Abstract: To form an electrostatic chuck, a bonding sheet is applied onto the upper surface of a cooling plate and then the cooling plate is placed in a vacuum dryer at a pressure of 2,000 Pa or less for a pre-bake treatment at 120° C. to 130° C. for 15 to 40 hours, followed by natural cooling. A plate is then stacked on the bonding sheet so that the lower surface of the plate is aligned with the upper surface of the bonding sheet, which is applied onto the cooling plate. The resulting stacked body is placed in a heat-resistant resin bag, and is then placed in an autoclave and treated together for several hours under pressure and heat.

Abstract: A substrate supporting member includes: a plate-shaped ceramic body having a surface serving as a substrate supporting surface; a plate-shaped composite material body which is joined to a surface of the ceramic body opposite to the substrate supporting surface with a joint material interposed therebetween and the plate-shaped composite material body made of porous ceramic with pores filled with metal, the composite material body having a porosity of more than 0% and not more than 5%; and a metallic plate which is joined to a surface of the composite material body opposite to the surface joined to the ceramic body with a joint material interposed therebetween.

Abstract: To form an electrostatic chuck, a bonding sheet is applied onto the upper surface of a cooling plate and then the cooling plate is placed in a vacuum dryer at a pressure of 2,000 Pa or less for a pre-bake treatment at 120° C. to 130° C. for 15 to 40 hours, followed by natural cooling. A plate is then stacked on the bonding sheet so that the lower surface of the plate is aligned with the upper surface of the bonding sheet, which is applied onto the cooling plate. The resulting stacked body is placed in a heat-resistant resin bag, and is then placed in an autoclave and treated together for several hours under pressure and heat.

Abstract: A heating device has a ceramic base with a heating surface, and a heating body embedded in the ceramic base. The heating device includes a thermal conductive member positioned between the heating surface and the heating body in the ceramic base. The thermal conductive member has a thermal conductivity that is higher than the ceramic base and as such, the heating device achieves superior temperature uniformity of a heated object particularly in a semiconductor device manufacturing process.

Abstract: A ceramic member is provided including a base including an alumina sintered body, an yttria sintered body formed on the alumina sintered body, an intermediate layer including yttrium and aluminum formed between the alumina sintered body and the yttria sintered body, and a metallic member buried in the intermediate layer of the base. A difference between the thermal expansion coefficient of the alumina sintered body and that of the yttria sintered body is equal to or less than about 0.50×10?6/K, and the thermal expansion coefficient of the alumina sintered body is greater than the thermal expansion coefficient of the yttria sintered body. The alumina sintered body, the intermediate layer, the yttria sintered body, and the metallic member are formed into an integrated sintered body, and the content of yttria in the yttria sintered body is 99 wt % or more.

Abstract: An electrostatic chuck includes a ceramic base having an electrode embedded in vicinity to a holding face for holding a substrate. On a back side of this ceramic base, provided are a terminal connected to the electrode, a wafer temperature control member, and an insulating member for insulating the temperature control member from the terminal. This insulating member has a flange portion on its end portion in contact with the ceramic base, and is made of highly thermal conductive ceramics.

Abstract: A heating apparatus 10 includes a ceramic base 11 having a heating surface 11a and provided with a resistance heating body 12 embedded therein, and a temperature adjusting member 21 fixedly fastened proximal to a back surface of the ceramic base 11. A heat conductive member 14 having a thermal conductivity higher than the ceramic base 11 is provided between the heating surface of the ceramic base 11 and the resistance heating body 12. A gas is introduced to an air gap 31 between the ceramic base 11 and the temperature adjusting member 21 while controlling the gas pressure.

Abstract: A yttria sintered body contains an amount of silicon carbide within a range of 5 to 40% by volume, has a volume resistivity at room temperature within a range of 1×101 to 1×1017 ?·cm, and is adapted for application to an electrostatic chuck.

Abstract: An electrostatic chuck includes; a base made of ceramics, in which an electrode generating electrostatic attractive force is embedded; a cooling member which contains metal; a bonding material which bonds the base and the cooling member to each other; a gas providing passage which penetrates the base, the bonding material, and the cooling member; and an engagement member and a bolt member, which are fixing members mechanically fixing the base and the cooling member to each other.

