Abstract: In a pressure sensor including a pressure detecting element in an intermediate portion or at a deep side of a through hole formed in a protrusion, a body portion (a base portion and the protrusion) is made of ceramic or an insulative resin material and molded into a predetermined shape, and the pressure sensor is constituted as a molded interconnect device in which a conductive pattern is formed on a surface thereof. Accordingly, a smaller pressure sensor can be obtained.

Abstract: In a pressure sensor including a pressure detecting element in an intermediate portion or at a deep side of a through hole formed in a protrusion, a body portion (a base portion and the protrusion) is made of ceramic or an insulative resin material and molded into a predetermined shape, and the pressure sensor is constituted as a molded interconnect device in which a conductive pattern is formed on a surface thereof. Accordingly, a smaller pressure sensor can be obtained.

Abstract: In order to obtain a 3D circuit board manufacturing method capable of improving productivity and accuracy of circuit formation, the metal hoop material 1 provided with the positioning pilot holes 2 is employed. Since the 3D structures 3 are formed on the hoop material 1 with a preset interval maintained therebetween in a lengthwise direction of the hoop material 1, the series of processes can be conducted on a roll 1A (winding of the hoop material 1) basis, which results that handling between the individual processes can be done more easily while increase of troubles and manufacturing costs can be prevented. Further, since the positioning pilot holes 2 serve to facilitate accurate positioning, plating and/or laser processing can be conducted continuously with high precision while a tact time for the positioning work can be reduced.

Abstract: A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board. The multilayer circuit board comprises a substrate having a first surface and a second surface extending from an end of the first surface at a required angle relative to the first surface, and the multilayer circuit formed on the first surface and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer having a required circuit pattern and an insulation layer formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer formed on the second surface of the substrate.

Abstract: A compact light-beam deflecting device with a photonic crystal is provided, which has the capability of deflecting a light beam incident on the photonic crystal by a controlled angle to output a transmitted light beam having a desired direction from the photonic crystal. This light-beam deflecting device comprises the photonic crystal designed to have a photonic band gap wavelength that is different from a wavelength of a light beam to be incident on the photonic crystal, and a deflection controller for applying an amount of energy to the photonic crystal to deflect the light beam incident on a side of the photonic crystal, and to provide a transmitted light beam, which forms the desired angle with respect to the light beam, from the other side of the photonic crystal.

Abstract: A compact light-beam deflecting device with a photonic crystal is provided, which has the capability of deflecting a light beam incident on the photonic crystal by a controlled angle to output a transmitted light beam having a desired direction from the photonic crystal. This light-beam deflecting device comprises the photonic crystal designed to have a photonic band gap wavelength that is different from a wavelength of a light beam to be incident on the photonic crystal, and a deflection controller for applying an amount of energy to the photonic crystal to deflect the light beam incident on a side of the photonic crystal, and to provide a transmitted light beam, which forms the desired angle with respect to the light beam, from the other side of the photonic crystal.

Abstract: A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board. The multilayer circuit board comprises a substrate having a first surface and a second surface extending from an end of the first surface at a required angle relative to the first surface, and the multilayer circuit formed on the first surface and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer having a required circuit pattern and an insulation layer formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer formed on the second surface of the substrate.

Abstract: A method and system for determination of a pressure of the pressurized fluid with the use of a diaphragm pump responsible for accumulating the pressurized fluid in the vessel. The pump has a pump cavity and a diaphragm with a piezoelectric element which is actuated by an application of a voltage to displace the diaphragm for pumping a fluid into the vessel. The method comprises the steps of:(a) deactivating the diaphragm by removal of the voltage to the piezoelectric element so as to stop pumping the fluid and accumulating the pressurized fluid into the vessel;(b) introducing the pressurized fluid only from the vessel back into the pump cavity so as to cause a displacement of the diaphragm by the pressurized fluid;(c) deriving an electrical signal indicative of the displacement of the diaphragm; and(d) translating the electrical signal into a corresponding pressure value indicative of the pressure of the pressurized fluid in the vessel.