Patents by Inventor Yaqin Mao

Yaqin Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10312177
    Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: June 4, 2019
    Assignee: Honeywell International Inc.
    Inventors: Liqiang Zhang, Yaqin Mao, Huifeng Duan, Haigang Kang, Ya Qun Liu, Ling Shen, Kai Zhang
  • Publication number: 20180358283
    Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.
    Type: Application
    Filed: October 12, 2016
    Publication date: December 13, 2018
    Inventors: Liqiang Zhang, Yaqin Mao, Huifeng Duan, Haigang Kang, Ya Qun Liu, Ling Shen, Kai Zhang