Abstract: The present invention discloses a method for packaging a chip-on-film (COF). The method includes: S1, forming a plurality of first pins on a circuit surface of a flexible circuit substrate, and forming a plurality of second pins on a chip to be packaged; S2, arranging to keep the circuit surface always facing downwards, arranging to keep a surface of the chip to be packaged, where the second pins matching the first pins are arranged, always facing upwards, and arranging the first pins and the second pins, to be opposite to each other; and S3, applying a top-down pressure to the flexible circuit substrate, and/or applying a bottom-up pressure to the chip to be packaged, and simultaneously heating at high temperature to solder the first pins and the second pins in a fused eutectic manner. The method of the present invention improves the product yield and stability.

Abstract: The present invention discloses a method for packaging a chip-on-film (COF). The method includes: S1, forming a plurality of first pins on a circuit surface of a flexible circuit substrate, and forming a plurality of second pins on a chip to be packaged; S2, arranging to keep the circuit surface always facing downwards, arranging to keep a surface of the chip to be packaged, where the second pins matching the first pins are arranged, always facing upwards, and arranging the first pins and the second pins, to be opposite to each other; and S3, applying a top-down pressure to the flexible circuit substrate, and/or applying a bottom-up pressure to the chip to be packaged, and simultaneously heating at high temperature to solder the first pins and the second pins in a fused eutectic manner. The method of the present invention improves the product yield and stability.