Abstract: A TAB tape is constituted by a base material consisting of, e.g., a polyimide, in which leads composed of a copper foil are formed on the base material, and a power supply unit and a signal unit formed on a substrate, such as a printed circuit board, are connected to electrodes formed on a chip via the copper foil leads. Power supply leads for supplying power to the chip, ground leads for grounding, and signal leads for exchanging signals with the chip are formed by the copper foil on one surface of the base material. A common power supply lead to be connected to the power supply leads and a common ground lead to be connected to the ground leads are formed by the copper foil on the other surface of the base material.

Abstract: A lead frame includes a stage portion, at least one bar-like support portion, a plurality of lead portions; and a connection portion. A semiconductor chip having pads formed on an upper surface of the semiconductor chip is mounted on the stage portion. The bar-like support portion supports the stage portion. The plurality of lead portions are arranged to surround the stage portion and connected to the pads of the semiconductor chip mounted on the stage portion, and the stage portion is arranged at a level lower than that of an arrangement surface of the lead portions. The connection portion is formed on one side of the stage portion perpendicular to a longitudinal direction of the support portion, and the connection portion has a central portion which has an upper side portion projecting almost parallelly to a surface of the stage portion at a level higher than that of the surface of the stage portion and is connected to the support portion on the same plane.