Patents by Inventor Yasuaki Oonishi

Yasuaki Oonishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5771630
    Abstract: The present invention provides an agricultural covering material comprising a fluororesin film which intercepts the transmission of the ultraviolet rays having a wavelength range of at least 300-330 nm, by at least 40% and which transmits at least 70% of the visible rays having a wavelength range of 400-800 nm.The covering material can be used outdoors in a spread state over a long period of time and is useful as a covering material for greenhouse to replace glass, for cultivation of various useful crops.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: June 30, 1998
    Assignee: Nippon Carbide Kogyo Kabushiki Kaisha
    Inventors: Isamu Harasawa, Yoshiaki Ishisaki, Yasuaki Oonishi
  • Patent number: 5225267
    Abstract: A laminated resin film having a metallic appearance comprises:(a) a polyvinyl chloride type resin film having a total light transmission of at least 30% and a tensile strength at 5% elongation of not higher than 2 kg/cm;(b) a thin polyurethane type resin layer laminated on one surface of the resin film and having a total light transmission of at least 30% and a tensile strength at 100% elongation within the range of 50 to 550 kg/cm; and(c) a metal layer having a thickness of 50 to 2,000 .ANG. formed and adhering onto the polyurethane type resin layer. The film is useful particularly as a marking film.
    Type: Grant
    Filed: September 5, 1991
    Date of Patent: July 6, 1993
    Assignee: Nippon Carbide Kogyo Kabushiki Kaisha
    Inventors: Katsura Ochi, Yasuaki Oonishi, Kazuhisa Kinsen
  • Patent number: 5008139
    Abstract: A pressure-sensitive adhesive layer having, on at least one surface thereof, a layer of evenly dispersed non-adhesive solid particles having an average particle diameter of 10 to 60 microns, wherein at least about half of the solid particles project from the surface of the adhesive layer to a height corresponding to at least about one-fourth of the average particle diameter of the solid particles and if the solid particles are hollow particles, the walls of the hollow particles are not rupturable by the pressure of bonding. The pressure-sensitive adhesive layer has a very low initial adhesion strength (adhesion strength before press-bonding). After press-bonding, it rapidly develops adhesion strength, and attains a very high final adhesion strength.
    Type: Grant
    Filed: October 31, 1988
    Date of Patent: April 16, 1991
    Assignee: Nippon Carbide Kogyo Kabushiki Kaisha
    Inventors: Katsura Ochi, Yasuaki Oonishi, Kazuhisa Kinsen