Patents by Inventor Yasuhiko Ohyama

Yasuhiko Ohyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6866739
    Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: March 15, 2005
    Assignees: Kyocera Corporation, Sekisui Chemical Corporation
    Inventors: Akihiko Nishimoto, Katsura Hayashi, Yasuhiko Ohyama, Shigeru Danjo, Kazuhiro Shimomura
  • Publication number: 20030034125
    Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.
    Type: Application
    Filed: June 26, 2002
    Publication date: February 20, 2003
    Applicant: KYOCERA CORPORATION
    Inventors: Akihiko Nishimoto, Katsura Hayashi, Yasuhiko Ohyama, Shigeru Danjo, Kazuhiro Shimomura
  • Patent number: 6451441
    Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: September 17, 2002
    Assignees: Kyocera Corporation, Sekisui Chemical Corporation
    Inventors: Akihiko Nishimoto, Katsura Hayashi, Yasuhiko Ohyama, Shigeru Danjo, Kazuhiro Shimomura
  • Patent number: 5232787
    Abstract: Disclosed herein is a pressure sensitive adhesive tape or sheet comprising a base layer (substrate) formed of a polyolefin resin and a pressure sensitive adhesive layer laminated on one side of the base layer, optionally, through an intermediate layer. The pressure sensitive adhesive tape or sheet is characterized in that the back surface of the base layer has been applied with shearing force so as to subject it to a surface treatment and is improved in unwinding ability, namely, is capable of rerolling with small force when it is wound into a roll.
    Type: Grant
    Filed: September 8, 1992
    Date of Patent: August 3, 1993
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Masahiko Gotoh, Shigehisa Kobayashi, Yasuhiko Ohyama