Patents by Inventor Yasuharu Shimomoto

Yasuharu Shimomoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5151385
    Abstract: A semiconductor device such as a solar cell, photodiode and solid state imaging device comprises a semiconductor layer made of amorphous silicon formed on a given substrate, and a transparent conductive layer formed by an interfacial reaction between the amorphous silicon and a metallic film directly formed on the amorphous silicon. This transparent conductive layer is used as a transparent electrode of the device and if necessary the remainder after having partially removed the metallic film for the transparent conductive layer is used as a conductive layer and light shielding film.
    Type: Grant
    Filed: October 3, 1988
    Date of Patent: September 29, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Hideaki Yamamoto, Koichi Seki, Toshihiro Tanaka, Akira Sasano, Toshihisa Tsukada, Yasuharu Shimomoto, Toshio Nakano, Hideto Kanamori
  • Patent number: 4900975
    Abstract: A target of an image pickup tube is formed by laminating at least a transparent conductive film, an amorphous layer consisting essentially of silicon, and an amorphous layer consisting essentially of selenium in the above order on a light-transmitting substrate.
    Type: Grant
    Filed: June 29, 1987
    Date of Patent: February 13, 1990
    Assignees: Hitachi, Ltd., Nippon Hoso Kyokai
    Inventors: Yasuharu Shimomoto, Sachio Ishioka, Yukio Takasaki, Tadaaki Hirai, Kazutaka Tsuji, Tatsuo Makishima, Hirokazu Matsubara, Kenji Sameshima, Junichi Yamazaki, Kenkichi Tanioka, Mitsuo Kosugi, Keiichi Shidara, Tatsuro Kawamura, Eikyuu Hiruma, Takashi Yamashita
  • Patent number: 4829345
    Abstract: Within an electronic device having a plurality of circuit parts (such as a three-dimensional device), a light transmission system which transfers signals between the circuit parts by the use of light is provided.The light transmission system is formed of a light emitting source which emits light having a desired wavelength, a photoelectric conversion portion which absorbs the light and converts it into an electric signal, and a light traveling path which conveys the light emitted from the light emitting source to the photoelectric conversion portion.Further, each of the light emitting source, the light traveling path and the photoelectric conversion portion is formed of a superlattice structure in which a plurality of materials of unequal energy gaps are layered.
    Type: Grant
    Filed: April 29, 1986
    Date of Patent: May 9, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Sachio Ishioka, Kazutaka Tsuji, Yukio Takasaki, Yasuharu Shimomoto, Hirokazu Matsubara, Tadaaki Hirai
  • Patent number: 4788582
    Abstract: A semiconductor device such as a solar cell, photodiode and solid state imaging device comprises a semiconductor layer made of amorphous silicon formed on a given substrate, and a transparent conductive layer formed by an interfacial reaction between the amorphous silicon and a metallic film directly formed on the amorphous silicon. This transparent conductive layer is used as a transparent electrode of the device and if necessary the remainder after having partially removed the metallic film for the transparent conductive layer is used as a conductive layer and right shielding film.
    Type: Grant
    Filed: November 10, 1986
    Date of Patent: November 29, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Hideaki Yamamoto, Koichi Seki, Toshihiro Tanaka, Akira Sasano, Toshihisa Tsukada, Yasuharu Shimomoto, Toshio Nakano, Hideto Kanamori
  • Patent number: 4609846
    Abstract: An image pick-up tube has a photoelectric conversion target including a transparent substrate, and a transparent electrode and a photoconductive layer formed on the transparent substrate. An electron beam is scanned on the photoelectric conversion target. A first electrode is formed on a beam scanning surface of the photoconductive layer so as to be segmented in stripe or grid with its electrode segments electrically connected to each other. A second electrode is formed on the first electrode through an insulating layer with its electrode segments electrically connected to each other. An insulating layer may be interposed between the first electrode and the photoconductive layer.
    Type: Grant
    Filed: September 20, 1984
    Date of Patent: September 2, 1986
    Assignee: Hitachi, Ltd.
