Patents by Inventor Yaqiong Zhang

Yaqiong Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127623
    Abstract: The present application discloses a display panel and a display device. The display panel includes a fingerprint recognition area. The display panel includes a cover plate and an optically transparent layer. The optically transparent layer at least covers a portion of the cover plate located in the fingerprint recognition area. A refractive index of the optically transparent layer is greater than a refractive index of air and less than a refractive index of a finger. A thickness of the optically transparent layer is an even multiple of a half-wavelength of a fingerprint recognition light ray. Half-wave loss and interference of light are used to improve fingerprint recognition performance.
    Type: Application
    Filed: May 18, 2021
    Publication date: April 18, 2024
    Inventors: Chuan SHUAI, Guiyang ZHANG, Yaqiong LONG
  • Publication number: 20230203308
    Abstract: A preparation method of a branched polyamide copolymer with ultra-high toughness is disclosed. The preparation method includes: (1) dissolving a linear dibasic acid in a solvent A to obtain a linear dibasic acid solution, dissolving a diamine B in a solvent B to obtain a diamine solution B, and dissolving a diamine C in a solvent C to obtain a diamine solution C; (2) adding the diamine solution B to the linear dibasic acid solution to obtain an amide salt solution B; and adding the diamine solution C to the linear dibasic acid solution, and collecting a precipitate to obtain an amide salt C; and (3) mixing the amide salt solution B with the amide salt C, adding a catalyst, and conducting melt polycondensation. The prepared branched copolymer has excellent mechanical performance and is suitable for melt blending toughening, melt extrusion spinning, blow-extruded films, hot melt adhesives, and other fields.
    Type: Application
    Filed: March 3, 2023
    Publication date: June 29, 2023
    Applicant: ANHUI AGRICULTURAL UNIVERSITY
    Inventors: Zhongkai WANG, Wei LIU, Chuqing MA, Cheng LIU, Zhong WANG, Yaqiong ZHANG
  • Publication number: 20220347156
    Abstract: A method for preparing a water-soluble curcumin liquid includes the following steps: A) dissolving curcumin, vitamin C and ascorbyl palmitate in an ethanol aqueous solution, evaporating ethanol under reduced pressure, and vacuum drying to obtain a curcumin-vitamin C-ascorbyl palmitate co-crystal; and B) high-speed emulsifying the curcumin-vitamin C-ascorbyl palmitate co-crystal and a water-soluble colloidal solution that includes an emulsifying additive under vacuum, sequentially conducting a two-stage wet grinding, a homogenization and a potential adjustment to obtain the water-soluble curcumin liquid.
    Type: Application
    Filed: September 13, 2021
    Publication date: November 3, 2022
    Applicant: HENAN ZHONGDA HENGYUAN BIOTECHNOLOGY STOCK CO., LTD.
    Inventors: Honglong LI, Xiaosong XU, Ziheng JIN, Linzheng LI, Congying SHI, Yulian GUO, Chunfeng YU, Yaqiong ZHANG
  • Patent number: 8838175
    Abstract: A signal transmission channel using a SIW between a transmitter and distant receiver. The SIW may include a MSL/SIW interface, be flexible, may use plug connections and/or may operate in a MMW band.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: September 16, 2014
    Assignee: Sony Corporation
    Inventors: Yaqiong Zhang, Xiaobing Sun, Yugang Ma
  • Patent number: 8829659
    Abstract: An integrated circuit connection comprises a substrate, first and second transmission lines, a die, and a conductive ribbon. The first transmission line has a first end and is arranged on the substrate. The die is spaced from the first end. The die has a first surface, which is arranged on the substrate, and a second surface, which is opposite to the first surface and which has the second transmission line arranged thereon. The second transmission line has a second end. The conductive ribbon electrically couples the first and the second ends.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: September 9, 2014
    Assignee: Sony Corporation
    Inventors: Xiaobing Sun, Yaqiong Zhang, Yugang Ma
  • Publication number: 20130104387
    Abstract: A method which relates to fabricating a dielectric waveguide (WG) on a PCB for RF communication between ICs on the PCB. The WG can replace a baseband copper bus and resulting in the PCB being smaller and/or cheaper. The WG may be printed, stamped, cut or prefabricated onto the PCB.
    Type: Application
    Filed: August 17, 2012
    Publication date: May 2, 2013
    Applicant: Sony Corporation
    Inventors: Yu Gang MA, Ching Biing Yeo, Hisashi Masuda, Yaqiong Zhang
  • Publication number: 20130049883
    Abstract: Conventional technologies using copper tracks to couple integrated circuits (ICs) disposed on printed circuit boards (PCBs) face limitations in scaling beyond a certain transmission rate, restricting their future applications. Described herein is a waveguide network, in which the network comprises ICs on a PCB coupled via a dielectric waveguide, which advantageously overcomes these limitations. The dielectric waveguide is able to transmit radio frequency (RF) signals and has a bandwidth of at least 100 GHz, among other features. Further, the network can be arranged with different topologies such as ring, star or bus based, and is also couplable to other equivalent networks on the PCB using suitable waveguide-based networking devices.
    Type: Application
    Filed: August 17, 2012
    Publication date: February 28, 2013
    Applicant: Sony Corporation
    Inventors: Yu Gang MA, Ching Biing Yeo, Hisashi Masuda, Yaqiong Zhang
  • Publication number: 20120105304
    Abstract: An antenna including one or more IC bond bands configured to connect to a signal port on an IC, one or more substrate bond pads, a bond wire antenna (BWA) connected between the one or more IC bond bands and the substrate bond pads, and a resonant cavity adjacent the one or more substrate bond pads.
    Type: Application
    Filed: October 21, 2011
    Publication date: May 3, 2012
    Applicant: SONY CORPORATION
    Inventors: Yugang Ma, Xiaobing Sun, Yaqiong Zhang
  • Publication number: 20110181375
    Abstract: A waveguide comprising a SF_WG portion between a first transmission line and a second transmission line, wherein the SF_WG portion has a width greater than or equal to 75 um.
    Type: Application
    Filed: December 23, 2010
    Publication date: July 28, 2011
    Applicant: SONY CORPORATION
    Inventors: Yugang Ma, Yaqiong Zhang, Xiaobing Sun
  • Publication number: 20110117836
    Abstract: A signal transmission channel using a SIW between a transmitter and distant receiver. The SIW may include a MSL/SIW interface, be flexible, may use plug connections and/or may operate in a MMW band.
    Type: Application
    Filed: November 9, 2010
    Publication date: May 19, 2011
    Applicant: SONY CORPORATION
    Inventors: Yaqiong Zhang, Xiaobing Sun, Yugang Ma
  • Publication number: 20110037178
    Abstract: An integrated circuit connection is disclosed. The integrated circuit connection comprises a substrate 221, a first and a second transmission line 205, 203, a die 219, and a conductive ribbon 207. The first transmission line 205 has a first termination 215 and is arranged on the substrate 221. The die 219 is spaced from the first termination 215, and has a first surface which is arranged on the substrate 221 and a second opposed surface on which the second transmission line 203 is arranged. The second transmission line 203 has a second termination 211, and the conductive ribbon 207 electrically couples the first and the second termination 215, 211. A conductive ribbon 215 for use in an integrated circuit 201 is also disclosed.
    Type: Application
    Filed: August 4, 2010
    Publication date: February 17, 2011
    Applicant: SONY CORPORATION
    Inventors: Xiaobing Sun, Yaqiong Zhang, Yugang Ma