Abstract: A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.

Abstract: A fixture assembly for use with fine wire laser soldering. The fixture includes a holding and support fixture and a wire securing and tensioning fixture. The holding and support fixture has a wire holding member and a retention member. The wire holding member and the retention member cooperate with wires prior to the wires being soldered. The wire securing fixture has wire tensioning projections and wire retention members. The wire tensioning projections and wire retention members cooperate with the wires to provide tension to the wire prior to the wires being soldered.

Abstract: Wire-alignment processes and devices are disclosed. A wire-alignment process includes manual loading of a wire-alignment device by positioning and temporary-securing of loading regions of a plurality of wires within an arrangement of grooves of the wire-alignment device. The manual loading of the loading regions produces diverging regions of the plurality of the wires leading to the loading regions and soldering regions oppositely extending from the loading regions. An alignment device includes an arrangement of grooves configured for manual loading of loading regions of wires to produce diverging regions of the wires leading to the loading regions and soldering regions oppositely extending from the loading regions.

Abstract: Laser soldering processes are disclosed. The laser soldering process includes beaming a lower-intensity laser beam from a laser soldering system at a first position, analyzing infrared feedback of the lower-intensity laser beam at the first position, and beaming a higher-intensity laser beam at a second position, the second position corresponding with the infrared feedback of the lower-intensity laser beam. The lower-intensity laser beam generates a lower temperature below a soldering temperature of a solder material and the higher-intensity laser beam generates a higher temperature above the soldering temperature.

Abstract: A fixture assembly for use with fine wire laser soldering. The fixture includes a holding and support fixture and a wire securing and tensioning fixture. The holding and support fixture has a wire holding member and a retention member. The wire holding member and the retention member cooperate with wires prior to the wires being soldered. The wire securing fixture has wire tensioning projections and wire retention members. The wire tensioning projections and wire retention members cooperate with the wires to provide tension to the wire prior to the wires being soldered.

Abstract: A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.

Abstract: A three-dimensional printing apparatus and method for inspecting an article during fabrication of the article. The material depositing device deposits layers of material to form a three-dimensional article. The build device receives the material deposited by the material depositing device. The inspection device is positioned proximate the build device and captures images of each respective layer of the article as the article is formed. The controller compares the images of each respective layer to a digital template to determine if the article is properly constructed. The article is inspected during the manufacture of the article with no need for destructive inspection.

Abstract: A three-dimensional printing apparatus includes a material receiving area for receiving material, a plasticizer, a discharge pump and an auger. The material receiving area receives material to be used to be used in the three-dimensional printing process. The plasticizer includes a heating zone which places the material in shear. The discharge pump controls the flow of the material. The auger extends from the material receiving area through the plasticizer and terminates proximate the discharge pump. The material is maintained under pressure in the discharge pump until the material exits a nozzle provided at the end of the discharge pump for depositing on a build plate.