Patent number: 9366964
Abstract: A composition comprising: A) polymer that comprises: L is CX—CYZ, where X, Y, and Z are independently hydrogen, an alkyl, or a substituted alkyl; and, M is an alkylene, an arylene, a substituted alkylene, a substituted arylene, or C(O)O—W—, where W is an alkylene or a substituted alkylene; and R?, R?, and R?? are independently selected from an aromatic hydrocarbon, an aliphatic hydrocarbon, or a substituted hydrocarbon that comprises one or more of O, N, S, or Si atoms, provided that at least one of R?, R?, and R?? is selected from alkoxyl, aryloxyl, hydroxyl, halide, carboxyl, or carbonate; and, p is from 1 to 10,000; and the polymer does not comprise a polyhedral oligomeric silsesquioxane structure; and B) a polymer formed from a composition comprising at least one Si-containing compound as described herein. Compositions are suitable for microelectronic applications, and have improved adhesion to photoresists polymers.
Type:
Grant
Filed:
August 28, 2012
Date of Patent:
June 14, 2016
Assignees:
Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
Inventors:
Yuanqiao Rao, Robert L. Auger, Cecilia W. Kiarie, Yasmin N. Srivastava, Christopher P. Sullivan