Abstract: A method for forming a foreign oxide or foreign nitride layer (6) on a substrate (1) of a semiconductor comprises providing a semiconductor substrate (1) having an oxidized or nitridized surface layer (3), supplying a foreign element (5) on the oxidized or nitridized surface layer; and keeping the oxidized or nitridized surface layer (3) at an elevated temperature so as to oxidize or nitridize at least partially the foreign element by the oxygen or nitrogen, respectively, initially present in the oxidized or nitridized surface layer (3).

Abstract: A method for forming a foreign oxide or foreign nitride layer (6) on a substrate (1) of a semiconductor comprises providing a semiconductor substrate (1) having an oxidized or nitridized surface layer (3), supplying a foreign element (5) on the oxidized or nitridized surface layer; and keeping the oxidized or nitridized surface layer (3) at an elevated temperature so as to oxidize or nitridize at least partially the foreign element by the oxygen or nitrogen, respectively, initially present in the oxidized or nitridized surface layer (3).

Abstract: A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.

Abstract: A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.

Abstract: A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.

Abstract: A method for forming a foreign oxide or foreign nitride layer (6) on a substrate (1) of a semiconductor comprises providing a semiconductor substrate (1) having an oxidized or nitridized surface layer (3), supplying a foreign element (5) on the oxidized or nitridized surface layer; and keeping the oxidized or nitridized surface layer (3) at an elevated temperature so as to oxidize or nitridize at least partially the foreign element by the oxygen or nitrogen, respectively, initially present in the oxidized or nitridized surface layer (3).

Abstract: A method for forming a foreign oxide or foreign nitride layer (6) on a substrate (1) of a semiconductor comprises providing a semiconductor substrate (1) having an oxidized or nitridized surface layer (3), supplying a foreign element (5) on the oxidized or nitridized surface layer; and keeping the oxidized or nitridized surface layer (3) at an elevated temperature so as to oxidize or nitridize at least partially the foreign element by the oxygen or nitrogen, respectively, initially present in the oxidized or nitridized surface layer (3).

Abstract: A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.

Abstract: A method for enabling indoor positioning of a mobile receiver, including: detecting an orientation of the mobile receiver; measuring light intensities using at least three effective visible light receiving areas positioned on the mobile receiver, wherein the at least three effective visible light receiving areas are orientated such that a measurement of light intensity of a light from the same light source by each of the at least three effective visible light receiving areas is different from the others; and producing an output which enables a 3-dimensional indoor positioning of the mobile receiver relative to a second coordinate system.