Patents by Inventor Yasuhide Matsuo
Yasuhide Matsuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170036703Abstract: There is provided a vehicle body framework structure, the vehicle body framework structure including (1) a framework main body that is provided with a closed cross-sectional structure which is formed by joining together a first panel, and a second panel having less strength than the first panel, and (2) a cylindrical reinforcing member that is provided inside the framework main body and extends along the framework main body, a portion of the cylindrical reinforcing member that is located on the second panel side being formed thicker overall than a portion of the cylindrical reinforcing member that is located on the first panel side.Type: ApplicationFiled: June 17, 2016Publication date: February 9, 2017Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hirokazu MAEDA, Yasuhide Matsuo
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Publication number: 20160375938Abstract: The suspension member includes: a rear cross member that extends along the vehicle width direction, and that includes a left and right pair of sub side rails that integrally extend from respective vehicle width direction end portions of the rear cross member toward the vehicle body front side; and a left and right pair of side rails that extend along the extension direction of the sub side rails, that each include a bent portion protruding toward the vehicle body lower side at an extension direction intermediate portion of the side rail, wherein the upper side of an end portion further toward a vehicle body rear side than the bent portion is covered by, and joined to, the respective sub side rail, and the lower side of the end portion further toward the vehicle body rear side than the bent portion is in an exposed state.Type: ApplicationFiled: March 25, 2016Publication date: December 29, 2016Applicant: Toyota Jidosha Kabushiki KaishaInventors: Yasuhide MATSUO, Soshiro MURATA
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Patent number: 9517798Abstract: There is provided a vehicle body structure including an upper section that is integrally casted using a non-ferrous metal material, that includes a transmission section to which an external force is transmitted and a join section extending out from the transmission section, a connection section that is formed using a steel material, and that is joined to the join section by riveting, and a member section that is formed using a steel material, and that is joined to the connection section by welding.Type: GrantFiled: June 9, 2015Date of Patent: December 13, 2016Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yasuhide Matsuo, Hiroyuki Koike, Takashi Sasaki
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Publication number: 20160136880Abstract: The present invention provides a joint structure having: a first panel comprising a first material; a second panel comprising a metal material different from the first material; a rivet having a head portion that is placed in contact with the first panel, a shaft portion that is passed through the first panel, and a joint portion that is disposed on the shaft portion side and is in contact with and joined by welding to the second panel; and a sandwiching portion that is disposed at the rivet and sandwiches between itself and the head portion the first panel from the second panel side.Type: ApplicationFiled: June 9, 2014Publication date: May 19, 2016Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yasuhide MATSUO, Hiroyuki KUROKAWA
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Publication number: 20160129772Abstract: A vehicle press door structure includes: a door frame in which an open portion having a recess-shaped cross-section that is open to an inner peripheral side is formed by a door outer panel, and a door inner panel arranged on a vehicle width direction inside of the door outer panel; a door glass run that has lip portions that respectively extend toward a center side from both side portions of a door glass run main body having a recess-shaped cross-section and slidingly contact a door glass, the door glass run being fit into the open portion with a base portion between both of the side portions of the door glass nm main body opposing an inside wall of the door inner panel; and a seal portion that protrudes from the base portion and contacts the inside wall, and extends in a length direction of the door glass run main body.Type: ApplicationFiled: June 26, 2014Publication date: May 12, 2016Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hideaki KANASUGI, Yasuhide MATSUO
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Publication number: 20160121829Abstract: There is provided a vehicle connecting member including: a front face portion that is connected to a crash box; a first connecting section inserted with and connected to a front end portion of a side member provided running along a vehicle front-rear direction at the vehicle front-rear direction rear side of the crash box; a second connecting section that is formed at a vehicle width direction outside of the first connecting section in a vehicle plan view, and that is connected to a lower end portion of an outrigger provided running along the vehicle front-rear direction at the vehicle width direction outside of the side member so as to extend toward a vehicle vertical direction lower side; and one or more lateral ribs that couple together the first connecting section and the second connecting section.Type: ApplicationFiled: October 26, 2015Publication date: May 5, 2016Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Soshiro MURATA, Hiroyuki KOIKE, Yasuhide MATSUO
