Patents by Inventor Yasuhide Takeda

Yasuhide Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11804610
    Abstract: A fuel cell system having a direct liquid fuel cell that uses a liquid containing a formic acid or an alcohol as a fuel includes: a fuel tank that stores the fuel to be supplied to the fuel cell; a fuel supply device that supplies the fuel in the fuel tank to the fuel cell; and a bubbling device that blows an inert gas into the fuel stored in the fuel tank.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: October 31, 2023
    Assignees: JTEKT CORPORATION, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY
    Inventors: Takuya Tsujiguchi, Yasuhide Takeda, Atsushi Kubo, Akihiro Takazato, Toshiyuki Saito, Motoo Nakai, Yusuke Ueda
  • Publication number: 20230275243
    Abstract: A fuel cell includes a discharge structure that discharges water generated in a cathode electrode in association with an electrode reaction in the MEA to the outside. The discharge structure includes a discharge path through which air that is an oxidant flows, a passage that communicably connects an oxidant supply flow path and the discharge path and that moves water generated in the cathode electrode to the discharge path, and a discharge portion that discharges the generated water moved to the discharge path to the outside.
    Type: Application
    Filed: August 25, 2021
    Publication date: August 31, 2023
    Applicants: JTEKT CORPORATION, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY
    Inventors: Takuya TSUJIGUCHI, Yasuhide TAKEDA, Motoo NAKAI, Toshiyuki SAITO, Atsushi KUBO, Mototake FURUHASHI, Ayumi NAKASONE, Atsushi NAKANE, Fumitaka ACHIWA
  • Publication number: 20220393200
    Abstract: A fuel cell system having a direct liquid fuel cell that uses a liquid containing a formic acid or an alcohol as a fuel includes: a fuel tank that stores the fuel to be supplied to the fuel cell; a fuel supply device that supplies the fuel in the fuel tank to the fuel cell; and a bubbling device that blows an inert gas into the fuel stored in the fuel tank.
    Type: Application
    Filed: October 23, 2020
    Publication date: December 8, 2022
    Applicants: JTEKT CORPORATION, NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY
    Inventors: Takuya TSUJIGUCHI, Yasuhide TAKEDA, Atsushi KUBO, Akihiro TAKAZATO, Toshiyuki SAITO, Motoo NAKAI, Yusuke UEDA
  • Patent number: 10766280
    Abstract: A printer includes a casing, a detachable unit provided to the casing, the detachable unit being configured to be detachable from the casing, an adjacent member provided adjacent to the detachable unit, and an engagement member attached to the adjacent member, the engagement member being configured to be changeable between an engagement position with which the adjacent member is engaged with the casing and a non-engagement position with which the adjacent member is removed from the casing. The engagement member engages the detachable unit to the casing together with the adjacent member, at the engagement position.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: September 8, 2020
    Assignee: SATO HOLDINGS KABUSHIKI KAISHA
    Inventors: Yasuhide Takeda, Hirohito Shimazaki
  • Publication number: 20200130383
    Abstract: A printer includes a casing, a detachable unit provided to the casing, the detachable unit being configured to be detachable from the casing, an adjacent member provided adjacent to the detachable unit, and an engagement member attached to the adjacent member, the engagement member being configured to be changeable between an engagement position with which the adjacent member is engaged with the casing and a non-engagement position with which the adjacent member is removed from the casing. The engagement member engages the detachable unit to the casing together with the adjacent member, at the engagement position.
    Type: Application
    Filed: September 25, 2018
    Publication date: April 30, 2020
    Applicant: SATO HOLDINGS KABUSHIKI KAISHA
    Inventors: Yasuhide TAKEDA, Hirohito SHIMAZAKI
  • Patent number: 9601572
    Abstract: A gate pad and a source pad are disposed on a semiconductor layer. The gate pad is disposed at the center portion of the semiconductor layer and has the shape of a circle centered on the center of the semiconductor layer as viewed in plan. The source pad is disposed so as to surround the gate pad, and has the shape of a circular ring centered on the center of the semiconductor layer as viewed in plan. A plurality of unit cells that compose a trench type MOSFET element are formed in the semiconductor layer.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: March 21, 2017
    Assignee: JTEKT CORPORATION
    Inventors: Yasuhide Takeda, Yasuyuki Wakita, Masaya Segawa, Shigeki Nagase
  • Patent number: 9601573
    Abstract: A gate pad is disposed on a semiconductor layer composed of an n+ type substrate, an n? type epitaxial layer, and a p? type body layer. The gate pad is disposed at the center portion of the semiconductor layer as viewed in plan. A plurality of unit cells that compose a trench type MOSFET element are provided in the semiconductor layer. The plurality of unit cells are arranged in the radial direction about the gate pad as viewed in plan. A gate electrode of a unit cell (center-side unit cell) that is proximate to the gate pad is electrically connected to the gate pad. Gate electrodes of unit cells that are adjacent to each other in the radial direction are connected to each other.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: March 21, 2017
    Assignee: JTEKT CORPORATION
    Inventors: Yasuhide Takeda, Yasuyuki Wakita
  • Publication number: 20150295043
    Abstract: A gate pad and a source pad are disposed on a semiconductor layer. The gate pad is disposed at the center portion of the semiconductor layer and has the shape of a circle centered on the center of the semiconductor layer as viewed in plan. The source pad is disposed so as to surround the gate pad, and has the shape of a circular ring centered on the center of the semiconductor layer as viewed in plan. A plurality of unit cells that compose a trench type MOSFET element are formed in the semiconductor layer.
