Abstract: A semiconductor chip defines an active surface on which a plurality of signal pads, a plurality of power source pads and a plurality of grounding pads are provided. A flexible insulation substrate defines an opening section by removing a section of the insulation member, and a power source conductor pattern and a grounding conductor pattern are formed to extend across the opening section. The power source conductor pattern and the grounding conductor pattern are provided with connection branches that are narrower than power source pads and grounding pads.

Abstract: A semiconductor chip defines an active surface on which a plurality of signal pads, a plurality of power source pads and a plurality of grounding pads are provided. A flexible insulation substrate defines an opening section by removing a section of the insulation member, and a power source conductor pattern and a grounding conductor pattern are formed to extend across the opening section. The power source conductor pattern and the grounding conductor pattern are provided with connection branches that are narrower than power source pads and grounding pads.

Abstract: A method of transporting PLCC IC packages (3) having J-shaped bend lead pins utilizing containers (1) for transport, in which the IC packages (3) are mounted upside down such that the lead pins cannot be moved to collide against anything within the container during transport. The method thus ensures that the leads of the IC packages are not deformed and loss of the flatness of the leads can be prevented during transport.

Abstract: An IC package storage container has a conductive tubular-shaped body within which is housed a plurality of IC packages and includes a non-conductive transparent window in one wall of the body. Conductive protrusions or projections are formed on and integral with the inside of the tubular-shaped body and extend into the interior of the container body to be in close proximity with a surface of the IC packages. The protrusions formed on adjacent sides of the transparent window and arranged substantially parallel thereto for the length of the container body. The length of the protrusions are such that they concurrently prevent substantial lateral shifting and rotational orientation of the IC packages within the tubular-shaped container body and prevent contact with the transparent window.