Abstract: A manufacturing method for a printed circuit board includes: passing a first laser beam output from a laser output device through a first aperture so as to define an outer diameter of the first laser beam, positioning the first laser beam by an optical axis positioning device including a galvano device and an f? lens, and irradiating the printed circuit board with the first laser beam such that a through-hole is formed in a copper layer; and passing a second laser beam output from the laser output device through a second aperture so as to define an outer diameter of the second laser beam whereby a diameter of the second aperture is smaller than a diameter of the first aperture, positioning the second laser beam by the optical axis positioning device, and irradiating the printed circuit board with the second laser beam such that an insulating layer is processed.

Abstract: Provided is a laser processing method for performing laser processing on a printed circuit board by using a carbon dioxide laser oscillator that oscillates a laser by applying an RF pulse, including continuing laser oscillation by restarting an RF pulse application while a laser after completing the RF pulse application is output, cutting off the continuously oscillated laser for a desired time, and performing laser processing on the printed circuit board.

Abstract: A laser processing method includes providing a unit configured to obtain time t0 from a time when the high-frequency pulse RF output is turned on to a time when the laser is actually output in advance and change a traveling direction of the laser in an optical path of the laser, irradiating the workpiece with all the lasers while the high-frequency pulse RF output is turned on, and removing at least a part of the laser from the workpiece simultaneous with turning off the high-frequency pulse RF output.

Abstract: A manufacturing method for a printed circuit board for positioning a laser beam output from a laser output device by using a galvano device and an f? lens and forming a hole in the printed circuit board including a copper layer and an insulating layer, the method including forming a through-hole in the copper layer by the laser beam whose outer diameter is shaped by a first aperture, and processing the insulating layer by the laser beam whose outer diameter is shaped by a second aperture having a smaller diameter than the first aperture.

Abstract: An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side.

Abstract: A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

Abstract: The present invention provides a method of manufacturing a thin-film solar panel with a laser scribing process to perform linear groove processing by irradiating a thin-film layer formed on a substrate with laser light to be separated from adjacent structure, including steps of: specifying an accurate position, size, shape of a adhered foreign matter on a glass substrate, a glass scratch, an air-bubble in the glass substrate causing an imperfection by inspecting a scribe line; and performing repair processing to form a new scribe line to bypass a portion of the imperfection after a final scribe line is formed.

Abstract: A manufacturing method of a multi-layered circuit board allows electronic parts to be mounted adequately and will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. The depth of the hole is set based on the tool electrically conducting with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.

Abstract: There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

Abstract: A printed circuit board manufacturing method by which the manufacturing time can be shortened and the manufacturing cost can be reduced. A printed circuit board has an insulating layer on its surface. Positions (first positions) of the printed circuit board where lands are disposed are irradiated with a CO2 laser beam (first laser beam) so as to form holes with a depth h from the surface. The printed circuit board is then scanned with an excimer laser beam (second laser beam) through a mask. The beam shape of the excimer laser beam is rectangular. Thus, holes reaching the lands are formed in the positions where the lands are disposed, and grooves for forming lines are formed (second positions). In this case, the holes reaching the lands may be formed by the CO2 laser beam.

Abstract: There is provided a multi-layered circuit board and a manufacturing method of the multi-layered circuit board that allows electronic parts to be mounted adequately and that will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. A depth of the hole is set based on that the tool electrically conducts with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.

Abstract: An improved drill bit for high speed, small diameter drilling of printed circuit boards uses flute/land ratio tapering in combination with the appropriate web thickness and point, cutting or flute angles to obtain high quality, accurately positioned holes. In one embodiment, the web thickness at the tip is 15% of the drill diameter, the flute/land ratio is 2.0, the tip angle is 130.degree., the second cutting angle is 20.degree., the third cutting angle is 30.degree., the flute angle is 32.degree., the relief groove depth is 0.001", body length is 0.256" and the distance between the body end and the flute end is 0.01". Such a bit is used in connection with an air jet cooling/cleaning system and a step feed drilling method wherein the first step is between four-six times drill diameter, the second step is between two-three times the drill diameter, and the third step and subsequent steps are between 1.5-2.5 times the drill diameter.

Abstract: A pressure foot (7) of a printed circuit board drilling apparatus is supported on a spindle (2) of the printed circuit board drilling apparatus slidably in the axial direction, and includes a pressing face (13) which presses a printed circuit board (5) at the time of drilling operation, a discharge port (11) formed in a side wall (8) so as to discharge chips produced by drilling operation, the discharge port (11) being connected to a suction device, and a compressed air supply conduit (20A) formed in a side wall so as to eject the compressed air toward a drill bit (4) of the printed circuit board drilling apparatus. A cooling fluid supply device (21) is connected to the compressed air supply conduit (20A). In place of the compressed air supply conduit (20A), a fluid supply conduit (14) for ejecting a cooling fluid toward the drill bit (4) of the printed circuit board drilling apparatus may be formed.

