Abstract: Some embodiments of the present application provide an optical module, including: a master control chip and a laser receiver; the laser receiver being connected to the master control chip; where the laser receiver includes: a PIN photodiode, a trans-impedance amplifier, a lens, and a shell; the PIN photodiode being electrically connected to the trans-impedance amplifier; and the lens being coated with an antireflection film; where the optical module further includes a bracket and a claw, where the laser receiver is fixed between a housing of the optical module and the bracket by the claw.

Abstract: Some embodiments of the present application provide an optical module, including: a master control chip and a laser receiver; the laser receiver being connected to the master control chip; where the laser receiver includes: a PIN photodiode, a trans-impedance amplifier, a lens, and a shell; the PIN photodiode being electrically connected to the trans-impedance amplifier; and the lens being coated with an antireflection film; where the optical module further includes a bracket and a claw, where the laser receiver is fixed between a housing of the optical module and the bracket by the claw.

Abstract: Some embodiments of the present application provide an optical module, including: a master control chip, a laser transmitter, and a laser receiver; the laser transmitter and the laser receiver being connected to the master control chip, respectively; where the laser receiver includes: a PIN photodiode, a trans-impedance amplifier with a transimpedance of no less than 43K ohms, a lens, and a shell; the PIN photodiode being electrically connected to the trans-impedance amplifier; the PIN photodiode, the trans-impedance amplifier and the lens being encapsulated within the shell in a manner of transistor out-line; and the lens being coated with an antireflection film.

Abstract: Some embodiments of the present application provide an optical module, including: a master control chip, a laser transmitter, and a laser receiver; the laser transmitter and the laser receiver being connected to the master control chip, respectively; where the laser receiver includes: a PIN photodiode, a trans-impedance amplifier with a transimpedance of no less than 43K ohms, a lens, and a shell; the PIN photodiode being electrically connected to the trans-impedance amplifier; the PIN photodiode, the trans-impedance amplifier and the lens being encapsulated within the shell in a manner of transistor out-line; and the lens being coated with an antireflection film.