Patents by Inventor Yasuhiko KAKIUCHI

Yasuhiko KAKIUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN SHEET
    Publication number: 20230064310
    Abstract: A resin sheet is made using a resin composition containing a thermosetting component (A). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0 × 10-6 m2/s or more. The resin sheet has a thickness in a range from 5 µm to 120 µm .
    Type: Application
    Filed: January 15, 2021
    Publication date: March 2, 2023
    Inventors: Yasutaka WATANABE, Yasunori KARASAWA, Kazue UEMURA, Yasuhiko KAKIUCHI
  • Sheet for semiconductor processing
    Patent number: 10825711
    Abstract: The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: November 3, 2020
    Assignee: LINTEC CORPORATION
    Inventors: Yasuhiko Kakiuchi, Takashi Akutsu, Sayaka Bandou, Yuichiro Komasu
  • SHEET FOR SEMICONDUCTOR PROCESSING
    Publication number: 20180286736
    Abstract: The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.
    Type: Application
    Filed: March 28, 2016
    Publication date: October 4, 2018
    Applicant: LINTEC CORPORATION
    Inventors: Yasuhiko KAKIUCHI, Takashi AKUTSU, Sayaka BANDOU, Yuichiro KOMASU