Abstract: The present invention relates to a printed wiring board and a method of manufacturing a printed wiring board. A first printed wiring board and a second printed wiring board, each including an insulating layer and a copper foil layer, are superposed on one another with a middle insulating layer therebetween with blind holes formed in the insulating layers of the boards to oppose one another, through-holes are formed and provided with conductive plating to electrically connect the copper foil layers with each other, and reflow pads are formed by etching in the copper foil layers to seal the blind holes. The blind holes are formed through the insulating layers and reach the copper foil layers. Plated layers are plated on the surfaces of the printed wiring boards on the sides thereof where the blind holes are formed to electrically connect the blind holes and the copper foil layers, respectively.

Abstract: A printed circuit board processing apparatus includes: a plurality of printed circuit board processing machines (A) arranged side by side, in each of which a printed circuit board (W) placed on a table (4) and a tool held by a single spindle (13) are caused to make a relative movement in the X-, Y- and Z-directions of the machine to process the printed circuit board (W); tipping devices (B) respectively mounted on the tables (4) in such a manner as to be swingable and adapted to perform the delivery of printed circuit boards (W); conveying devices (C) arranged along the beds (1) of the printed circuit board processing machines (A) and each equipped with a feeding path (C1) and a discharging path (C2) which are adapted to convey printed circuit boards (W) in an inclined posture; loading/unloading devices (D) arranged at a delivery position on the printed-circuit-board-processing-machine side of the feeding and discharging paths of the conveying devices (C) and adapted to effect the delivery of printed circuit

Abstract: A method is provided for the confirmation of the diameters of plural drills of different diameters in a PWB working machine in which the drills are interchangeably mounted to perform drilling. The method comprises storing, with respect to each of the drills, data on whether or not the drill has already been used, checking the data of one of the drills upon drill replacement, and measuring the diameter of the drill only where the drill has not previously been used.

Abstract: A tool holding device for use in a printed circuit board processing machine is provided with a record which is capable of storing data concerning the states of tools held on the tool holding device and data concerning processing conditions and which enables reading and updating of the recorded content through a communication with an external control device. Necessity for renewal of data registered in the NC device, which has to be executed in the known apparatus each time the tool holding device is exchanged, is eliminated thereby improving the rate of operation of the printed circuit board processing machine. In addition, the present invention enables an easy automatic replacement of tools when the lives of the tools are expired.

Abstract: The present invention relates to a printed circuit board presser device in a drilling machine. The board presser device is arranged such that it includes an axially movable upper-plate presser device which is provided on the outer side of a contact surface of the board presser device with a printed circuit board so that a top end surface of the upper-plate presser device extends to the side of a table beyond the contact surface; and an urging device for pushing the upper-plate presser device against the table by a force larger than an attraction force generated from the board presser device. With such construction, an upper plate is suppressed from floating during drilling the printed circuit board, and a distance of useless transfer movement of a drill decreased, to thereby improve an efficiency of a drilling operation.

Abstract: A method of and apparatus for effecting a machining operation, e.g. drilling, on a multi-layered printed circuit board utilizing a machining apparatus having a spindle for driving a tool. The spindle is movable in the axial direction of the tool and a pressure foot for pressing the printed circuit board during the machining is mounted on the spindle for relative movement with respect thereto. The method includes the steps of determining the position of the end of a tool with respect to the end of a pressure foot in the state before the pressure foot contacts the printed circuit board, setting the amount of relative movement between the pressure foot and the tool necessary for effecting the desired machining, on the basis of the position of the end of the tool and a predetermined set value of the machining depth; and effecting the machining on the printed circuit board by controlling the feed of the tool in conformity with the amount of relative movement.

Abstract: An apparatus and method for supplying a printed circuit board to a printed circuit board drilling machine and for returning the printed circuit board after the drilling. A stocker stores a plurality of printed circuit boards in a tilted state, and a plurality of conveyor rollers provides a conveying path for the printed circuit boards. A conveyor device which includes conveyor rollers provides a conveying path connected to the first mentioned conveying path. The arrival of the printed circuit board is detected at a predetermined position, and the printed circuit board is then decelerated by braking in response to a signal from the detection. A device is provided on the printed circuit board drilling machine for delivering the printed circuit board to the printed circuit board drilling machine.