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Publication number: 20150360723Abstract: There is provided a vehicle body structure including an upper section that is integrally casted using a non-ferrous metal material, that includes a transmission section to which an external force is transmitted and a join section extending out from the transmission section, a connection section that is formed using a steel material, and that is joined to the join section by riveting, and a member section that is formed using a steel material, and that is joined to the connection section by welding.Type: ApplicationFiled: June 9, 2015Publication date: December 17, 2015Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yasuhide MATSUO, Hiroyuki KOIKE, Takashi SASAKI
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Publication number: 20150239223Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.Type: ApplicationFiled: February 26, 2015Publication date: August 27, 2015Inventors: Hiroyuki TSUCHIYA, Yasuhide MATSUO, Kenji OTSUKA, Minehiro IMAMURA, Tomohiro HAYASHI, Kei TADACHI
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Patent number: 8884495Abstract: The present invention provides a piezoelectric sensor that can reduce spurious vibration of a transducer. The piezoelectric sensor includes a transducer which has a piezoelectric body and a vibration plate and which transmits/receives ultrasound, and a mount supporting the transducer near nodes of mechanical vibration generated to the transducer. The mount includes ribs that contact the transducer near the nodes of vibration in a point by point, line by line or partially plane by plane contact manner to support the transducer, and retract portions which are provided side by side to respective ribs near the nodes of vibration and which are distant from the transducer so as not to support the transducer.Type: GrantFiled: January 20, 2012Date of Patent: November 11, 2014Assignee: Tamura CorporationInventors: Yasuhide Matsuo, Daisuke Shimizu
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Patent number: 8262837Abstract: A bonding method includes a first process that includes plasmatizing a first gas including a raw gas containing a siloxane (Si—O) bond at a reduced-pressure atmosphere, substituting the first gas by a second gas mainly including an inert gas, and plasmatizing the second gas to form a first plasma polymerized film on at least a part of a base member so as to obtain a first bonded object including the base member and the plasma polymerized film and a second process that includes preparing a second bonded object that is to be bonded to the first bonded object and pressing the first and the second bonded objects against each other such that a surface of the first plasma polymerized film is closely contacted to a surface of the second bonded object to bond the objects together.Type: GrantFiled: March 30, 2009Date of Patent: September 11, 2012Assignee: Seiko Epson CorporationInventor: Yasuhide Matsuo
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Publication number: 20120187801Abstract: The present invention provides a piezoelectric sensor that can reduce spurious vibration of a transducer. The piezoelectric sensor includes a transducer which has a piezoelectric body and a vibration plate and which transmits/receives ultrasound, and a mount supporting the transducer near nodes of mechanical vibration generated to the transducer. The mount includes ribs that contact the transducer near the nodes of vibration in a point by point, line by line or partially plane by plane contact manner to support the transducer, and retract portions which are provided side by side to respective ribs near the nodes of vibration and which are distant from the transducer so as not to support the transducer.Type: ApplicationFiled: January 20, 2012Publication date: July 26, 2012Inventors: Yasuhide Matsuo, Daisuke Shimizu
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Patent number: 8128202Abstract: A nozzle plate includes: a nozzle for discharging a liquid as droplets; a liquid-repellent film suppressing attachment of the droplets on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellent film includes a first plasma polymerized film having a Si skeleton, which includes a siloxane (Si—O) bond and has a random atomic structure, and an elimination group bonded with the Si skeleton.Type: GrantFiled: July 23, 2009Date of Patent: March 6, 2012Assignee: Seiko Epson CorporationInventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
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Patent number: 8029111Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film.Type: GrantFiled: November 4, 2008Date of Patent: October 4, 2011Assignee: Seiko Epson CorporationInventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
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Patent number: 8029110Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and a second bonding film on one surface, the first and second films being bonded together to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding films contain an Si-skeleton of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding films.Type: GrantFiled: November 4, 2008Date of Patent: October 4, 2011Assignee: Seiko Epson CorporationInventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