    Type: Application
    Filed: April 8, 2015
    Publication date: October 15, 2015
    Inventors: Yasuhide TAKEDA, Yasuyuki WAKITA, Masaya SEGAWA, Shigeki NAGASE
  • Publication number: 20150295044
    Abstract: A gate pad is disposed on a semiconductor layer composed of an n+ type substrate, an n? type epitaxial layer, and a p? type body layer. The gate pad is disposed at the center portion of the semiconductor layer as viewed in plan. A plurality of unit cells that compose a trench type MOSFET element are provided in the semiconductor layer. The plurality of unit cells are arranged in the radial direction about the gate pad as viewed in plan. A gate electrode of a unit cell (center-side unit cell) that is proximate to the gate pad is electrically connected to the gate pad. Gate electrodes of unit cells that are adjacent to each other in the radial direction are connected to each other.
    Type: Application
    Filed: April 8, 2015
    Publication date: October 15, 2015
    Inventors: Yasuhide TAKEDA, Yasuyuki WAKITA
  • Patent number: 8749255
    Abstract: An electronic device test apparatus which can optimize throughput and costs is provided. An electronic device test apparatus 1 comprises: a test cell cluster 10 having cell groups 11A to 11H each of which has a plurality of test cells 20; and a conveyor apparatus 30 supplying test carriers to a plurality of the test cells 20, and each of the test cell 20 has: contactors 215; a flow path 221 connected to a vacuum pump 25 and reducing pressure in a recess 211 of a pocket 21 so as to bring external terminals 73 and the contactors 215 into contact; and a test circuit for running a test on an electronic circuit formed into a die 90.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: June 10, 2014
    Assignee: Advantest Corporation
    Inventors: Yasuhide Takeda, Hiroyuki Nagai, Yoji Ogino, Tatsuya Yamada
  • Patent number: 8653846
    Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: February 18, 2014
    Assignee: Advantest Corporation
    Inventors: Yoshinari Kogure, Yasuhide Takeda
  • Patent number: 8284224
    Abstract: A thermal printer allows ink ribbon replacement without interference of a hook positioned in the opened state particularly in an ink ribbon replacement operation. A thermal printer includes a head lock lever 40 which includes a hook 41 at the tip of the lever. The hook is mounted such that it can be moved in the longitudinal direction relative to a turn shaft 26 during turning of the turn shaft 26, allowing the distance between the turn shaft 26 and the hook 41 to be changed. A movement control moves the head lock lever 40 such that the distance between the turn shaft 26 and the hook 41 in the opened state in which the thermal head 12 is separated from the platen roller 11 is smaller than that in the pressed state in which the thermal head 12 is pressed into contact with the platen roller 11.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: October 9, 2012
    Assignees: Kabushiki Kaisha Sato, Kabushiki Kaisha Sato Chishiki Zaisan Kenkyusyo
    Inventor: Yasuhide Takeda
  • Publication number: 20120037833
    Abstract: A powder valve is propose which is simple in structure and small in size, which can prevent powder from getting stuck in the valve, and can withstand high feed pressure. The valve includes a valve casing 21, a valve shaft 25, and a valve body 22 mounted in the valve casing 21 and supported by the valve shaft 25. The valve body 22 has a spherical outer surface 27 configured to be brought into contact with a valve seat 23 of the valve casing 21 to close the valve. The valve body 22 is formed with a communication hole 26 extending in a direction perpendicular to the valve shaft 25 so that when the valve body 22 is rotated about the valve shaft 25 in either of two opposite directions from the closed position, the valve is configured to open through the communication hole 26. The communication hole 26 is open on the back side of the valve body 22 over the entire length thereof. With this arrangement, it is possible to ensure the advantages of a ball valve, i.e. full-bore properties and high rigidity.
