Abstract: An LED module includes a base, a rear plate, an LED chip board and a glass window. The back surface of the base includes a channel for introducing cooling water. A sealing ring is compressed between the back surface of the base and the rear plate to seal the channel. A plurality of LED chips connected in series form the LED chip board which is mounted on the front surface of the base and is covered with the glass window.

Abstract: Disclosed is a high-power light-emitting diode (LED) light source module with optimized heat dissipation. The high-power LED light source module comprises a base, a rear plate, an LED chip board and a glass window. The base is a carrier of the whole light source module. A water channel for introducing cooling water is formed in the back surface of the base. The water channel and the rear plate are pressed and sealed through a sealing ring. A plurality of LED chips connected in series form the LED chip board to be installed on the front surface of the base. Finally, the front surface of the whole base is sealed with the glass window.