Patents by Inventor Yasuaki Otani

Yasuaki Otani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240115959
    Abstract: Provided are a program, an information processing device, a method, and a system that allow properties of an organized party to be easily grasped. An information processing device 10 is an information processing device for executing a game and includes: a setting unit 231 for setting two or more game media on a deck with which indicator information is associated; an indicator-information-point calculation unit 232 for determining points for each item of the indicator information on the basis of predetermined data associated with the game media; and an indicator-information determination unit 233 for determining the indicator information to be displayed on a game screen on the basis of the points for each item of the indicator information obtained by the indicator-information-point calculation unit 232 and associating the determined indicator information with the deck.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: CYGAMES, INC.
    Inventors: Shohei Sawa, Masayoshi Sato, Koji Otani, Yasuaki Hayashizaki, Ryota Yagi, Junpei Yamaguchi, Takafumi Oka
  • Patent number: 5277787
    Abstract: A method of manufacturing printed wiring board is disclosed. The method comprising steps of providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.
    Type: Grant
    Filed: October 28, 1992
    Date of Patent: January 11, 1994
    Assignee: Nippon CMK Corp.
    Inventors: Yasuaki Otani, Fusao Birukawa, Tatero Takai
  • Patent number: 5277929
    Abstract: A method for masking through-holes during the manufacture of a printed circuit board comprises providing a substrate having a plurality of through-holes. A removable masking seal comprised of a soluble material, a light-setting material or a thermo-setting material is formed on the surface of the substrate to cover at least one of the through-holes. At least one of the through-holes that is not covered with the masking seal is filled with a filler material by a conventional silk screen process. The masking seal is then removed, either by dissolving the masking seal in the case of the soluble material, or in the case of the light-setting or thermo-setting material, the masking seal is set by applying light or heat to reduce adhesion between the masking seal and the substrate, and then the set masking seal is peeled off to expose the through-hole.
    Type: Grant
    Filed: October 11, 1991
    Date of Patent: January 11, 1994
    Assignee: Nippon CMK Corp.
    Inventors: Kameharu Seki, Yasuaki Otani, Isamu Kubo
  • Patent number: 5238524
    Abstract: A hole masking apparatus for use in the manufacture of a printed wiring board is disclosed. The apparatus comprises first and second positioning sections provided on a conveying path of a base material at a distance apart for stopping the positioning of the base material having a plurality of through holes at respective given position; a masking device provided to respective positioning sections and having a head to paste a seal while supplying and for pasting the seal on through holes by moving the head in such a manner that the head is positioned on through holes which do not require a plugging up thereof; and a reversing section arranged between the first and the second positioning sections and for reversing face and back of the base material on the conveying path thereof.
    Type: Grant
    Filed: November 19, 1991
    Date of Patent: August 24, 1993
    Assignee: Nippon CMK Corp.
    Inventors: Kameharu Seki, Yasuaki Otani, Isamu Kubo
  • Patent number: 5186811
    Abstract: The present invention aims to stabilize the plating film and to even the thickness thereof in the case where through holes of printed wiring boards are subjected to copper plating.Copper recovered from the etching waste liquor produced in the general manufacture of the printed wiring boards is supplied from a powder feeder 21 into a dissolution tank 23 to obtain a copper ion solution. For the copper plating, a substrate 1 acting as a cathod is arranged facing anodes 28 within a plating tank 26. The dissolution tank 23 supplies the copper ion solution into a plating tank 26 to maintain at a predetermined value the concentration of copper ions of a plating solution 27. This allows the insoluble polar plate to be used as the anodes 28, which leads to a stable current density.
    Type: Grant
    Filed: April 15, 1992
    Date of Patent: February 16, 1993
    Assignee: Nippon CMK Corp.
    Inventors: Yasuaki Otani, Toichi Takishima, Yasuhiko Sakata