Patents by Inventor Yaqiang Wang

Yaqiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200320274
    Abstract: An encoder includes a first processing circuit and a second processing circuit. The first processing circuit is configured to perform intraframe prediction on a sub-image-block according to reconstructed neighboring pixels of the sub-image-block to determine an optimal intraframe prediction direction of the sub-image-block. The second processing circuit is configured to generate quantized data of the sub-image-block according to the optimal intraframe prediction direction of the sub-image-block, and perform reconstruction on the sub-image-block according to the quantized data of the first sub-image-block. The sub-image-block is one of sub-image-blocks for processing obtained by dividing a to-be-encoded image block in a division mode.
    Type: Application
    Filed: June 24, 2020
    Publication date: October 8, 2020
    Inventors: Yaqiang WANG, Dong QIN
  • Patent number: 7861316
    Abstract: A microscope probe including a coaxial tip and a coplanar waveguide (CPW) formed on a silicon substrate is provided. The coaxial tip includes a tip shaft and a tip nib formed from the silicon substrate with the tip nib extending from the tip shaft opposite the silicon substrate. The tip shaft includes a first layer of a first conductive material formed over the silicon substrate, a second layer of an insulating material formed over the first layer, and a third layer of a second conductive material formed over the second layer. The tip nib includes the first layer of the first conductive material formed over the silicon substrate and exposed from the second layer and the third layer of the tip shaft. The CPW includes a center conductor formed from the first layer of the first conductive material and a first and a second outer conductor formed from the second layer of the second conductive material.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: December 28, 2010
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Daniel Warren van der Weide, Yaqiang Wang
  • Publication number: 20080135749
    Abstract: A microscope probe including a coaxial tip and a coplanar waveguide (CPW) formed on a silicon substrate is provided. The coaxial tip includes a tip shaft and a tip nib formed from the silicon substrate with the tip nib extending from the tip shaft opposite the silicon substrate. The tip shaft includes a first layer of a first conductive material formed over the silicon substrate, a second layer of an insulating material formed over the first layer, and a third layer of a second conductive material formed over the second layer. The tip nib includes the first layer of the first conductive material formed over the silicon substrate and exposed from the second layer and the third layer of the tip shaft. The CPW includes a center conductor formed from the first layer of the first conductive material and a first and a second outer conductor formed from the second layer of the second conductive material.
    Type: Application
    Filed: December 8, 2006
    Publication date: June 12, 2008
    Inventors: Daniel Warren van der Weide, Yaqiang Wang
  • Patent number: 7368305
    Abstract: A method of fabricating high aspect ratio micromechanical tips is provided. The method includes, but is not limited to, forming an etchant protective island on a surface of a silicon substrate with the silicon substrate exposed around the island; isotropically etching the silicon substrate by reactive ion etching around the protective island to partially undercut the silicon substrate beneath the protective island; anisotropically etching, by deep reactive ion etching, the silicon surrounding the island to a desired depth to define a tip shaft of the desired height supported at a base by the substrate; removing the protective island from the tip; and sharpening the top of the tip shaft to an apex. Using the method, micromechanical tips having heights greater than at least 30 ?m have been obtained while maintaining the vertical sidewall necessary for both AFM and scanning near-field microwave microscopy (SNMM) profiling applications.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: May 6, 2008
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Daniel W. van der Weide, Yaqiang Wang
  • Publication number: 20060278825
    Abstract: A method of fabricating high aspect ratio micromechanical tips is provided. The method includes, but is not limited to, forming an etchant protective island on a surface of a silicon substrate with the silicon substrate exposed around the island; isotropically etching the silicon substrate by reactive ion etching around the protective island to partially undercut the silicon substrate beneath the protective island; anisotropically etching, by deep reactive ion etching, the silicon surrounding the island to a desired depth to define a tip shaft of the desired height supported at a base by the substrate; removing the protective island from the tip; and sharpening the top of the tip shaft to an apex. Using the method, micromechanical tips having heights greater than at least 30 ?m have been obtained while maintaining the vertical sidewall necessary for both AFM and scanning near-field microwave microscopy (SNMM) profiling applications.
    Type: Application
    Filed: June 10, 2005
    Publication date: December 14, 2006
    Inventors: Daniel van der Weide, Yaqiang Wang