Abstract: A system (101) for monitoring a physiological condition of a user (104) is disclosed herein. The system (101) includes a receiving module (110) configured to receive a plurality of short-term segments of Heart Rate Variability (HMI) (302) or short-term electrocardiogram (ECG) segments (402) or short voice recordings (602) from the user (104) recorded at different time points. The system includes a stitching module (114) for stitching the plurality of short-term segments and creating a stitched segment. The system further includes an extracting module (116) extracting feature from the stitched segment and a predicting module (118) for predict the physiological condition, based on the feature.

Abstract: A vehicle light installed in a vehicle includes: a main case having a front opening; a first light guide disposed in the main case; a first light source that emits light into the first light guide; and a headlamp disposed in the main case. The first light guide (i) is rod-shaped, (ii) includes a first extended section extending from the inboard side of the first light guide relative to the vehicle widthwise direction toward the outboard side and a second extended section that continues from the first extended section, curves back inwardly, and extends to the inboard side, and (iii) opens toward a longitudinal center line of the vehicle. The headlamp is disposed between the first extended section and the second extended section. The first extended section and the second extended section extend toward the longitudinal center line of the vehicle to a point beyond the headlamp.

Abstract: A vehicle light installed in a vehicle includes: a main case having a front opening; a first light guide disposed in the main case; a first light source that emits light into the first light guide; and a headlamp disposed in the main case. The first light guide (i) is rod-shaped, (ii) includes a first extended section extending from the inboard side of the first light guide relative to the vehicle widthwise direction toward the outboard side and a second extended section that continues from the first extended section, curves back inwardly, and extends to the inboard side, and (iii) opens toward a longitudinal center line of the vehicle. The headlamp is disposed between the first extended section and the second extended section. The first extended section and the second extended section extend toward the longitudinal center line of the vehicle to a point beyond the headlamp.

Abstract: A vehicle light installed in a vehicle includes: a main case having a front opening; first and second light guides that are disposed in the main case; light sources that emit light into the first and second light guides; and a translucent cover fitted to cover the opening of the main case. The first light guide is rod-shaped and includes a first extended section extending from the inboard side of the first light guide relative to the vehicle width direction toward the outboard side of the first light guide relative to the same and a second extended section that continues from the first extended section, curves back inwardly, and extends to the inboard side, and the second light guide is plate-shaped and disposed so as to pass in front of or behind the portion of the first light guide that curves back.

Abstract: A vehicle light installed in a vehicle includes: a main case having a front opening; first and second light guides that are disposed in the main case; light sources that emit light into the first and second light guides; and a translucent cover fitted to cover the opening of the main case. The first light guide is rod-shaped and includes a first extended section extending from the inboard side of the first light guide relative to the vehicle width direction toward the outboard side of the first light guide relative to the same and a second extended section that continues from the first extended section, curves back inwardly, and extends to the inboard side, and the second light guide is plate-shaped and disposed so as to pass in front of or behind the portion of the first light guide that curves back.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

Abstract: Provided is a photoelectric converting device including: first photoreceptors each converting a received main beam to a current; second photoreceptors each converting a received first sub-beam to a current; and third photoreceptors each converting a received second sub-beam to a current; first current-voltage converting circuits each converting the current converted by a corresponding one of the first photoreceptors to a voltage; current amplifying circuits each amplifying or attenuating the current converted by a corresponding one of the second photoreceptors; switching circuits each supplying one of the current amplified or attenuated by a corresponding one of the current amplifying circuits and the current converted by the corresponding one of the second photoreceptors; and second current-voltage converting circuits each converting a sum of the current supplied by a corresponding one of the switching circuits and the current converted by a corresponding one of the third photoreceptors to a voltage.

Abstract: An optical pickup device includes: a first light-receiving element for receiving a main beam of a first light beam; second and third light-receiving elements for receiving sub-beams of the first light beam; a fourth light-receiving element for receiving a main beam of a second light beam; and fifth and sixth light-receiving elements for receiving sub-beams of the second light beam. The first through third light-receiving elements are located on a first line with the first light-receiving element sandwiched between the second and third light-receiving elements. The fourth through sixth light-receiving elements are located on a second line with the fourth light-receiving element sandwiched between the fifth and sixth light-receiving elements. The first line and the second line are parallel to each other.

Abstract: An amplifier circuit according to the present invention includes: a first operational amplifier having a negative input terminal, a positive input terminal, and an output terminal; a photodiode connected to the negative input terminal; a first resistor inserted between the output terminal and the negative input terminal; and a second resistor inserted between the output terminal and the positive input terminal, in which the amplifier circuit outputs current from the output terminal via the second resistor.

Abstract: An amplifier circuit according to the present invention includes: a first operational amplifier having a negative input terminal, a positive input terminal, and an output terminal; a photodiode connected to the negative input terminal; a first resistor inserted between the output terminal and the negative input terminal; and a second resistor inserted between the output terminal and the positive input terminal, in which the amplifier circuit outputs current from the output terminal via the second resistor.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.