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Patent number: 7982372Abstract: A piezoelectric transformer includes: a piezoelectric transducer on whose outer surface an electrode is formed; a case housing the piezoelectric transducer; a terminal disposed to face the electrode; an elastic member in contact with both the electrode and the terminal in the case and having conductivity to bring the electrode and the terminal into mutual continuity; and a folder formed in the case and fixedly holding the elastic member to press-fit the elastic member between the electrode and the terminal.Type: GrantFiled: December 2, 2008Date of Patent: July 19, 2011Assignee: Tamura CorporationInventors: Akio Machida, Ryo Nakagawa, Yasuhide Matsuo
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Publication number: 20100323193Abstract: A base member including a bonding film comprises a substrate; and the bonding film provided on the substrate. The base member is capable of bonding to an opposite substrate (object) through the bonding film. Such a bonding film contains a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. Further, a crystallinity degree of the Si-skeleton is equal to or lower than 45%. Furthermore, in a case where energy is applied to at least a part region of the surface of the bonding film, the elimination groups existing on the surface and in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that the region develops a bonding property with respect to the opposite substrate.Type: ApplicationFiled: July 2, 2008Publication date: December 23, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
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Publication number: 20100323192Abstract: A base member including a bonding film comprises a substrate; and the bonding film provided on the substrate. The base member is capable of bonding to an opposite substrate (object) through the bonding film. Such a bonding film contains a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. Further, the bonding film is formed by a plasma polymerization. Furthermore, in a case where energy is applied to at least a part region of the surface of the bonding film, the elimination groups existing on the surface and in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that the region develops a bonding property with respect to the opposite substrate.Type: ApplicationFiled: July 2, 2008Publication date: December 23, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
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Publication number: 20100200144Abstract: A bonding method of manufacturing a bonded body is provided. The bonding method comprises: after providing a first object in which a plasma polymerization film having a surface is formed on a base member, applying an energy to the surface of the plasma polymerization film to activate the surface; after providing a second object having a surface to be bonded to the surface of the plasma polymerization film of the first object and no plasma polymerization film onto the surface of the second object, bonding the surface of the second object and the surface of the activated plasma polymerization film so that the surface of the plasma polymerization film is bonded to the surface of the second object to obtain the bonded body.Type: ApplicationFiled: June 16, 2008Publication date: August 12, 2010Applicant: SEIKO EPSON CORPORATIONInventor: Yasuhide Matsuo
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Publication number: 20100193120Abstract: A bonding method of manufacturing a bonded body is provided. The bonding method comprises: after providing a first object on which a first plasma polymerization film is formed on a first base member, and the first plasma polymerization film having a surface, selectively applying an energy to a part of a predetermined region of the surface of the first plasma polymerization film to activate the part of the predetermined region of the surface of the plasma polymerization film; after providing a second object having a surface; and bonding the surface of the second object and the surface of the activated first plasma polymerization film so that the surface of the first plasma polymerization film is partially bonded to the surface of the second object at the part of the predetermined region to obtain the bonded body.Type: ApplicationFiled: June 16, 2008Publication date: August 5, 2010Applicant: SEIKO EPSON CORPORATIONInventor: Yasuhide Matsuo
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Publication number: 20100151231Abstract: A bonded body according to the present invention comprises a first object comprised of a first substrate and a first bonding film formed on the first substrate and a second object comprised of a second substrate and a second bonding film formed on the second substrate. The first and second bonding films contain a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. When an energy is applied to at least a part region of the surface of each of the first and second bonding films, the elimination groups existing in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that each region develops a bonding property with respect to the other film to thereby bond the first and second objects together through the first and second bonding films.Type: ApplicationFiled: July 2, 2008Publication date: June 17, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu