Abstract: A high-frequency terminator includes a dielectric substrate, a metal layer provided on a back surface of the dielectric substrate, a transmission line provided on a front surface of the dielectric substrate, a resistor provided on the front surface of the dielectric substrate and connected to the transmission line, and a conductor electrically connecting the resistor and the metal layer. The dielectric substrate includes a first substrate part having a first thickness in a direction from the back surface toward the front surface, and a second substrate part having a second thickness in the direction that is less than the first thickness. The transmission line extends from the first substrate part to the second substrate part and is connected to the resistor on the second substrate part. The conductor electrically connects the metal layer and the resistor at the second substrate part.

Abstract: A plane filter includes a dielectric substrate, a filter part provided on the dielectric substrate, and an input/output line connected to the filter part on the dielectric substrate. The filter part and the input/output line are provided on a front surface of the dielectric substrate. The dielectric substrate includes first and second regions. The filter part is provided in the first region, and the input/output line is provided in the second region. The first region having a first thickness in a first direction toward the front surface from a back surface at a side opposite to the front surface. The second region having a second thickness in the first direction, the second thickness being less than the first thickness. The back surface includes a step corresponding to a difference between the first thickness and the second thickness.

Abstract: A coaxial microstrip line conversion circuit includes a housing part including a protrusion protruding into the interior, a microstrip line substrate, a coaxial line including central and ground conductor parts, and a solder layer. The microstrip line substrate includes a microstrip line, a dielectric body having a recess cut into a lower surface, and a ground conductive part bent along the cut surface. The microstrip line substrate is mounted to a bottom surface of the housing part so that the recess and the protrusion fit together. A vertical distance between a lowest position of the ground conductor part facing the central conductor part and a ground surface of the ground conductive part adjacent to the cut surface is less than a vertical distance between the lowest position and a ground surface of the ground conductive part adjacent to a region of the dielectric body where the recess is not provided.

Abstract: A grounding structure of the high-frequency circuit board includes a dielectric substrate, a back surface ground electrode, an upper ground electrode, and a microstripline upper electrode. The dielectric substrate has a first surface and a second surface, and is provided with a first through-hole. A first opening of the first through-hole at the first surface is smaller than a second opening of the first through-hole at the second surface. A first grounding conductor layer is provided in the first through-hole. The back surface ground electrode is provided at the second surface and is connected with the first grounding conductor layer. The upper ground electrode is provided at the first surface and is connected with the first ground conductor layer. The microstripline upper electrode is provided at the first surface.

Abstract: A grounding structure of the high-frequency circuit board includes a dielectric substrate, a back surface ground electrode, an upper ground electrode, and a microstripline upper electrode. The dielectric substrate has a first surface and a second surface, and is provided with a first through-hole. A first opening of the first through-hole at the first surface is smaller than a second opening of the first through-hole at the second surface. A first grounding conductor layer is provided in the first through-hole. The back surface ground electrode is provided at the second surface and is connected with the first grounding conductor layer. The upper ground electrode is provided at the first surface and is connected with the first ground conductor layer. The microstripline upper electrode is provided at the first surface.

Abstract: A variable frequency resonator includes a series resonance circuit and a parallel resonance circuit. The series resonance circuit includes a first inductor, a first capacitor and a variable capacitance diode which are connected together in series. A reverse bias voltage is applied to the variable capacitance diode. A signal source is connected to the series resonance circuit. The parallel resonance circuit includes a second inductor and a second capacitor which are connected together in parallel. One terminal of the parallel resonance circuit is connected to a connection point between the first inductor and the first capacitor, and the other terminal of the parallel resonance circuit is connected to a connection point between the variable capacitor and the one terminal of the signal source.

Abstract: Certain embodiments provide a high-frequency package comprising: a conductive member to have a cut portion; a package to have a high-frequency device; a signal lead drawn from the package and is connected with the high-frequency device; a substrate to have a microstrip line comprising a microstrip line pattern in contact with the signal lead, a dielectric and an earth conductor; and a ground lead provided in the cut portion and directly below the signal lead, to contact the earth conductor and hold the substrate in cooperation with the signal lead.

Abstract: A variable frequency resonator includes a series resonance circuit and a parallel resonance circuit. The series resonance circuit includes a first inductor, a first capacitor and a variable capacitance diode which are connected together in series. A reverse bias voltage is applied to the variable capacitance diode. A signal source is connected to the series resonance circuit. The parallel resonance circuit includes a second inductor and a second capacitor which are connected together in parallel. One terminal of the parallel resonance circuit is connected to a connection point between the first inductor and the first capacitor, and the other terminal of the parallel resonance circuit is connected to a connection point between the variable capacitor and the one terminal of the signal source.