Abstract: A resin-metal composite to be used as a marker in an immunoassay, said resin-metal composite comprising a resin particle and metal particles and having the following constitution (A) or constitution (B): (A) the average particle size of the resin-metal composite exceeding 300 nm; or (B) the average particle size of the metal particles being in the range of more than 20 nm and less than 70 nm. It is preferred that a part of the metal particles are two- or three-dimensionally distributed in the surface layer part of the resin particle, a part of the three-dimensionally distributed metal particles are partly exposed to the outside of the resin particle, and a part of the remainder particles are enclosed in the resin particle.

Abstract: A resin-metal composite 100 includes resin particles 10 and metal particles 20. The metal particles 20 are dispersed or immobilized on the resin particles 10, and portions of the metal particles 20 are three-dimensionally distributed in a surface section 60 of the resin particles 10. The metal particles 20 include encased metal particles 30 completely encased in the resin particles 10, partially exposed metal particles 40 having a portion embedded in a resin particle 10 and a portion exposed from the resin particle 10, and surface-adsorbed metal particles 50 absorbed on the surface of a resin particle 10.

Abstract: This resin-platinum composite 100 is provided with resin particles 10 and platinum particles 20, and the platinum particles 20 are immobilized on the resin particles 10. In the resin-platinum composite 100, one portion of the platinum particles 20 may be distributed three-dimensionally on surface layer sections 60 of the resin particles 10. In this case, the one portion of the three-dimensionally distributed platinum particles 20 may be partially exposed outside the resin particles 10, and the remaining portion may be enclosed in the resin particles 10. In the platinum particles 20, enclosed particles 30 that are fully enclosed in the resin particles 10, partially exposed particles 40 each having a segment embedded inside the resin particles 10 and a segment exposed outside the resin particles 10, and surface attached particles 50 attached to the surfaces of the resin particles 10 preferably exist.

Abstract: A resin-metal composite to be used as a marker in an immunoassay, said resin-metal composite comprising a resin particle and metal particles and having the following constitution (A) or constitution (B): (A) the average particle size of the resin-metal composite exceeding 300 nm; or (B) the average particle size of the metal particles being in the range of more than 20 nm and less than 70 nm. It is preferred that a part of the metal particles are two- or three-dimensionally distributed in the surface layer part of the resin particle, a part of the three-dimensionally distributed metal particles are partly exposed to the outside of the resin particle, and a part of the remainder particles are enclosed in the resin particle.

Abstract: A resin-metal composite 100 to be used as a marker in an immunoassay, said resin-metal composite 100 comprising a resin particle 10 and metal particles 20 and having the following constitution (A) or constitution (B): (A) the average particle size of the resin-metal composite exceeding 300 nm; or (B) the average particle size of the metal particles being in the range of more than 20 nm and less than 70 nm. It is preferred that a part of the metal particles 20 are two- or three-dimensionally distributed in the surface layer part 60 of the resin particle 10, a part of the three-dimensionally distributed metal particles 20 are partly exposed to the outside of the resin particle 10, and a part of the remainder particles are enclosed in the resin particle 10.

Abstract: A metal-resin composite that has a structure in which a plurality of metal particles are fixed to resin particles and, in the range of pH 3 to pH 10, the maximum value of the zeta potential is at least 5 mV and the minimum value is ?5 mV or less. In this metal-resin composite, it is preferable that, in the range of pH 3 to pH 10, the difference between the maximum value and the minimum value of the zeta potential is at least 20 mV; and it is further preferable that the point of zero charge of the zeta potential is in the range of pH 3.5 to pH 9.0. This metal-resin composite can be used in immunoassays and in immunoassay reagents as a labeled substance by making antigens or antibodies adhere to the surface of the metal-resin composite.

