Patents by Inventor Yashaswini B. PATTAR

Yashaswini B. PATTAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Feedforward temperature control for plasma processing apparatus
    Patent number: 9338871
    Abstract: Methods and systems for controlling temperatures in plasma processing chamber with reduced controller response times and increased stability. Temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. A feedforward control signal compensating disturbances in the temperature attributable to the plasma power may be combined with a feedback control signal counteracting error between a measured and desired temperature.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: May 10, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chetan Mahadeswaraswamy, Walter R. Merry, Sergio Fukuda Shoji, Chunlei Zhang, Yashaswini B. Pattar, Duy D. Nguyen, Tina Tsong, Shane C. Nevil, Douglas A. Buchberger, Jr., Fernando M. Silveira, Brad L. Mays, Kartik Ramaswamy, Hamid Noorbakhsh
  • Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
    Patent number: 9214315
    Abstract: Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: December 15, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Fernando M. Silveira, Hamid Tavassoli, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Brad L. Mays, Tina Tsong, Chetan Mahadeswaraswamy, Yashaswini B. Pattar, Duy D. Nguyen, Walter R. Merry
  • TEMPERATURE CONTROL IN PLASMA PROCESSING APPARATUS USING PULSED HEAT TRANSFER FLUID FLOW
    Publication number: 20150316941
    Abstract: Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.
    Type: Application
    Filed: December 22, 2014
    Publication date: November 5, 2015
    Inventors: Fernando M. SILVEIRA, Hamid Tavassoli, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Brad L. Mays, Tina Tsong, Chetan Mahadeswaraswamy, Yashaswini B. Pattar, Duy D. Nguyen, Walter R. Merry
  • Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
    Patent number: 8916793
    Abstract: Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: December 23, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Fernando M. Silveira, Hamid Tavassoli, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Brad L. Mays, Tina Tsong, Chetan Mahadeswaraswamy, Yashaswini B. Pattar, Duy D. Nguyen, Walter R. Merry
  • TEMPERATURE CONTROL IN PLASMA PROCESSING APPARATUS USING PULSED HEAT TRANSFER FLUID FLOW
    Publication number: 20120132397
    Abstract: Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.
    Type: Application
    Filed: May 19, 2011
    Publication date: May 31, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Fernando M. Silveira, Hamid Tavassoli, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Brad L. Mays, Tina Tsong, Chetan Mahadeswaraswamy, Yashaswini B. Pattar, Duy D. Nguyen, Walter R. Merry
  • FEEDFORWARD TEMPERATURE CONTROL FOR PLASMA PROCESSING APPARATUS
    Publication number: 20110186545
    Abstract: Methods and systems for controlling temperatures in plasma processing chamber with reduced controller response times and increased stability. Temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. A feedforward control signal compensating disturbances in the temperature attributable to the plasma power may be combined with a feedback control signal counteracting error between a measured and desired temperature.
    Type: Application
    Filed: October 15, 2010
    Publication date: August 4, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Chetan MAHADESWARASWAMY, Walter R. MERRY, Sergio Fukuda SHOJI, Chunlei ZHANG, Yashaswini B. PATTAR, Duy D. NGUYEN, Tina TSONG, Shane C. NEVIL, Douglas A. BUCHBERGER, JR., Fernando M. SILVEIRA, Brad L. MAYS, Kartik RAMASWAMY, Hamid NOORBAKHSH