    Type: Application
    Filed: March 26, 2009
    Publication date: February 16, 2012
    Inventors: Takayuki Miyazaki, Yasuhide Takeda, Shigeo Fukui, Shinji Takahashi, Takashi Arai
  • Publication number: 20110248734
    Abstract: An electronic device test apparatus which can optimize throughput and costs is provided. An electronic device test apparatus 1 comprises: a test cell cluster 10 having cell groups 11A to 11H each of which has a plurality of test cells 20; and a conveyor apparatus 30 supplying test carriers to a plurality of the test cells 20, and each of the test cell 20 has: contactors 215; a flow path 221 connected to a vacuum pump 25 and reducing pressure in a recess 211 of a pocket 21 so as to bring external terminals 73 and the contactors 215 into contact; and a test circuit for running a test on an electronic circuit formed into a die 90.
    Type: Application
    Filed: February 1, 2011
    Publication date: October 13, 2011
    Applicant: ADVANTEST CORPORATION
    Inventors: Yasuhide TAKEDA, Hiroyuki NAGAI, Yoji OGINO, Tatsuya YAMADA
  • Publication number: 20110089968
    Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.
    Type: Application
    Filed: October 5, 2010
    Publication date: April 21, 2011
    Inventors: Yoshinari KOGURE, Yasuhide TAKEDA
  • Publication number: 20100321458
    Abstract: A thermal printer allows ink ribbon replacement without interference of a hook positioned in the opened state particularly in an ink ribbon replacement operation. A thermal printer includes a head lock lever 40 which includes a hook 41 at the tip of the lever. The hook is mounted such that it can be moved in the longitudinal direction relative to a turn shaft 26 during turning of the turn shaft 26, allowing the distance between the turn shaft 26 and the hook 41 to be changed. A movement control moves the head lock lever 40 such that the distance between the turn shaft 26 and the hook 41 in the opened state in which the thermal head 12 is separated from the platen roller 11 is smaller than that in the pressed state in which the thermal head 12 is pressed into contact with the platen roller 11.
    Type: Application
    Filed: October 6, 2008
    Publication date: December 23, 2010
    Applicant: KABUSHIKI KAISHA SATO
    Inventor: Yasuhide Takeda
  • Patent number: 6815629
    Abstract: In a hydraulic pressure actuating apparatus for a circuit breaker, contacts of the circuit breaker have a moving contact and a stationary contact for turning on/off current. A shaft, at an end portion of which is attached the moving contact, and at the other end of which is attached a piston, is received within a cylinder. A directional control valve exchanges oil pressure for actuating the piston. For changing over the directional control valve, pilot valves are provided. Each pilot valve has a pair of valve bodies, each opposing to each other, and springs. One of the valve bodies is able to stroke up to contact with the valve body of the other valve body, therefore giving no ill influences upon actuating time, even if drawback occurs in the pilot valves in the hydraulic pressure actuating apparatus for the circuit breaker.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: November 9, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Shinji Seto, Yasuhide Takeda, Daisuke Ebisawa, Masayuki Uchiyama, Atsuji Watanabe, Hideo Kawamoto
  • Publication number: 20030213774
    Abstract: In a hydraulic pressure actuating apparatus for a circuit breaker, contacts of the circuit breaker has a moving contact 2 and a stationary contact 1 for turning on/off current. A shaft, at an end portion of which is attached the moving contact, and at the other end of which is attached a piston 5, is received within a cylinder 4. A directional control valve 13 exchanges oil pressure for actuating the piston. For changing over the directional control valve, pilot valves 50 and 60 are provided. Each pilot valve has a pair of valve bodies 53 and 55 or 63 and 65, each opposing to each other, and springs 54 and 64. One of the valve bodies is able to stroke up to contact with the valve body of the other valve body, therefore giving no ill influences upon actuating time, even if drawback occurs in the pilot valves in the hydraulic pressure actuating apparatus for the circuit breaker.
    Type: Application
    Filed: May 16, 2003
    Publication date: November 20, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Shinji Seto, Yasuhide Takeda, Daisuke Ebisawa, Masayuki Uchiyama, Atsuji Watanabe, Hideo Kawamoto
  • Patent number: D910746
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: February 16, 2021
    Assignees: SATO HOLDINGS KABUSHIKI KAISHA, KYOCERA CORPORATION
    Inventors: Yasuhide Takeda, Kazuya Shindo
  • Patent number: D919700
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: May 18, 2021
    Assignees: SATO HOLDINGS KABUSHIKI KAISHA, KYOCERA CORPORATION
    Inventors: Yasuhide Takeda, Kazuya Shindo