    Inventors: Chushirou Kusano, Sachio Ishioka, Yasuharu Shimomoto, Yoshinori Imamura, Hirofumi Ogawa
  • Patent number: 4554478
    Abstract: In a photoelectric conversion element including at least a first electrode and a photoconductive layer having an amorphous material whose indispensable constituent is silicon and which contains hydrogen as an essential constituent element on a predetermined substrate, the present invention discloses a photoelectric conversion element wherein said layer of the amorphous material is disposed on said first electrode via a light transmitting or light semi-transmitting metallic layer for adhesion with respect to said amorphous material. As said metallic layer for adhesion, preferred is a layer consisting of at least one metal selected from the group consisting of Ta, Cr, W, Nd, Mo, V and Ti. Thus, adhesion between said substrate and said amorphous material can be improved.
    Type: Grant
    Filed: May 25, 1983
    Date of Patent: November 19, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Yasuharu Shimomoto, Yasuo Tanaka, Yukio Takasaki, Sachio Ishioka, Toshihisa Tsukada, Toru Baji
  • Patent number: 4495409
    Abstract: A photosensor comprising an array of a plurality of unit picture elements each of which is constituted by a serial connection of a photoconductor film and a diode or a combination of a photodiode and a diode connected in series to the photodiode in the opposite rectifying direction, wherein the plurality of unit picture elements being divided into at least two groups, the unit picture elements belonging to the respective groups being connected to corresponding first group of wiring conductors provided in association with the groups, respectively, while the unit picture elements belonging to the different groups and located at same positions in the different groups relative to one another are connected together to respective second group of wiring conductors, including a first biasing controller for applying a voltage to the first group of wiring conductor connected to the picture element from which a signal is to be read out, the voltage serving for biasing forward the diode of the picture element to be read
    Type: Grant
    Filed: February 16, 1982
    Date of Patent: January 22, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Toru Baji, Naohiko Koizumi, Toshihisa Tsukada, Hideaki Yamamoto, Yasuharu Shimomoto, Yasuo Tanaka
  • Patent number: 4457949
    Abstract: A hydrogen-containing amorphous silicon layer is formed on a substrate held below 200.degree. C., in a plasma atmosphere, whereupon the plasma is stopped and the layer is heated in a temperature range of 200.degree. C.-400.degree. C. without cooling the substrate. The saturation field for photocurrent of electrons or holes can be made low. In case of using electrons as major carriers, preferably the heating temperature is set in a temperature range of 200.degree. C.-240.degree. C., and in case of using holes as major carriers, preferably it is set in a range of 270.degree. C.-400.degree. C.
    Type: Grant
    Filed: June 15, 1982
    Date of Patent: July 3, 1984
    Assignee: Hitachi, Ltd.
    Inventors: Yukio Takasaki, Yasuharu Shimomoto, Yasuo Tanaka, Akira Sasano, Toshihisa Tsukada
  • Patent number: 4430185
    Abstract: In the method of producing photoelectric transducers having processes for forming a photoconductive layer on a predetermined substrate with an irregular surface by a method of depositing the photoconductive layer in the atmosphere including at least plasma, the predetermined substrate with irregular surface is disposed above a first electrode to which an electrode is opposed, and said photoconductive layer is formed while a negative potential is being applied to the first electrode. This enables the photoconductive layer to be formed without breaks at steps, pinholes and so on due to the irregular surface, and therefore, it is possible to provide good photoelectric transducers with small dark current.
    Type: Grant
    Filed: March 20, 1981
    Date of Patent: February 7, 1984
    Assignee: Hitachi, Ltd.
    Inventors: Yasuharu Shimomoto, Toshihisa Tsukada, Akira Sasano, Yasuo Tanaka, Hideaki Yamamoto, Yukio Takasaki
  • Patent number: 4419604
    Abstract: Disclosed is a light sensitive screen including at least a light-transmitting conductive film and a photoconductive layer, the light-transmitting conductive film being arranged on a side of incidence of light, characterized in that the photoconductive layer is constructed of a single layer or a plurality of layers of one or more photoconductive substances, at least one of such photoconductive substance layers being formed of an amorphous silicon material which contains at least 5 atomic-% to 30 atomic-% of hydrogen, whose optical forbidden band gap is 1.65 eV to 2.25 eV and whose peak component in an infrared absorption spectrum at a wave number of 2,100 cm.sup.-1 is greater than that at a wave number of 2,000 cm.sup.-1. Various characteristics of an imaging device provided with the light sensitive screen, such as dark current, lag and after image characteristics, are improved.
    Type: Grant
    Filed: April 24, 1981
    Date of Patent: December 6, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Sachio Ishioka, Yoshinori Imamura, Yasuharu Shimomoto, Saburo Ataka, Yasuo Tanaka, Eiichi Maruyama
  • Patent number: 4412900
    Abstract: A method of manufacturing photosensors is disclosed which comprises the steps of forming a photo-conductor film made chiefly of silicon and containing hydrogen on a desired substrate, forming a transparent conductive film on the photo-conductor film by sputtering, and heating the photosensor having the sputtered transparent conductive film at least at 140.degree. C. and not higher than 280.degree. C. The heat treatment is performed preferably at a temperature between 170.degree. to 250.degree. C., at which greater effect will be provided. This heat treatment remarkably improves the photo-response speed.
    Type: Grant
    Filed: March 11, 1982
    Date of Patent: November 1, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Tanaka, Akira Sasano, Toshihisa Tsukada, Yasuharu Shimomoto
  • Patent number: 4380557
    Abstract: In preparing an image pickup device by using hydrogen-containing amorphous silicon for a photoconductive layer, a hydrogen-containing amorphous silicon layer is first formed and is then heat-treated at 100.degree. to 300.degree. C. The image pickup characteristics of the amorphous silicon layer are highly improved by this heat treatment. For example, the lag and dark current are reduced and the signal current-target voltage characteristic is improved. Especially excellent improving effects can be obtained when amorphous silicon characterized in that (1) the hydrogen content is 5 to 30 atomic %, (2) the optical forbidden band gap is 1.30 to 1.95 eV and (3) in the infrared absorption spectrum, the component of a wave number of 2000 cm.sup.-1 is observed larger than the component of a wave number of 2100 cm.sup.-1 is subjected to the above-mentioned heat treatment. The adhesion to the substrate is enhanced, and good image pickup characteristics can be obtained.
    Type: Grant
    Filed: July 28, 1981
    Date of Patent: April 19, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Sachio Ishioka, Yasuharu Shimomoto, Yoshinori Imamura, Saburo Ataka, Yasuo Tanaka, Hirokazu Matsubara, Yukio Takasaki, Eiichi Maruyama
  • Patent number: 4378417
    Abstract: In an electrophotographic member employing an amorphous silicon photoconductive layer, a part which is at least 10 nm thick inwardly of the amorphous silicon layer from the surface (or interface) of the amorphous silicon layer is made of amorphous silicon which has an optical forbidden band gap of at least 1.6 eV and a resistivity of at least 10.sup.10 .OMEGA..cm. The electrophotographic member exhibits a satisfactory resolution and good dark-decay characteristics. Further, a region which has an optical forbidden band gap narrower than that of the amorphous silicon forming the surface (or interface) region is disposed within the amorphous silicon layer to a thickness of at least 10 nm, whereby the sensitivity of the electrophotographic member to longer wavelengths of light can be enhanced.
    Type: Grant
    Filed: April 15, 1981
    Date of Patent: March 29, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Eiichi Maruyama, Sachio Ishioka, Yoshinori Imamura, Hirokazu Matsubara, Yasuharu Shimomoto, Shinkichi Horigome, Yoshio Taniguchi
  • Patent number: RE33094
    Abstract: In an electrophotographic member employing an amorphous silicon photoconductive layer, a part which is at least 10 nm thick inwardly of the amorphous silicon layer from the surface (or interface) of the amorphous silicon layer is made of amorphous silicon which has an optical forbidden band gap of at least 1.6 eV and a resistivity of at least 10.sup.10 .OMEGA..cm. The electrophotographic member exhibits a satisfactory resolution and good dark-decay characteristics. Further, a region which has an optical forbidden band gap narrower than that of the amorphous silicon forming the surface (or interface) region is disposed within the amorphous silicon layer to a thickness of at least 10 nm, whereby the sensitivity of the electrophotographic member to longer wavelengths of light can be enhanced.
    Type: Grant
    Filed: September 11, 1986
    Date of Patent: October 17, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Eiichi Maruyama, Sachio Ishioka, Yoshinori Imamura, Hirokazu Matsubara, Yasuharu Shimomoto, Shinkichi Horigome, Yoshio Taniguchi