Patents by Inventor Yasuaki Hirokawa

Yasuaki Hirokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150276257
    Abstract: A filter for an electric dust collector includes: a conductive filter frame for surrounding a passage of airflow along a transverse plane that traverses the passage by being supported by a casing of the electric duct collector; and a mesh sheet arranged along the transverse plane, coupled to the filter frame, and having a conductive material at least partially on a surface of the mesh sheet, the conductive material being connected to the filter frame.
    Type: Application
    Filed: March 27, 2015
    Publication date: October 1, 2015
    Inventors: Syun IWANO, Hiroki OKUNO, Yusuke HAYASHI, Yasuaki HIROKAWA, Hironori AOKI
  • Patent number: 8872427
    Abstract: A plasma generating apparatus includes: a power supply one of whose electrodes is connected to vacuum chamber walls of N vacuum chambers; an oscillator which outputs a pulse signal at every predetermined period; N pulse amplifying circuits which are connected in parallel to the oscillator as well as to the other electrode of the power supply, and each of which amplifies the pulse signal and supplies the amplified pulse signal to a corresponding one of N electrodes disposed in the N vacuum chambers; and at least (N-1) timing generating circuits which are connected between the oscillator and at least (N-1) pulse amplifying circuits, and which delay the pulse signal by respectively different delay times so that at any specific time, the pulse signal is supplied to only one of the pulse amplifying circuits.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: October 28, 2014
    Assignee: Denso Corporation
    Inventors: Daisuke Itomura, Ryonosuke Tera, Yasuaki Hirokawa, Hayato Nagaya
  • Publication number: 20120119649
    Abstract: A plasma generating apparatus includes: a power supply one of whose electrodes is connected to vacuum chamber walls of N vacuum chambers; an oscillator which outputs a pulse signal at every predetermined period; N pulse amplifying circuits which are connected in parallel to the oscillator as well as to the other electrode of the power supply, and each of which amplifies the pulse signal and supplies the amplified pulse signal to a corresponding one of N electrodes disposed in the N vacuum chambers; and at least (N?1) timing generating circuits which are connected between the oscillator and at least (N?1) pulse amplifying circuits, and which delay the pulse signal by respectively different delay times so that at any specific time, the pulse signal is supplied to only one of the pulse amplifying circuits.
    Type: Application
    Filed: October 27, 2011
    Publication date: May 17, 2012
    Applicant: DENSO CORPORATION
    Inventors: Daisuke ITOMURA, Ryonosuke TERA, Yasuaki HIROKAWA, Hayato NAGAYA
  • Patent number: 6761843
    Abstract: According to this invention, thermal expansion microcapsules can be substantially evenly mixed with a base resin and an expected expansion coefficient for the thermal expansion microcapsules can be obtained during resin molding in a mold. Specifically, this invention provides a method for manufacturing a synthetic resin molding using thermal expansion microcapsules in which the thermal expansion microcapsules are mixed with a base resin and the mixture undergoes resin molding in a mold, wherein the thermal expansion microcapsules are granulated with a given binder resin under a temperature condition in which the thermal expansion microcapsules are not thermally expanded; then the mixture is mixed with the base resin; and the mixture undergoes resin molding.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: July 13, 2004
    Assignee: Fujitsu General Limited
    Inventors: Yoshiyasu Horiuchi, Yasuaki Hirokawa
  • Publication number: 20020125599
    Abstract: According to this invention, thermal expansion microcapsules can be substantially evenly mixed with a base resin and an expected expansion coefficient for the thermal expansion microcapsules can be obtained during resin molding in a mold. Specifically, this invention provides a method for manufacturing a synthetic resin molding using thermal expansion microcapsules in which the thermal expansion microcapsules are mixed with a base resin and the mixture undergoes resin molding in a mold, wherein the thermal expansion microcapsules are granulated with a given binder resin under a temperature condition in which the thermal expansion microcapsules are not thermally expanded; then the mixture is mixed with the base resin; and the mixture undergoes resin molding.
    Type: Application
    Filed: March 5, 2002
    Publication date: September 12, 2002
    Applicant: FUJITSU GENERAL LIMITED
    Inventors: Yoshiyasu Horiuchi, Yasuaki Hirokawa
  • Patent number: 6120159
    Abstract: A transparent display panel such as an electroluminescent panel is overlapped on a part of a conventional instrument panel for use in an automobile. The overlapped display panel displays additional information such as navigation maps when required and is turned off under a normal driving condition. When the overlapped transparent display panel is turned off, the conventional instrument panel displays information such as a vehicle speed, an engine speed so and so forth. In this situation, overall luminance on the combined display panel is made uniform throughout a whole surface including the area where the transparent display panel is overlapped. To realize the uniformity of luminance, brightness of back lamps for illuminating the instrument panel is adjusted or a filter having an adequate transparency is used. The combined display panel may be also made by combining a non-transparent display panel with a conventional instrument panel.
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: September 19, 2000
    Assignee: Denso Corporation
    Inventors: Kazuhiro Inoguchi, Yasuaki Hirokawa, Takashi Hagiwara, Nobuei Ito, Tadashi Hattori