Abstract: This resin-platinum composite 100 is provided with resin particles 10 and platinum particles 20, and the platinum particles 20 are immobilized on the resin particles 10. In the resin-platinum composite 100, one portion of the platinum particles 20 may be distributed three-dimensionally on surface layer sections 60 of the resin particles 10. In this case, the one portion of the three-dimensionally distributed platinum particles 20 may be partially exposed outside the resin particles 10, and the remaining portion may be enclosed in the resin particles 10. In the platinum particles 20, enclosed particles 30 that are fully enclosed in the resin particles 10, partially exposed particles 40 each having a segment embedded inside the resin particles 10 and a segment exposed outside the resin particles 10, and surface attached particles 50 attached to the surfaces of the resin particles 10 preferably exist.

Abstract: A resin-metal composite 100 includes resin particles 10 and metal particles 20. The metal particles 20 are dispersed or immobilized on the resin particles 10, and portions of the metal particles 20 are three-dimensionally distributed in a surface section 60 of the resin particles 10. The metal particles 20 include encased metal particles 30 completely encased in the resin particles 10, partially exposed metal particles 40 having a portion embedded in a resin particle 10 and a portion exposed from the resin particle 10, and surface-adsorbed metal particles 50 absorbed on the surface of a resin particle 10.

Abstract: A resin-metal composite 100 to be used as a marker in an immunoassay, said resin-metal composite 100 comprising a resin particle 10 and metal particles 20 and having the following constitution (A) or constitution (B): (A) the average particle size of the resin-metal composite exceeding 300 nm; or (B) the average particle size of the metal particles being in the range of more than 20 nm and less than 70 nm. It is preferred that a part of the metal particles 20 are two- or three-dimensionally distributed in the surface layer part 60 of the resin particle 10, a part of the three-dimensionally distributed metal particles 20 are partly exposed to the outside of the resin particle 10, and a part of the remainder particles are enclosed in the resin particle 10.

Abstract: A nano-composite 10 is described, including a matrix resin 1, metal fine-particles 3 immobilized in the matrix resin 1, a binding species 7 immobilized on a part or all of the metal fine-particles 3, and metal fine-particles 9 indirectly immobilized on the metal fine-particles 3 via the binding species 7. Each of at least a part of the metal fine-particles 3 has a portion embedded in the matrix resin 1, and a portion (exposed portion 3a) exposed outside of the matrix resin 1, while the binding species 7 is immobilized on the exposed portions.

Abstract: A dew condensation sensor is described, including a nano-composite for generating local surface plasmon resonance, a light reflecting member disposed on one side of the nano-composite, a protection layer laminated on the light reflecting member, a light source/light receiver disposed facing the nano-composite, a spectroscope (or photo-detector) for detecting the light reflected by the light source/light receiver, a controller connected to the light source/light receiver and the spectroscope (or photo-detector) and used for overall control thereof, and a display unit connected to the controller. The dew condensation sensor detects occurrence of dew condensation based on the variation in the absorption spectrum, the absorption intensity or the reflected-light intensity of the local surface plasmon resonance of the nano-composite.

Abstract: A metal nanoparticle composite is provided, in which a matrix resin layer and metal nanoparticles are immobilized on the matrix resin layer. The metal nanoparticle composite has the following characteristics: a) the metal nanoparticles are obtained by heat-reducing metal ions or metal salts contained in the matrix resin layer or a precursor resin layer thereof; b) the metal nanoparticles exist within a region from the surface of the matrix resin layer to a depth of at least 50 nm; c) particle diameters of the metal nanoparticles are in the range of 1 nm to 100 nm with the mean particle diameter of greater than and equal to 3 nm; and d) a spacing between adjacent metal nanoparticles is greater than and equal to the particle diameter of a larger one of the adjacent metal nanoparticles.

Abstract: A composite substrate is described, including a laminate of a metal fine-particle dispersed layer and a light transmission layer. The metal fine-particle dispersed layer includes a matrix having a solid framework and voids therein, and metal fine-particles immobilized in the solid framework. The solid framework has a 3D network structure of aluminum oxyhydroxide or alumina hydrate. The metal fine-particles have a mean particle diameter of 20 to 100 nm, with 50% or more having particle diameters in the same range. The metal fine-particles are separated from each other, with a distance greater than or equal to the particle diameter of the larger one of neighboring fine-particles. The metal fine-particles have portions exposed in the voids of the matrix, and are 3D-dispersed in the matrix. The metal fine-particle dispersed layer has a thickness of 0.5 to 5 ?m and a metal fine-particle content of 22 to 900 ?g/cm2.

