Patents by Inventor Yaoran HUANG

Yaoran HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP EMBEDDED COMPOSITE FOR ELECTRON BEAM LITHOGRAPHY, PREPARATION METHOD AND APPLICATION THEREOF
    Publication number: 20230343605
    Abstract: The present application relates to the technical filed of semiconductor chip nanofabrication, provides a method for preparing a chip embedded composite for electron beam lithography. The preparation method includes: providing a composite structure, the composite structure including a first substrate, a conductive layer disposed on a surface of the first substrate and a chip array disposed on a surface of the conductive layer away from the first substrate; arranging a protective layer on an outer surface of the chip array, where the protective layer covers the chip array; encapsulating and curing the composite structure and the protective layer by a polymer solution; removing the protective layer to obtain the chip embedded composite.
    Type: Application
    Filed: January 18, 2022
    Publication date: October 26, 2023
    Applicant: THE CHINESE UNIVERSITY OF HONGKONG, SHENZHEN
    Inventors: Zhaoyu ZHANG, Yaoran HUANG, Gexing LIU, Haochuan LI