Abstract: An electronic component includes a package substrate extending in a longitudinal direction, and chip components disposed along the longitudinal direction of the package substrate and each connected to the package substrate by a bump. A height of a bump connecting at least one chip component disposed at an end portion in the longitudinal direction among the chip components and the package substrate is greater than a height of a bump connecting at least one chip component disposed inward relative to the end portion in the longitudinal direction among the chip components and the package substrate.

Abstract: An acoustic wave device includes first to third acoustic wave resonators connected in series, and the first acoustic wave resonator and the third acoustic wave resonator are respectively disposed on one side and another side of the second acoustic wave resonator. In the first to third acoustic wave resonators, a first common busbar is connected to one of reflectors of the first and second acoustic wave resonators, and a second common busbar is connected to one of reflectors of the second and third acoustic wave resonators.

Abstract: An electronic component includes a package substrate extending in a longitudinal direction, and chip components disposed along the longitudinal direction of the package substrate and each connected to the package substrate by a bump. A height of a bump connecting at least one chip component disposed at an end portion in the longitudinal direction among the chip components and the package substrate is greater than a height of a bump connecting at least one chip component disposed inward relative to the end portion in the longitudinal direction among the chip components and the package substrate.

Abstract: An acoustic wave device includes first to third acoustic wave resonators connected in series, and the first acoustic wave resonator and the third acoustic wave resonator are respectively disposed on one side and another side of the second acoustic wave resonator. In the first to third acoustic wave resonators, a first common busbar is connected to one of reflectors of the first and second acoustic wave resonators, and a second common busbar is connected to one of reflectors of the second and third acoustic wave resonators.

Abstract: An elastic wave device is configured such that a first surface acoustic wave chip including a piezoelectric substrate is mounted on a package board, a center of the first surface acoustic wave chip is shifted from a center of the package board when viewed from above, and a crystal Z-axis orientation of the piezoelectric substrate of the first surface acoustic wave chip is slanted to extend toward an outer side portion from a central portion of the package board as it progresses toward an upper surface from a lower surface of the piezoelectric substrate.

Abstract: An elastic wave device is configured such that a first surface acoustic wave chip including a piezoelectric substrate is mounted on a package board, a center of the first surface acoustic wave chip is shifted from a center of the package board when viewed from above, and a crystal Z-axis orientation of the piezoelectric substrate of the first surface acoustic wave chip is slanted to extend toward an outer side portion from a central portion of the package board as it progresses toward an upper surface from a lower surface of the piezoelectric substrate.

Abstract: The present invention provides a plate brick having a low amount of generation of smoke and a gas with a pungent odor during use, and exhibiting high durability. A plate brick of the present invention is obtained by: adding an organic binder to a refractory raw material mixture containing 0.5 to 20 mass % of aluminum and/or aluminum alloy; kneading the mixture with the organic binder; forming the kneaded mixture into a shaped body; and subjecting the shaped body to a heat treatment at a temperature of 400 to 1000° C., wherein the plate brick is obtained without being impregnated with a carbon-containing liquid material comprising tar or pitch, after the heat treatment. The plate brick has a compressive strength of 180 MPa or more, and a weight-increasing rate of 1% or less as measured in a hydration test using an autoclave.

Abstract: An acoustic wave filter device includes a plurality of acoustic wave filters disposed on the same piezoelectric substrate, and achieves enlargement of out-of-passband attenuation without a large increase in its size. For at least the first acoustic wave filter, ends of second IDTs and of third IDTs connected to first and second balanced terminals, the ends being connected to a ground potential, are connected to a common connection line, the common connection line is connected to a ground terminal by a ground line, and a distance between a connection point, at which the ground line is connected to the common connection line, and the first balanced terminal, and a distance between the connection point and the second balanced terminal, is the same or substantially the same.

Abstract: The present invention provides a plate brick having a low amount of generation of smoke and a gas with a pungent odor during use, and exhibiting high durability. A plate brick of the present invention is obtained by: adding an organic binder to a refractory raw material mixture containing 0.5 to 20 mass % of aluminum and/or aluminum alloy; kneading the mixture with the organic binder; forming the kneaded mixture into a shaped body; and subjecting the shaped body to a heat treatment at a temperature of 400 to 1000° C., wherein the plate brick is obtained without being impregnated with a carbon-containing liquid material comprising tar or pitch, after the heat treatment. The plate brick has a compressive strength of 180 MPa or more, and a weight-increasing rate of 1% or less as measured in a hydration test using an autoclave.

Abstract: An elastic wave filter includes two longitudinally coupled resonator type elastic wave filter elements that are cascade connected with each other, each longitudinally coupled resonator type elastic wave filter element including three IDTs (interdigital transducers) arranged on a piezoelectric substrate in a transmitting direction of an elastic wave. In at least one of the longitudinally coupled resonator type elastic wave filter elements, electrode fingers of the IDTs that are cascade connected are arranged at a pitch that is smaller than a pitch of electrode fingers of the remaining IDT. The adverse effect of a parasitic capacitance in cascade connected wires disposed between the longitudinally coupled resonator type elastic wave filter elements is reduced so as to improve impedance matching of a cascade connected portion and to improve the VSWR characteristics of input-output terminals of the elastic wave filter.

Abstract: An acoustic wave filter device includes a plurality of acoustic wave filters disposed on the same piezoelectric substrate, and achieves enlargement of out-of-passband attenuation without a large increase in its size. For at least the first acoustic wave filter, ends of second IDTs and of third IDTs connected to first and second balanced terminals, the ends being connected to a ground potential, are connected to a common connection line, the common connection line is connected to a ground terminal by a ground line, and a distance between a connection point, at which the ground line is connected to the common connection line, and the first balanced terminal, and a distance between the connection point and the second balanced terminal, is the same or substantially the same.

Abstract: An elastic wave filter includes two longitudinally coupled resonator type elastic wave filter elements that are cascade connected with each other, each longitudinally coupled resonator type elastic wave filter element including three IDTs (interdigital transducers) arranged on a piezoelectric substrate in a transmitting direction of an elastic wave. In at least one of the longitudinally coupled resonator type elastic wave filter elements, electrode fingers of the IDTs that are cascade connected are arranged at a pitch that is smaller than a pitch of electrode fingers of the remaining IDT. The adverse effect of a parasitic capacitance in cascade connected wires disposed between the longitudinally coupled resonator type elastic wave filter elements is reduced so as to improve impedance matching of a cascade connected portion and to improve the VSWR characteristics of input-output terminals of the elastic wave filter.