Abstract: A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Abstract: A substrate treatment method is provided, which includes a liquid film retaining step of retaining a liquid film of a treatment liquid on a major surface of a substrate, and a heater heating step of locating a heater in opposed relation to the major surface of the substrate to heat the treatment liquid film by the heater in the liquid film retaining step, wherein an output of the heater is changed from a previous output level in the heater heating step.

Abstract: A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.

Abstract: A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off the liquid remaining on the substrate, a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate, and a temperature decrease suppressing step of supplying, in parallel to the hydrogen peroxide water supplying step, pure water having high temperature to a lower surface of the substrate.

Abstract: A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.

Abstract: A substrate treatment method is provided, which includes a liquid film retaining step of retaining a liquid film of a treatment liquid on a major surface of a substrate, and a heater heating step of locating a heater in opposed relation to the major surface of the substrate to heat the treatment liquid film by the heater in the liquid film retaining step, wherein an output of the heater is changed from a previous output level in the heater heating step.

Abstract: A substrate treatment method is provided which includes: a treatment liquid supplying step of supplying a treatment liquid to a major surface of a substrate; a substrate rotating step of rotating the substrate while retaining a liquid film of the treatment liquid on the major surface of the substrate; a heater heating step of locating a heater in opposed relation to the major surface of the substrate to heat the treatment liquid film by the heater in the substrate rotating step; and a heat amount controlling step of controlling the amount of heat to be applied per unit time to a predetermined portion of the liquid film from the heater according to the rotation speed of the substrate in the heater heating step.

Abstract: A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off the liquid remaining on the substrate, a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate, and a temperature decrease suppressing step of supplying, in parallel to the hydrogen peroxide water supplying step, pure water having high temperature to a lower surface of the substrate.

Abstract: A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.

Abstract: A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Abstract: A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Abstract: A design/evaluation support tool 100 is constructed from a table link use unit 110 identifying linkages between a threat-to-component correspondence table 125, a risk-value table 126, a component contribution rate table 127, and a risk-to-assurance level correspondence table 128, based on their respective duplicate items; and a component assurance level deriving unit 111 deriving an assurance level of each of components that conforms to a risk value of a threat that a security function of each of the components counters by weighting the risk value of the threat by a component rate of contribution based on linkages of the tables.

Abstract: In order to provide an information security policy evaluation system in which information security policies can be efficiently and appropriately defined and operated in an organization, such as a corporation, treated threats operated on a second site are transmitted from a second information processing apparatus on the second site to a first information processing apparatus on a first site, threat information is transmitted from a third site collecting information on threats to the first information processing apparatus on the first site. The first information processing apparatus extracts treated threats which have been effective for threats having occurred actually, and untreated threats, out of the received treated threat and generates an evaluation report in which these are described. Moreover, a compensation amount of insurance against threats is changed based on the generated evaluation report.

Abstract: A design/evaluation support tool 100 is constructed from a table link use unit 110 identifying linkages between a threat-to-component correspondence table 125, a risk-value table 126, a component contribution rate table 127, and a risk-to-assurance level correspondence table 128, based on their respective duplicate items; and a component assurance level deriving unit 111 deriving an assurance level of each of components that conforms to a risk value of a threat that a security function of each of the components counters by weighting the risk value of the threat by a component rate of contribution based on linkages of the tables.

Abstract: A security system design supporting tool and method are disclosed, in which security requirements (PP) and security specifications (ST) used for designing a product or a system (TOE) based on CC requirements can be prepared efficiently and uniformly even by ordinary designers other than specialists. In a security system design supporting method, registered PPs and past PP/ST generation cases are so structured as to reuse and/or reference as templates, a draft is automatically generated, and the draft thus generated is additionally modified or corrected by partial automatic generation utilizing a database of past generation cases and partial case accumulated in the generation process thereof.

Abstract: A security support and evaluation system in accordance with the present invention accepts from an operator via an input unit 16, a first specification of a system to be evaluated and a second specification of each of the components constituting the system, and then retrieves data from a security countermeasure database 131 stored in an external storage unit 13 and reads out security countermeasures to be executed to each of the components of the specified system to be evaluated, and then displays on a display unit 17, the security countermeasures read out in correspondence with each of the components of the specified system to be evaluated, and then accepts from the operator via the input unit 16, information whether or not each of the security countermeasures is executed, and thereafter evaluates the state of security based on the information and displays evaluation results on the display unit 17.

Abstract: In order to provide an information security policy evaluation system in which information security policies can be efficiently and appropriately defined and operated in an organization, such as a corporation, treated threats operated on a second site 102 are transmitted from a second information processing apparatus 112 on the second site 102 to a first information processing apparatus 111 on a first site 101, threat information is transmitted from a third site 103 collecting information on threats to the first information processing apparatus 111 on the first site 101. The first information processing apparatus 111 extracts treated threats which have been effective for threats having occurred actually, and untreated threats, out of the received treated threat and generates an evaluation report in which these are described. Moreover, a compensation amount of insurance against threats is changed based on the generated evaluation report.

Abstract: A security specification creation support device has a security specification example database in which existing security specifications are registered as examples. A definition information acceptance unit accepts the definition information of respective components constituting the information network system from the user. A security specification selection unit looks up reusable examples from the security specification example database using definition information of the component in question accepted by the definition information acceptance unit in respect of the respective components. A security specification draft creation unit creates a composite security specification draft in respect of an information network system by entering the details of respective examples found by the security specification selection unit in a prescribed form of security specification and accepts revisions of the draft in question from the user.

Abstract: When a sender sends a transmission message to a receiver by use of a communication appliance such as telephone, portable telephone, facsimile or electronic mail, the transmission massage is temporarily received by a computer-telephony integration (CTI) server. The CTI server makes reference to a user contact table to thereby specify a contact point of the receiver at present and the kind of a communication appliance capable of being used by the receiver which are registered in advance in the user contact table. Then, the CTI server sends the transmission message to the receiver after automatic media conversion in accordance with the communication appliance and reception condition which are allowed for the receiver to use. A reception condition requested by the sender may be reflected in a part of the reception condition of the receiver.

Abstract: A mark management server for certifying digital data based on a digital mark to enable realization of identity authentication and data certification when the digital data is transmitted or received on a network.