Patents by Inventor Yasuaki Sugano

Yasuaki Sugano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Positive type photosensitive epoxy resin composition and printed circuit board using the same
    Patent number: 7378228
    Abstract: A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: May 27, 2008
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventors: Yasuaki Sugano, Yasuharu Nojima
  • Positive type photosensitive epoxy resin composition and printed circuit board using the same
    Publication number: 20060240356
    Abstract: A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.
    Type: Application
    Filed: June 21, 2006
    Publication date: October 26, 2006
    Applicant: Huntsman Advanced Materials Americas Inc.
    Inventors: Yasuaki Sugano, Yasuharu Nojima
  • Positive type photosensitive epoxy resin composition and printed circuit board using the same
    Patent number: 7097958
    Abstract: A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: August 29, 2006
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventors: Yasuaki Sugano, Yasuharu Nojima
  • Positive type photosensitive epoxy resin composition and printed circuit board using the same
    Publication number: 20040043327
    Abstract: A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.
    Type: Application
    Filed: May 15, 2003
    Publication date: March 4, 2004
    Inventors: Yasuaki Sugano, Yasuharu Nojima
  • Composition comprising an epoxy resin, a phenol and an advancement catalyst
    Patent number: 4880892
    Abstract: Advancement catalysts which are a combination of a phosphonium halide or an alkylene phosphorane and a nitrogen heterocycle selected from the group consisting of substituted or unsubstituted imidazoles, benzimidazoles, imidazolines, dihydropyrimidines, tetrahydropyrimidines, dihydroquinazolines, their salts and mixtures thereof, confer high reactivity and selectivity on epoxy resin advancement reactions. The advanced epoxy resins are useful in the preparation of coatings of high quality.
    Type: Grant
    Filed: August 22, 1988
    Date of Patent: November 14, 1989
    Assignee: Ciba-Geigy Corporation
    Inventors: Wataru Urano, Yasuaki Sugano