Patents by Inventor Yasuaki Iwata

Yasuaki Iwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9786804
    Abstract: A thin-film solar cell comprising a substrate, a first electrode layer arranged upon the substrate, a p-type light absorption layer formed by a group I-III-IV2 compound arranged upon the first electrode layer, and an n-type second electrode layer arranged upon the p-type light absorption layer. The p-type light absorption layer includes Cu as a group 1 element and includes Ga and In as group III elements. The ratio of the atomic number between Cu and the group III elements in the entire p-type light absorption layer is lower than 1.0; the ratio of the atomic number between Ga and the group III elements in the surface on the second electrode layer side is no more than 0.13; and the ratio of the atomic number between Cu and the group III elements in the surface on the second electrode layer side is at least 1.0.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: October 10, 2017
    Assignee: Solar Frontier K.K.
    Inventors: Yasuaki Iwata, Hiroki Sugimoto, Hideki Hakuma
  • Publication number: 20160155878
    Abstract: A thin-film solar cell comprising a substrate, a first electrode layer arranged upon the substrate, a p-type light absorption layer formed by a group I-III-IV2 compound arranged upon the first electrode layer, and an n-type second electrode layer arranged upon the p-type light absorption layer. The p-type light absorption layer includes Cu as a group 1 element and includes Ga and In as group III elements. The ratio of the atomic number between Cu and the group III elements in the entire p-type light absorption layer is lower than 1.0; the ratio of the atomic number between Ga and the group III elements in the surface on the second electrode layer side is no more than 0.13; and the ratio of the atomic number between Cu and the group III elements in the surface on the second electrode layer side is at least 1.0.
    Type: Application
    Filed: June 19, 2014
    Publication date: June 2, 2016
    Applicant: Solar Frontier K.K.
    Inventors: Yasuaki IWATA, Hiroki SUGIMOTO, Hideki HAKUMA
  • Publication number: 20120215889
    Abstract: Disclosed is a communication terminal device whereby a user's perception of a wait time can be lessened while missing data portions are downloaded, and whereby the user becomes irritated less. In this device, a broadcast wave receiver (102) receives content data via a broadcast network and an antenna (101). An analysis unit (103) detects the missing portions of the content data and calculates the volume of the missing data portions. On basis of the calculated data volume, a communication unit (108) downloads the missing data portions via an antenna (107) and a communication network other than the broadcast network.
    Type: Application
    Filed: October 29, 2010
    Publication date: August 23, 2012
    Applicant: Panasonic Corporation
    Inventor: Yasuaki Iwata
  • Patent number: 8102046
    Abstract: Through heat discharge only by wiring connected to a conventional semiconductor chip, sufficient heat discharge performance may not be achieved in a recent semiconductor device. A semiconductor device according to an aspect of the present invention includes: a flexible substrate including a first main surface and a second main surface; a semiconductor chip; a first heat conductive layer formed on the first main surface of the flexible substrate and electrically connected to the semiconductor chip; and a second heat conductive layer formed on the second main surface of the flexible substrate and electrically insulated from the semiconductor chip.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: January 24, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Yasuaki Iwata, Chihiro Sasaki
  • Publication number: 20110233794
    Abstract: A method of manufacturing a semiconductor device at a good manufacturing efficiency and at a low cost while suppressing the occurrence of voids in the sealing region, the method including the steps of (A) bonding external connection terminals of a semiconductor chip to wirings of a film substrate by hot press bonding, and (B) resin sealing the periphery of the bonded portion of the semiconductor chip and the film substrate, in which the bonding step (A) is performed in a state of adsorbing a portion of the film substrate facing the semiconductor chip from the side opposite the bonding side of the semiconductor chip, and the resin sealing step (B) is performed in a state where the temperature of the semiconductor chip and the film substrate is lowered press is no thermal expansion of the film substrate.
    Type: Application
    Filed: March 24, 2011
    Publication date: September 29, 2011
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventor: YASUAKI IWATA
  • Patent number: 7821115
    Abstract: A semiconductor device on a tape carrier package with improved heat dissipation, as provided. The number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration, and narrower pitches are employed. Included are a tape carrier 20 having lead patterns 21 to 24 formed on a tape base 28 thereof, and a semiconductor device 10 mounted on the tape carrier 20 and having electrode patterns 11 to 14 disposed thereon. The semiconductor device 10 includes heat dissipating electrode patterns 15 to 17 at positions where the heat dissipating electrode patterns 15 to 17 do not interfere with the electrode patterns 11 to 14. The lead patterns 21 to 24 are electrically connected to the corresponding electrode patterns 11 to 14, respectively. On the tape carrier 20, heat dissipation patterns 25 to 27 are formed. The heat dissipation patterns have a surface area broader than that of the lead patterns and have the heat dissipating electrode patterns disposed thereon.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: October 26, 2010
    Assignee: NEC Electronics Corporation
    Inventors: Chihiro Sasaki, Yasuaki Iwata
  • Patent number: 7802282
    Abstract: A content detecting device for a digital broadcast signal receiver or a recording apparatus that records the digital broadcast signal. When information in program specific information and information in an electronic program guide information in the memory contradict each other concerning presence or absence of one of a closed captioning broadcast and a data broadcast, a detecting unit causes the memory to store information indicating the detection of the commercial.
    Type: Grant
    Filed: January 11, 2006
    Date of Patent: September 21, 2010
    Assignee: Panasonic Corporation
    Inventors: Yasuaki Iwata, Sadatoshi Chozui
  • Publication number: 20100031291
    Abstract: A content detecting device for a digital broadcast signal receiver or a recording apparatus that records the digital broadcast signal. When information in program specific information and information in an electronic program guide information in the memory contradict each other concerning presence or absence of one of a closed captioning broadcast and a data broadcast, a detecting unit causes the memory to store information indicating the detection of the commercial.
