Abstract: The present invention relates to a polymeric compound comprising, as structural units, groups each represented by the following general formula (1); and an insulating film for a semiconductor integrated circuit which comprises the polymeric compound: —R1—C?C—C?C—, wherein R1 represents a group having a cage-shaped structure. The insulating film has a high heat resistance, a high mechanical strength and a low dielectric constant. In addition, the insulating film has a high stability of its dielectric constant with the elapse of time. Furthermore, the present invention can provide an interlayer insulating film for electronic devices having a high heat resistance, a high mechanical strength and a low dielectric constant which can be maintained over an extremely long period of time as well as an electronic device whose layer structure is provided with such an insulating film as a constituent thereof.

Abstract: A process for producing an exterior member/seal member assembly includes: a first step of moving a slide core to protrude into a major cavity defined between first and second dies and, and injecting a hard synthetic resin into an exterior-member forming cavity partitioned in the major cavity; and a second step of retracting the slide core and injecting a soft synthetic resin into a seal-member forming cavity which is a remaining portion of the major cavity. An outer-seal-lip forming portion is connected to an outer end of the seal-member forming cavity; a recess-shaped step is formed on one side face of the slide core and adapted to define an inner-seal-lip forming portion leading to the seal-member forming cavity between the step and an inner surface of a guide bore in the second die when the slide core is retracted; and the soft synthetic resin is filled into the outer and inner-seal-lip forming portions 15 and 16 at the second step.

Abstract: A film forming composition includes a polymer of a compound represented by formula (I): wherein R1, R2 and R3 each independently represents a substituent containing a carbon-carbon double bond or carbon-carbon triple bond; X1, X2 and X3 each independently represents any substituent; l and n each stands for an integer of from 0 to 15 and m stands for an integer of from 0 to 14, with the proviso that l, m and n do not represent 0 simultaneously; o and q each independently stands for an integer of from 0 to 15 and p independently stands for an integer of from 0 to 14; and r stands for 0 or 1, with the proviso that when r=0, R1 and R3 each independently represents a substituent containing a carbon-carbon double bond.

Abstract: A polymer obtained by polymerizing a compound represented by formula (I) in a presence of a polymerization accelerator; a film-forming composition comprising the polymer; an insulating film formed by utilizing the composition; and an electronic device, in formula (I), R1 and R2 each independently represents a substituent containing a carbon-carbon triple bond; X1 and X2 each independently represents a substituent except for a substituent containing a carbon-carbon triple bond; l and m each independently represents an integer of 0 to 15, provided that l and m are not 0 at the same time; and p and n each independently represents an integer of 0 to 14.

Abstract: The present invention relates to a polymeric compound comprising, as structural units, groups each represented by the following general formula (1); and an insulating film for a semiconductor integrated circuit which comprises the polymeric compound: —R1—C?C—C?C—, wherein R1 represents a group having a cage-shaped structure. The insulating film has a high heat resistance, a high mechanical strength and a low dielectric constant. In addition, the insulating film has a high stability of its dielectric constant with the elapse of time. Furthermore, the present invention can provide an interlayer insulating film for electronic devices having a high heat resistance, a high mechanical strength and a low dielectric constant which can be maintained over an extremely long period of time as well as an electronic device whose layer structure is provided with such an insulating film as a constituent thereof.

Abstract: A film forming composition includes a polymer of a compound represented by formula (I): wherein R1, R2 and R3 each independently represents a substituent containing a carbon-carbon double bond or carbon-carbon triple bond; X1, X2 and X3 each independently represents any substituent; l and n each stands for an integer of from 0 to 15 and m stands for an integer of from 0 to 14, with the proviso that l, m and n do not represent 0 simultaneously; o and q each independently stands for an integer of from 0 to 15 and p independently stands for an integer of from 0 to 14; and r stands for 0 or 1, with the proviso that when r=0, R1 and R3 each independently represents a substituent containing a carbon-carbon double bond.

Abstract: A method of two-stage injection molding of an air conditioner outlet vent device is provided, the device including a housing, a plurality of blades pivotably supported by the housing and disposed in parallel to each other within the housing, and a link operatively connecting the blades. The plurality of blades are injection-molded in a secondary injection step subsequent to a primary injection step in which the housing is molded. In the secondary injection step, a molten resin is injected into cavities formed within a mold device in a closed mold state from a plurality of gates provided in portions of the mold device corresponding to projections of the blades. It is thus possible to improve the strength of link shafts and the projections while preventing any malfunction of the blades pivoting and any deterioration of the surface appearance, as well as to increase the degrees of freedom in changing the gate diameter.

Abstract: A polymer obtained by polymerizing a compound represented by formula (I) in a presence of a polymerization accelerator; a film-forming composition comprising the polymer; an insulating film formed by utilizing the composition; and an electronic device, in formula (I), R1 and R2 each independently represents a substituent containing a carbon-carbon triple bond; X1 and X2 each independently represents a substituent except for a substituent containing a carbon-carbon triple bond; l and m each independently represents an integer of 0 to 15, provided that l and m are not 0 at the same time; and p and n each independently represents an integer of 0 to 14.

Abstract: A process for producing an exterior member/seal member assembly includes: a first step of moving a slide core to protrude into a major cavity defined between first and second dies and, and injecting a hard synthetic resin into an exterior-member forming cavity partitioned in the major cavity; and a second step of retracting the slide core and injecting a soft synthetic resin into a seal-member forming cavity which is a remaining portion of the major cavity. An outer-seal-lip forming portion is connected to an outer end of the seal-member forming cavity; a recess-shaped step is formed on one side face of the slide core and adapted to define an inner-seal-lip forming portion leading to the seal-member forming cavity between the step and an inner surface of a guide bore in the second die when the slide core is retracted; and the soft synthetic resin is filled into the outer and inner-seal-lip forming portions 15 and 16 at the second step.

Abstract: A method of two-stage injection molding of an air conditioner outlet vent device is provided, the device including a housing, a plurality of blades pivotably supported by the housing and disposed in parallel to each other within the housing, and a link operatively connecting the blades. The plurality of blades are injection-molded in a secondary injection step subsequent to a primary injection step in which the housing is molded. In the secondary injection step, a molten resin is injected into cavities formed within a mold device in a closed mold state from a plurality of gates provided in portions of the mold device corresponding to projections of the blades. It is thus possible to improve the strength of link shafts and the projections while preventing any malfunction of the blades pivoting and any deterioration of the surface appearance, as well as to increase the degrees of freedom in changing the gate diameter.

Abstract: A process for producing an exterior member/seal member assembly includes: a first step of moving a slide core to protrude into a major cavity defined between first and second dies and, and injecting a hard synthetic resin into an exterior-member forming cavity partitioned in the major cavity; and a second step of retracting the slide core and injecting a soft synthetic resin into a seal-member forming cavity which is a remaining portion of the major cavity. An outer-seal-lip forming portion is connected to an outer end of the seal-member forming cavity; a recess-shaped step is formed on one side face of the slide core and adapted to define an inner-seal-lip forming portion leading to the seal-member forming cavity between the step and an inner surface of a guide bore in the second die when the slide core is retracted; and the soft synthetic resin is filled into the outer and inner-seal-lip forming portions 15 and 16 at the second step.