Abstract: A controller sets, as a satellite mask range, a range for which a work implement can become an obstacle when an antenna receives positioning signals from a plurality of positioning satellites on the basis of a position at which the antenna is installed, a movable range of the work implement, a posture of an upper swing structure, and an azimuth angle of the upper swing structure. The controller cancels the setting of the satellite mask range in a case where it has been determined, on the basis of satellite positioning condition data acquired from a receiver, that the setting of the satellite mask range leads to reduced precision of positioning computation by the receiver. In a case where the setting of the satellite mask range has been canceled, the receiver computes the position of the upper swing structure on the basis of the positioning signals transmitted from the plurality of positioning satellites.

Abstract: In accordance with an embodiment, a measuring apparatus includes an electromagnetic wave applying unit, a detecting unit, a data processing unit, a film structure transforming unit, and a film structure measuring unit. The electromagnetic wave applying unit generates electromagnetic waves to apply it to a periodic structure of films on a substrate. The detecting unit detects the electromagnetic waves scattered or reflected by the substrate. The data processing unit calculates a surface shape of the periodic structure. The film structure transforming unit calculates a virtual film structure regarding the internal structure of the periodic structure. The film structure measuring unit calculates the thickness of each layer constituting the periodic structure by fitting a first reflectance profile by actual measurement regarding the periodic structure to a second reflectance profile obtained by a simulation using the virtual film structure to restructure the shape of the periodic structure.

Abstract: In accordance with an embodiment, a measurement apparatus includes a stage to hold a substrate, an electromagnetic wave applying unit, a detector, and first and second calculation units. The electromagnetic wave applying unit generates electromagnetic waves and applies it to the substrate. The detector detects the electromagnetic waves scattered or reflected by the substrate and measure the intensity of the electromagnetic waves. The first calculation unit processes a signal from the detector to create a first reflectance profile, fit the first reflectance profile to a second reflectance profile prepared by a simulation, thereby calculating thickness and density of an analytic model which is set so that the periodic structure and the membranous structure are regarded as a single mixed layer. The second calculation unit calculates, from a sectional shape of the periodic structure and the calculated thickness and density, the density of the second material after a volume change.

Abstract: In accordance with an embodiment, a substrate measurement apparatus circuit includes a light source, a detector, a data calculation unit, a mirror unit, a mirror drive unit, and a mirror drive calculation unit. The light source applies the electromagnetic waves to a measurement target substrate. The detector detects the electromagnetic waves diffracted or scattered by the application of the electromagnetic waves to the substrate. The data calculation unit processes a signal from the detector to acquire substrate information. The mirror unit includes a deflecting mirror which is adjusted to an optical condition where incident electromagnetic waves are totally reflected to control the track of the electromagnetic waves. The mirror drive unit drives the deflecting mirror in at least one of vertical, horizontal, and rotational directions. The mirror drive calculation unit calculates a drive amount to drive the deflecting mirror in at least one of the vertical, horizontal, and rotational directions.

Abstract: In accordance with an embodiment, a measuring apparatus includes a stage, an electromagnetic wave applying unit, a detector, a monitor, a detector location adjusting unit, and a measuring unit. The stage supports a substrate comprising a periodic structure on a main surface thereof. The electromagnetic wave applying unit generates electromagnetic waves and applies the electromagnetic waves to the substrate. The detector detects the intensity of the electromagnetic waves scattered or reflected by the substrate with the use of two-dimensionally arranged detection elements, and then outputs a signal. The monitor processes the signal from the detector to acquire a first scatter profile, and measure a positional deviation of the detector in accordance with the first scatter profile. The detector location adjusting unit corrects the positional deviation of the detector in accordance with the measured positional deviation. The measuring unit calculates a surface shape of the periodic structure.

Abstract: In accordance with an embodiment, a measuring apparatus includes an electromagnetic wave applying unit, a detecting unit, a data processing unit, a film structure transforming unit, and a film structure measuring unit. The electromagnetic wave applying unit generates electromagnetic waves to apply it to a periodic structure of films on a substrate. The detecting unit detects the electromagnetic waves scattered or reflected by the substrate. The data processing unit calculates a surface shape of the periodic structure. The film structure transforming unit calculates a virtual film structure regarding the internal structure of the periodic structure. The film structure measuring unit calculates the thickness of each layer constituting the periodic structure by fitting a first reflectance profile by actual measurement regarding the periodic structure to a second reflectance profile obtained by a simulation using the virtual film structure to restructure the shape of the periodic structure.

Abstract: According to one embodiment of a substrate measuring method, a shape of a unit structure is measured by making an electromagnetic wave incident on a periodical structure and detecting a scattered electromagnetic wave. Measurement conditions are determined through calculation of a scattering profile representing the distribution of scattering intensities of the electromagnetic wave and optimization corresponding to a comparison result obtained by comparing the scattering profile every time a value of a parameter of attention is changed.

Abstract: According to one embodiment, a pattern measuring method includes: irradiating, from a plurality of different incident directions, electromagnetic waves on a periodical structure pattern in which a plurality of patterns are periodically arrayed and partially overlap one another; detecting the electromagnetic waves scattered by the periodical structure pattern and detecting scattering profiles of the electromagnetic waves; and measuring, based on the detected scattering profiles, a pattern shape of the periodical structure pattern. Each of the different incident directions is an incident direction in which the patterns included in the periodical structure pattern do not partially overlap each other.

Abstract: According to one embodiment of a substrate measuring method, a shape of a unit structure is measured by making an electromagnetic wave incident on a periodical structure and detecting a scattered electromagnetic wave. Measurement conditions are determined through calculation of a scattering profile representing the distribution of scattering intensities of the electromagnetic wave and optimization corresponding to a comparison result obtained by comparing the scattering profile every time a value of a parameter of attention is changed.