    Type: Application
    Filed: January 11, 2006
    Publication date: February 4, 2010
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Yasuaki Iwata, Sadatoshi Chozui
  • Publication number: 20090108438
    Abstract: Through heat discharge only by wiring connected to a conventional semiconductor chip, sufficient heat discharge performance may not be achieved in a recent semiconductor device. A semiconductor device according to an aspect of the present invention includes: a flexible substrate including a first main surface and a second main surface; a semiconductor chip; a first heat conductive layer formed on the first main surface of the flexible substrate and electrically connected to the semiconductor chip; and a second heat conductive layer formed on the second main surface of the flexible substrate and electrically insulated from the semiconductor chip.
    Type: Application
    Filed: October 14, 2008
    Publication date: April 30, 2009
    Applicant: NEC Electronics Corporation
    Inventors: Yasuaki Iwata, Chihiro Sasaki
  • Publication number: 20070126090
    Abstract: Heat dissipation, is improved, of a semiconductor device on a tape carrier package, in which the number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration and narrower pitches are employed. There are included a tape carrier 20 having lead patterns 21 to 24 formed on a tape base 28 thereof, and a semiconductor device 10 mounted on the tape carrier 20 and having electrode patterns 11 to 14 disposed thereon. The semiconductor device 10 includes heat dissipating electrode patterns 15 to 17 at positions where the heat dissipating electrode patterns 15 to 17 do not interfere with the electrode patterns 11 to 14. The lead patterns 21 to 24 are electrically connected to the corresponding electrode patterns 11 to 14, respectively. On the tape carrier 20, heat dissipation patterns are formed.
    Type: Application
    Filed: December 5, 2006
    Publication date: June 7, 2007
    Applicant: NEC Electronics Corporation
    Inventors: Chihiro Sasaki, Yasuaki Iwata
  • Patent number: 7140460
    Abstract: A driving force control apparatus is provided for a vehicle capable of preventing a shock from being generated by disengaging a clutch disposed between a subordinate drive source and subordinate drive wheels during vehicle travel. When a transition determination is made in which the clutch will be released, e.g., from a four-wheel drive state to a two-wheel drive state, a clutch release section disengage the clutch, upon the drive torque of the drive source substantially reaching a target drive torque in which a difference between an output torque of the clutch and an input torque of the clutch is smaller than a prescribed value in response to the transition determination.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: November 28, 2006
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Kouichi Shimizu, Keiji Kadota, Ping Chen, Tatsuya Kamata, Hiroyuki Ohya, Yasuaki Iwata
  • Patent number: 6969337
    Abstract: A vehicle driving force control apparatus is provided for a vehicle having an electric motor transmitting a drive torque to a first wheel, and a clutch installed between the electric motor and the first wheel. The vehicle driving force control apparatus basically comprises a clutch control section and a motor control section. The clutch control section is configured to control engagement and release of the clutch. The motor control section is configured to control a motor response characteristic by increasing the motor response characteristic of the motor from a first response characteristic to a second response characteristic when the clutch control section releases the clutch. Preferably, the vehicle driving force control apparatus is configured to cancel insufficient torque generation due to undershoot armature current when controlling armature current of an electric motor and transmitting torque to subordinate drive wheels.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: November 29, 2005
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Keiji Kadota, Tatsuya Kamata, Yasuaki Iwata, Kimitaka Nakamura
  • Publication number: 20040043862
    Abstract: A vehicle driving force control apparatus is provided for a vehicle having an electric motor transmitting a drive torque to a first wheel, and a clutch installed between the electric motor and the first wheel. The vehicle driving force control apparatus basically comprises a clutch control section and a motor control section. The clutch control section is configured to control engagement and release of the clutch. The motor control section is configured to control a motor response characteristic by increasing the motor response characteristic of the motor from a first response characteristic to a second response characteristic when the clutch control section releases the clutch. Preferably, the vehicle driving force control apparatus is configured to cancel insufficient torque generation due to undershoot armature current when controlling armature current of an electric motor and transmitting torque to subordinate drive wheels.
    Type: Application
    Filed: August 15, 2003
    Publication date: March 4, 2004
    Applicant: Nissan Motor Co., Ltd.
    Inventors: Keiji Kadota, Tatsuya Kamata, Yasuaki Iwata, Kimitaka Nakamura
  • Publication number: 20040038775
    Abstract: A driving force control apparatus is provided for a vehicle capable of preventing a shock from being generated by disengaging a clutch disposed between a subordinate drive source and subordinate drive wheels during vehicle travel. When a transition determination is made in which the clutch will be released, e.g., from a four-wheel drive state to a two-wheel drive state, a clutch release section disengage the clutch, upon the drive torque of the drive source substantially reaching a target drive torque in which a difference between an output torque of the clutch and an input torque of the clutch is smaller than a prescribed value in response to the transition determination.
    Type: Application
    Filed: August 7, 2003
    Publication date: February 26, 2004
    Applicant: Nissan Motor Co., Ltd.
    Inventors: Kouichi Shimizu, Keiji Kadota, Ping Chen, Tatsuya Kamata, Hiroyuki Ohya, Yasuaki Iwata
  • Patent number: 6628682
    Abstract: Of spontaneous emission beams emitted from a laser medium but not line-narrowed, a spontaneous emission beam whose wavelength approximates a narrowed emission beam and whose light intensity is equal to or higher than a certain level is used as a reference light.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: September 30, 2003
    Assignee: Komatsu Ltd.
    Inventors: Kiwamu Takehisa, Kouji Shio, Shinji Nagai, Yasuaki Iwata, Osamu Wakabayashi