Patents by Inventor Yaosheng Wen

Yaosheng Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080053108
    Abstract: The present invention relates to a thermoelectric refrigeration module, comprising a TEC refrigerating piece (8) having a top surface and a bottom surface, a radiator (16) closely contacted to the bottom surface of the TEC refrigerating piece (8), and a cold eliminator (18) including a brick body (4) having a bottom surface adhered to the top surface of the TEC refrigerating piece (8), characterized in that a thermal insulation frame structure (7) is disposed between the radiator (16) and the cold eliminator (18); the brick body of the cold eliminator and the TEC refrigerating piece are located within thermal insulation frame structure (7); the radiator and the cold eliminator are connected to the thermal insulation frame structure (7) via a connecting piece respectively; the cold eliminator has an end portion at which a plurality of cold aluminum fins are provided; a locating frame structure (1) having an inside frame, within which the end portion of the cold eliminator is located, is provided; the inside fr
    Type: Application
    Filed: December 20, 2004
    Publication date: March 6, 2008
    Inventor: Yaosheng Wen