Abstract: To provide a device structure that is capable of preventing oxygen, water, and the like from entering the device, and a method of producing the same. A device structure 10 according to an embodiment of the present invention includes a substrate (base) 2, a device layer 3, a first inorganic material layer (convex portion) 41, and a first resin material 51. The substrate 2 has a first surface 2a and a second surface 2c opposite to the first surface 2a. The device layer 3 is arranged on at least the first surface 2a out of the first and second surfaces 2a and 2c. The first inorganic material layer 41 is formed on the first surface 2a. The first resin material 51 is unevenly arranged around the first inorganic material layer 41.

Abstract: To provide a device structure that is capable of preventing oxygen, water, and the like from entering the device, and a method of producing the same. A device structure 10 according to an embodiment of the present invention includes a substrate (base) 2, a device layer 3, a first inorganic material layer (convex portion) 41, and a first resin material 51. The substrate 2 has a first surface 2a and a second surface 2c opposite to the first surface 2a. The device layer 3 is arranged on at least the first surface 2a out of the first and second surfaces 2a and 2c. The first inorganic material layer 41 is formed on the first surface 2a. The first resin material 51 is unevenly arranged around the first inorganic material layer 41.

Abstract: A semiconductor device includes: a substrate; a line formed on the substrate; and a crystalline semiconductor film containing silicon connected to the line. The crystalline semiconductor film is crystallized by annealing where a constituting material of the line functions as a catalyst.

Abstract: A semiconductor device includes: a substrate; a line formed on the substrate; and a crystalline semiconductor film containing silicon connected to the line. The crystalline semiconductor film is crystallized by annealing where a constituting material of the line functions as a catalyst.

Abstract: A method of fabricating a thin-film transistor, includes the step of forming a source region and a drain region in a semiconductor thin film having a capping film thereon, by accelerating a plasma source including hydrogen ions and one of Group III ions and Group V ions of the Periodic table, and simultaneously implanting the hydrogen ions and one of the Group III ions and the Group V ions into the semiconductor thin film, wherein there exist a plurality of peaks in a depth profile of a concentration of the hydrogen ions implanted into the semiconductor thin film having the capping film thereon and a second peak from a surface of the capping film among the plurality of the peaks is made to exist in the semiconductor thin film.

Abstract: A method for producing a polycrystalline semiconductor film is disclosed. The method includes the steps of: forming a semiconductor film on a substrate; forming a passivation film on the semiconductor film; exciting a mixed gas including hydrogen and at least one element selected from the group consisting of the III, IV, and V groups of the periodic table to generate hydrogen ions and ions of the at least one element; and implanting the hydrogen ions into the semiconductor film through the passivation film and simultaneously implanting the ions of the at least one element into the semiconductor film through the passivation film, thereby changing the semiconductor film into a polycrystalline semiconductor film having the at least one element.