Abstract: The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.

Abstract: A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.

Abstract: A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.

Abstract: A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.

Abstract: The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under ection of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.

Abstract: A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.

Abstract: A photopolymeriziable thermosetting resin composition comprising (A) a mixture consisting of (a) an active energy ray-setting resin and obtained by reacting an unsaturated monobasic acid copolymer resin with a cycloaliphatic epoxy group-containing unsaturated compound or reacting a cycloaliphatic epoxy group containing copolymer resin with an acid group-containing unsaturated compound and (b) an photosensitive prepolymer obtained by esterifying a novolak type epoxy compound with an alpha-beta-unsaturated carboxylic acid and then further reacting with polybasic acid anhydride (and in one embodiment further reacting with an unsaturated isocyanate).