Patents by Inventor Yashuhiro Murasawa

Yashuhiro Murasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 4994896
    Abstract: Two types of semiconductor packages (6a, 6b), being different in direction of bending of external lead terminals (3) from each other, are prepared to be mounted on a single surface or both surfaces of a package substrate. In case of single-surface mounting, the external lead terminals (3) of the same pin numbers can be electrically connected with each other by drawing around wires (9). In case of double-surface mounting, the external lead terminals (3) of the same pin numbers can be electrically connected with each other by through holes.
    Type: Grant
    Filed: May 17, 1988
    Date of Patent: February 19, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shunichi Uemura, Yashuhiro Murasawa