Abstract: A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head.