Patents by Inventor Yasuaki AMANO

Yasuaki AMANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner
    Patent number: 10937681
    Abstract: A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a support surface for supporting the wafer, and the bottom plate has a maximum diameter being larger than the maximum diameter of the top plate so that the bottom plate forms a repository for the dicing frame. The dicing frame has a plate-like shape defining a center hole, wherein the minimum diameter of the center hole is larger than the maximum diameter of the top plate so that the dicing frame sinks below the upper surface of the wafer and/or the support surface. Further, a wafer support device, a wafer support system and a mask aligner are provided.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: March 2, 2021
    Inventors: Yasuaki Amano, Sven Hansen, Lennert Schwart
  • WAFER SUPPORT SYSTEM, WAFER SUPPORT DEVICE, SYSTEM COMPRISING A WAFER AND A WAFER SUPPORT DEVICE AS WELL AS MASK ALIGNER
    Publication number: 20190096733
    Abstract: A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a support surface for supporting the wafer, and the bottom plate has a maximum diameter being larger than the maximum diameter of the top plate so that the bottom plate forms a repository for the dicing frame. The dicing frame has a plate-like shape defining a center hole, wherein the minimum diameter of the center hole is larger than the maximum diameter of the top plate so that the dicing frame sinks below the upper surface of the wafer and/or the support surface. Further, a wafer support device, a wafer support system and a mask aligner are provided.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 28, 2019
    Inventors: Yasuaki AMANO, Sven HANSEN, Lennert SCHWART