Abstract: A growth device and method for low-stress crystals are provided, which relate to the field of preparation of crystals, in particular to a device and method for preparing low-stress and low-defect crystals by using a pulling method. The growth device includes a furnace body; a crucible and a heating and insulation system which are arranged at a bottom of the furnace body; a crystal pulling mechanism, and a quartz observation window; the device further includes a liftable heating mantle mechanism including a heating mantle body, a heating mantle supporting component, a heating wire arranged around the heating mantle body, and a heating mantle lifting mechanism. The method includes: after crystals are pulled out of a melt, covering the crystals with a liftable heating mantle mechanism.

Abstract: The invention discloses a method for cutting a substrate wafer from an indium phosphide crystal, and belongs to the field of semiconductor substrate preparation, comprises the following steps of: 1) orientating, cutting the head and the tail of a crystal bar, adjusting the orientation and trying to cut the crystal bar until a wafer with a required crystal orientation cut, wherein the cutting end face is an orientation end face; 2) multi-wire cutting, on a multi-wire cutting apparatus, dividing a crystal bar parallel to an orientation end face into wafers; 3) cleaning, cleaning the wafer until no residue and no dirt existing on the surface; 4) circle cutting, performing circle cutting on the wafer to cut the desired crystal orientation area.

Abstract: A resin composition superior in stability and external appearance characteristics during/following melt molding; and an extrusion-molded article, an injection-molded article and a blow-molded article that are formed from the resin composition are provided. The resin composition contains an ethylene-vinyl alcohol copolymer as a principle component, and has a heterogeneous nucleation index (f) of less than 0.6 as determined by formula (1) based on a differential scanning calorimetry (DSC) curve obtained by DSC in which the resin composition is cooled at a rate of 150° C./sec from a molten state at 210° C. In the formula (1), Qtotal represents an area of a total region surrounded by the DSC curve and a base line, and Qhetero represents an area of a heterogeneous region that is a part of the total region, falling within a range from the temperature lower than the melting point by 38° C. to a temperature lower than the melting point by 75° C.

Abstract: A resin composition superior in stability and external appearance characteristics during/following melt molding; and an extrusion-molded article, an injection-molded article and a blow-molded article that are formed from the resin composition are provided. The resin composition contains an ethylene-vinyl alcohol copolymer as a principle component, and has a heterogeneous nucleation index (f) of less than 0.6 as determined by formula (1) based on a differential scanning calorimetry (DSC) curve obtained by DSC in which the resin composition is cooled at a rate of 150° C./sec from a molten state at 210° C. In the formula (1), Qtotal represents an area of a total region surrounded by the DSC curve and a base line, and Qhetero represents an area of a heterogeneous region that is a part of the total region, falling within a range from the temperature lower than the melting point by 38° C. to a temperature lower than the melting point by 75° C.

Abstract: Embodiments disclosed herein relate to reagent containers configured to allow for different liquid and solid reagents to be mixed in situ prior to the measurement.

Abstract: A therapeutic thermal pack with built-in seal and insulation functions for preserving the thermal condition of its thermal module. The thermal pack comprises a plurality of thermal module for thermal therapy, an insulation cover comprising a fastening means for attaching the thermal module to a body part, and a closing means for enclosing the thermal module inside the insulation cover for preserving the temperature of the thermal module. When it is configured for storage and carry, this thermal pack can maintain its therapeutic condition for an extended time period without using an additional insulation. It can thus be conveniently carried to the sports fields using any regular bag. When the pack is used for a treatment, the built-in insulation functions minimize the heat exchange between the thermal modules of the thermal pack and the surrounding environment and thus prolong the treatment time of the thermal pack.