Abstract: A manufacturing method of an LED filament and a manufacturing method of a bulb are provided. The steps are as follows: step S1, preparing a support; step S2, fixing chips; step S3, performing a first baking and performing a lighting test after cooling; step S4, dispensing a glue in which a semi-finished product is covered with a covering glue, and a viscosity of the covering glue used is 5000 to 50000 mPa·S; and step S5, performing a second baking. According to the disclosure, the preparation of the LED filament is completed through support preparing, chip fixing, the first baking, dispensing and the second baking, and the covering glue selected during dispensing has good fluidity, and the fluorescent powders mixed in the covering glue can be uniformly dispersed, thus preventing precipitation or agglomeration and ensuring good light distribution.

Abstract: A filament and a bulb are provided. The support in the filament includes a plurality of board bodies, and two adjacent board bodies are connected by a conductive connecting pin and an outer end of each of the board bodies at both ends is connected with a conductive pin. The bulb includes a lamp cap, a shell, a stem sealed with the shell, a conductive support fixed to the stem and a plurality of the LED filaments, the filaments are electrically connected to the conductive support.

Abstract: Disclosed is a card type electrocardio measuring device, including: a circuit board (101), a main body bracket (102) and a back encapsulation; the circuit board (101) is arranged on the front of the main body bracket (102); the back encapsulation is arranged on the back of the main body bracket (102); the main body bracket (102) has a hollow shape, and electronic components on the circuit board (101) are respectively accommodated fitly between the back of the circuit board (101) and the back encapsulation, in a way of penetrating a hollow portion of the main body bracket (102).

Abstract: Disclosed is a card type electrocardio measuring device, including: a circuit board (101), a main body bracket (102) and a back encapsulation; the circuit board (101) is arranged on the front of the main body bracket (102); the back encapsulation is arranged on the back of the main body bracket (102); the main body bracket (102) has a hollow shape, and electronic components on the circuit board (101) are respectively accommodated fitly between the back of the circuit board (101) and the back encapsulation, in a way of penetrating a hollow portion of the main body bracket (102).