Patents by Inventor Yasuhiko Hata

Yasuhiko Hata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8827690
    Abstract: A hollow body molding device having molten resin injected into a main cavity, fluid is pressure-injected through a pressure port after the injection of molten resin, a floating core moves to the outlet side, the molten resin is extruded from the outlet simultaneously with the movement of the floating core, and a hollow molded body is molded, the hollow body molding device having a floating core storage portion connected to the main cavity and stores the floating core moved by the pressurized fluid, an auxiliary cavity stores molten resin discharged from the main cavity and the floating core storage portion, communication passages and which communicate the floating core storage portion and the auxiliary cavity with each other; and an opening and closing means that opens and closes the communication passages by sliding movement. In the hollow body molding device, each inlet cross-sectional area B of the communication passages is specified.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 9, 2014
    Assignee: RP Topla Limited
    Inventors: Tomoyoshi Sakamoto, Minoru Ojiro, Takashi Hirose, Yasuhiko Hata, Hiroki Katagiri
  • Publication number: 20130236591
    Abstract: The present invention provides a hollow body molding device which allows easy confirmation of passage of a floating core through a molded body and facilitates quality control at the site.
    Type: Application
    Filed: November 30, 2011
    Publication date: September 12, 2013
    Applicant: RP TOPLA LIMITED
    Inventors: Tomoyoshi Sakamoto, Minoru Ojiro, Takashi Hirose, Yasuhiko Hata, Hiroki Katagiri
  • Publication number: 20110210482
    Abstract: A resin molded body can give a heat-insulating or radiation function of providing extremely good heat transfer, has high reliability, and is manufactured with a simple process at low cost. The resin molded body is formed by integrally injection molding of a pipe portion (1), which has at least a curved portion (3) and passes a fluid therethrough, and a flat plate portion (4).
    Type: Application
    Filed: August 5, 2009
    Publication date: September 1, 2011
    Applicant: RP TOPLA LIMITED
    Inventors: Tomoyoshi Sakamoto, Yasuhiko Hata, Hiroyuki Minezaki, Hiroki Katagiri, Minoru Ojiro
  • Publication number: 20100276133
    Abstract: In a resin heat exchanger unit, a resin pipe having straight portions and curved portions and a plurality of resin fins are integrally molded and there can be realized high reliability, high heat exchange efficiency, and a simple manufacturing process. The resin heat exchanger unit includes a resin pipe (1), which has straight portions (2) and curved portions (3) provided alternatively and continuously, and a plurality of resin fins (4) connected to the pipe (1), the pipe (1) and the fins (4) being integrally injection-molded.
    Type: Application
    Filed: March 13, 2009
    Publication date: November 4, 2010
    Applicant: RP TOPLA LIMITED
    Inventors: Minoru OJIRO, Yasuhiko HATA, Hiroyuki MINEZAKI, Tomoyoshi SAKAMOTO, Hiroki KATAGIRI
  • Patent number: 4933255
    Abstract: In an electro-photographic photosensor wherein amorphous silicon as a photoconductive layer is formed on the surface of an aluminum base which has been processed to be alumite layer consisting of a porous layer and barrier layer, amorphous silicon is formed directly on the surface of the porous layer in which porosities is remained by the elimination of the process of sealing porosities. Further, when aluminum is processed by electrolyzation to be alumite, thickness of the barrier layer and the porous layer are appropriately set to provide good adhesive strength of amorphous silicon to the aluminum base and good electrostatic characteristics by adjusting respectively a voltage and duration of the electrolyzation.
    Type: Grant
    Filed: May 8, 1989
    Date of Patent: June 12, 1990
    Assignee: Kabushiki Kaisha Komatsu Siesakusho
    Inventors: Yasuhiko Hata, Hiroyuki Mizukami, Toshio Itoh