Abstract: The invention provides a multilayer resin sheet that includes: a resin composition layer that includes a thermosetting resin and a filler; and an adhesive layer that is disposed on at least one surface of the resin composition layer, the adhesive layer having an arithmetic average surface roughness Ra of 1.5 ?m or less at a surface that does not face the resin composition layer.

Abstract: A surface light source device is disclosed that provides greater light condensation in the frontal direction and higher luminance in comparison to a conventional surface light source device. Disclosed is a surface light source device providing a light source, a light guide having at least one of the side surfaces thereof as an incident surface and an outgoing surface substantially perpendicular to the incident surface, and at least two prism sheets, in which the surfaces formed by the prisms of the prism sheets are arranged so as to face upward, moreover the surfaces of the sides opposing the surfaces formed by the prisms of the prism sheets are arranged substantially parallel to the outgoing surface of the light guide.

Abstract: Provided are an easy-to-handle thin diffraction type light-condensing film exhibiting high light transmissivity and condensation ability, and a planar light source device using the film. A hologram optical element using diffraction/interference phenomena based on wave properties of light is used instead of a conventional prism sheet using refraction. As a result, the diffraction type light-condensing film and the planar light source device have high light transmissivity and are thin. In the diffraction type light-condensing film, dependence of bending angle on wave length is low and light entering from an oblique direction is bent in the vertical direction and emitted with spectral separation of white light suppressed. High light-condensation impossible in a conventional optical element is realized by suppressing angular variation in emission light for angular variation in incident light.

Abstract: Provided are an easy-to-handle thin diffraction type light-condensing film exhibiting high light transmissivity and condensation ability, and a planar light source device using the film. A hologram optical element using diffraction/interference phenomena based on wave properties of light is used instead of a conventional prism sheet using refraction. As a result, the diffraction type light-condensing film and the planar light source device have high light transmissivity and are thin. In the diffraction type light-condensing film, dependence of bending angle on wave length is low and light entering from an oblique direction is bent in the vertical direction and emitted with spectral separation of white light suppressed. High light-condensation impossible in a conventional optical element is realized by suppressing angular variation in emission light for angular variation in incident light.

Abstract: A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Abstract: A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.