Abstract: The invention discloses an electrochemical mechanical polishing/planarization equipment for processing a polishing surface of a conductive wafer substrate, which includes a power supply; a polishing table with conductivity; a polishing pad including an insulating active layer and having holes where a conductive chemical liquid is accommodated; a polishing head having conductivity and being attached to the back of the polishing surface. The power supply, the polishing table, the chemical liquid, the conductive wafer substrate, and the polishing head in sequence form a conductive loop, and an electrochemical reaction layer is formed on the polishing surface of the conductive wafer substrate. The polishing head drives the wafer substrate to move relative to the polishing pad, and to implement a mechanical polishing or a chemical mechanical polishing of the electrochemical reaction layer.

Abstract: The invention provides a double-power-supply switching control system for a welding machine and method. The welding machine double-power-supply switching control method comprises the steps of: continuously detecting and modifying an input voltage signal by a signal modification unit; under the control of a control unit, judging, by a judgment unit, whether to perform voltage doubling, controlling to execute voltage doubling switching action, and locking an actual input voltage mode of a welding machine by a locking unit; and finally outputting matched output current by a power supply output unit.

Abstract: The invention provides a double-power-supply switching control system for a welding machine and method. The welding machine double-power-supply switching control method comprises the steps of: continuously detecting and modifying an input voltage signal by a signal modification unit; under the control of a control unit, judging, by a judgment unit, whether to perform voltage doubling, controlling to execute voltage doubling switching action, and locking an actual input voltage mode of a welding machine by a locking unit; and finally outputting matched output current by a power supply output unit.