Abstract: A floor coating agent applying machine having propelling wheels attached to a machine body and an applying device for applying floor coating agent onto a floor surface by an applying member. The applying device is vertically movably mounted on the machine body between a free-lift state where the device is lowered, by a dead weight thereof, relative to the machine body to place the applying member into pressure contact with the floor surface and a lift-up state where the applying member is lifted up away from the floor surface. A control member is provided for selectably bringing the applying device into the free-lift state or the lift-up state.

Abstract: A floor coating liquid applying machine having a propelling machine body, a liquid feed device driven to reciprocate along a transverse direction of the machine body and a liquid feed pump. The feed pump includes an elastic pump tube connecting between a liquid tank and the liquid feed device, a rotary pump member operatively connected with the elastic pump tube, a feed portion disposed along a rotational direction of the rotary pump member, with the feed portion being operable in response to rotation of the rotary pump member for causing the elastic pump tube to elastically deform to squeeze out the liquid therein into the liquid feed device and a receiver portion disposed aside the feed portion for causing the elastically deformed pump tube to resile so as to introduce further liquid from the tank into the elastic pump tube.

Abstract: A process of fabricating a multi-level wiring structure starts with preparation of a semiconductor substrate covered with a lower insulating film, and comprises the steps of forming lower-level wiring strips on the lower insulating film, covering the lower-level wiring strips and exposed portions of the lower insulating film with a first intermediate insulating film, coating the entire surface with an organic glass film, removing the organic film except for pieces of the organic glass film in valleys between the lower-level wiring strips, coating the entire surface with an inorganic glass film, removing the inorganic glass film except for pieces of the inorganic glass film on the pieces of the organic glass film, covering the entire surface with a second intermediate insulating film, and forming upper-level wiring strips on the intermediate insulating film, wherein the pieces of the inorganic glass film prevent the upper-level wiring strips from corrosion due to water vapor produced from the pieces of the org