Abstract: A nano-composite 10 is described, including: a matrix layer 1 including a solid framework 1a and voids 1b defined by the same, and metal fine-particles 3 immobilized to the solid framework 1a. The framework 1a includes aluminum oxyhydroxide or alumina hydrate and forms a 3D network structure. The metal fine-particles have a mean particle diameter of 3 to 100 nm, with 60% or more having particle diameters of 1 to 100 nm. The metal fine-particles 3 exist in a manner that they are not in contact with one another and neighboring metal fine-particles 3 are apart from each other by a distance equal to or larger than the particle diameter DL of the larger one of the neighboring metal fine-particles 3. The metal fine-particles 3 are 3D-dispersed in the matrix layer 1, wherein each metal fine-particle 3 has a portion exposed in the voids 1b.

Abstract: A nano-composite 10 is described, including a matrix resin 1, metal fine-particles 3 immobilized in the matrix resin 1, a binding species 7 immobilized on a part or all of the metal fine-particles 3, and metal fine-particles 9 indirectly immobilized on the metal fine-particles 3 via the binding species 7. Each of at least a part of the metal fine-particles 3 has a portion embedded in the matrix resin 1, and a portion (exposed portion 3a) exposed outside of the matrix resin 1, while the binding species 7 is immobilized on the exposed portions.

Abstract: A metal microparticle composite is provided, which includes a film-shaped matrix resin and metal microparticles immobilized in the matrix resin. The metal microparticles are obtained by reducing metal ions or metal salts, and the particle diameters of at least 90% of all the metal microparticles are in the range of 10 nm to 80 nm. The metal microparticles that are dispersed in a plane direction parallel to the matrix resin surface in a range of depth within 150 nm from the matrix resin surface to form a metal microparticle layer, and only one metal microparticle having the diameter described is present in the direction of depth in the metal microparticles layer. The spacing between adjacent metal microparticles is greater than and equal to the particle diameter of the larger one of the adjacent metal microparticles.

Abstract: A metal nanoparticle composite is provided, in which a matrix resin layer and metal nanoparticles are immobilized on the matrix resin layer. The metal nanoparticle composite has the following characteristics: a) the metal nanoparticles are obtained by heat-reducing metal ions or metal salts contained in the matrix resin layer or a precursor resin layer thereof; b) the metal nanoparticles exist within a region from the surface of the matrix resin layer to a depth of at least 50 nm; c) particle diameters of the metal nanoparticles are in the range of 1 nm to 100 nm with the mean particle diameter of greater than and equal to 3 nm; and d) a spacing between adjacent metal nanoparticles is greater than and equal to the particle diameter of a larger one of the adjacent metal nanoparticles.

Abstract: This invention relate to a copper-clad laminate with good adhesion between a copper foil and a layer of polyimide resin useful for high-density printed wiring boards. The copper-clad laminate having a copper foil treated with a heterocyclic compound containing nitrogen and sulfur as an organic surface treating agent and a layer of polyimide resin satisfying either of the following requirements: the concentration of sulfur atoms derived from the organic surface treating agent in the interface of copper and polyimide is in the range of 0.01-0.24 wt % as determined by an Energy dispersive X-ray spectroscopy (EDX); the weight of sulfur atoms derived from the organic surface treating agent per unit area of the copper foil is in the range of 2.5-3.1 mg/m2; and the concentration of sulfur atoms derived from the organic surface treating agent existing in the range from the surface to a depth of 16 nm of the copper foil is in the range of 1.73-2.30 atom % as determined by X-ray photoelectron spectroscopy (XPS).

Abstract: A liquid trifunctional epoxy compound with a total chlorine content of 100 ppm or less represented by general formula (1) is obtained by epoxidizing a triallyl ether represented by general formula (2) with a peroxide and the liquid epoxy compound is useful as a diluent in a variety of applications, particularly useful as a liquid encapsulating material in electronic applications: