Abstract: This is a cooler for dissipating heat away from an electronic device (A). The cooler includes a liquid cooling mechanism (B), a forcible air cooling mechanism (C) and a substrate (D). The liquid cooling mechanism includes a set of metal pipes (20-21) connected to a pump (3) with an impeller (16) to transfer cooling liquid to a liquid channel (4). The forcible air cooling mechanism (C) includes a fan (25) discharging air onto a radiating fin (37) located on the set of metal pipes (20-21). The substrates (D) is in fluid communication with the forcible air cooling mechanism (C) and the liquid cooling mechanism (B) and in direct contact with the electronic device (A) so as to remove heat away from the electronic device (A).

Abstract: An object of the present invention is to provide a thermostat device which ensures a smooth slide without damaging the slide function by immersion of a cooling liquid, increase flexibility of a circulation channel design by miniaturization, and materializes a hand-operated opening and closing of a valve. In order to solve the problems, the thermostat device 1 in which a heat responding element (wax 3) to expand and shrink by sensing the heating or cooling of the circulating liquid in the circulation channel, is embedded, a sliding member (piston rod 9) is slid in accordance with volume changes caused by the expansion and shrinkage of the expansion element to open and close the valve body, is structured that a sensor case 2 which embeds the responding element is placed in the circulation channel of the circulating liquid, and the sliding member is placed outside of the circulation channel of the circulating liquid.