Abstract: A heating device has a ceramic base with a heating surface, and a heating body embedded in the ceramic base. The heating device includes a thermal conductive member between the heating surface and the heating body in the ceramic base. The thermal conductive member has thermal conductivity higher than the ceramic base. The present, heating device achieves superior temperature uniformity of a heated object, particularly in the semiconductor device manufacturing process.

Abstract: A substrate supporting member includes: a plate-shaped ceramic body having a surface serving as a substrate supporting surface; a plate-shaped composite material body which is joined to a surface of the ceramic body opposite to the substrate supporting surface with a joint material interposed therebetween and made of porous ceramic with pores filled with metal, the composite material body having a porosity of more than 0% and not more than 5%; and a metallic plate which is joined to a surface of the composite material body opposite to the surface joined to the ceramic body with a joint material interposed therebetween.

Abstract: A yttria sintered body is provided which includes yttria as a principal ingredient and 5 to 40 vol. % silicon nitride, and which exhibits enhanced corrosion resistance and mechanical strength.

Abstract: An electrostatic chuck including lower and upper regions of a ceramic base, an embedded electrode and a resin film formed on the surface of the base. Volume resistivity of the upper region is 1×109 ?·cm to 1×1012 ?·cm, surface roughness of the surface of the upper region is 0.4 ?m or less in centerline average roughness Ra, and the resin film is made of denatured fluorine resin. A thickness of the resin film is 1 ?m or more, variations of the thickness of the resin film are ±30% or less, static friction and dynamic friction coefficients of a surface of the resin film is 0.2 or less, hardness of the resin film is 3H to F in a pencil method, and a contact angle of the resin film with water is 85° or more.

Abstract: An electrostatic chuck includes a ceramic base having an electrode embedded in vicinity to a holding face for holding a substrate. On a back side of this ceramic base, provided are a terminal connected to the electrode, a wafer temperature control member, and an insulating member for insulating the temperature control member from the terminal. This insulating member has a flange portion on its end portion in contact with the ceramic base, and is made of highly thermal conductive ceramics.

Abstract: A yttria sintered body contains an amount of silicon carbide within a range of 5 to 40% by volume, has a volume resistivity at room temperature within a range of 1×101 to 1×1017?·cm, and is adapted for application to an electrostatic chuck.

Abstract: An electrostatic chuck includes; a base made of ceramics, in which an electrode generating electrostatic attractive force is embedded; a cooling member which contains metal; a bonding material which bonds the base and the cooling member to each other; a gas providing passage which penetrates the base, the bonding material, and the cooling member; and an engagement member and a bolt member, which are fixing members mechanically fixing the base and the cooling member to each other.

Abstract: A yttria sintered body includes yttria as a principal ingredient, and 5 to 40% by volume of silicone nitride, allowing for an enhanced corrosion resistance and mechanical strength.

Abstract: A ceramic member comprises a base including an alumina sintered body, and an yttria sintered body formed on the alumina sintered body and exposed to a corrosive gas; and a metallic member buried in the base.

Abstract: A base member made of a metal in which aluminum is included, ceramics in which an aluminum element is included, or a composition member constructed by a metal in which aluminum and ceramics are included, is provided in a container in which a solid fluorine compound such as NaHF2 is filled. Then, the container is heated at a temperature higher than a decomposing temperature of the solid fluorine compound. After that, the base member is subjected to a heat treatment with the decomposed gas of the solid fluorine compound to form a fluoride layer on a surface of the base member. In this manner, it is possible to obtain an anti-corrosion member which shows a high corrosion property with respect to the corrosion gas of halogen series and its plasma, particularly with respect to chlorine gas and its plasma.

Abstract: A highly resistive recrystallized silicon carbide having open pores, wherein layered carbons on the inner wall surfaces of said open pores are removed and a resistivity at room temperature of said recrystallized silicon carbide is not less than 10000 &OHgr;·cm.