Patents by Inventor Yasuhiro Asano

Yasuhiro Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12138025
    Abstract: A blood pressure measurement device that measures blood pressure, and relates to a cuff unit.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: November 12, 2024
    Assignee: OMRON HEALTHCARE CO., LTD.
    Inventors: Tatsuya Kobayashi, Yohei Asano, Yasuhiro Kawabata, Hideyuki Yamashita, Akito Ito
  • Patent number: 12084436
    Abstract: The present invention provides a heterocyclic compound having a HDAC inhibitory action, which is useful for the treatment of central nervous system diseases including neurodegenerative diseases, and the like, and a medicament comprising the compound. The present invention relates to a compound represented by the formula (I): wherein each symbol is as described in the description, or a salt thereof.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: September 10, 2024
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Masahiro Ito, Takeshi Yamamoto, Keiko Kakegawa, Hideyuki Sugiyama, Tohru Miyazaki, Yasuyoshi Arikawa, Tomohiro Okawa, Jinichi Yonemori, Osamu Kubo, Akinori Toita, Takuto Kojima, Fumiaki Kikuchi, Minoru Sasaki, Misaki Homma, Yasuhiro Imaeda, Hironobu Maezaki, Shiinobu Sasaki, Ayumu Sato, Hirotaka Kamitani, Yasutomi Asano, Hironori Kokubo, Masato Yoshikawa
  • Patent number: 10260921
    Abstract: A connection terminal is on a flange of a thermal flow meter. A terminal connection part has a first and a second bent part. The first bent part is bent from a first direction to a second direction. The second bent part has is bent from the first bent part to a third direction. The first and second bent parts are formed such that when connection pin parts of a plurality of the connection terminals and terminal connection parts of the plurality of connection terminals are projected onto a first imaginary plane, an imaginary line L extending along a first direction passing through the projection areas of each of the terminal connection parts of the plurality of connection terminals passes between the projection areas of the connection pin parts from among the connection pin parts of the plurality of connection terminals, that are positioned on both sides.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: April 16, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Jiro Taniguchi, Keiichi Nakada, Yasuhiro Asano, Hiroshi Hirayama, Kazunori Suzuki
  • Publication number: 20170276526
    Abstract: A connection terminal is on a flange of a thermal flow meter. A terminal connection part has a first and a second bent part. The first bent part is bent from a first direction to a second direction. The second bent part has is bent from the first bent part to a third direction. The first and second bent parts are formed such that when connection pin parts of a plurality of the connection terminals and terminal connection parts of the plurality of connection terminals are projected onto a first imaginary plane, an imaginary line L extending along a first direction passing through the projection areas of each of the terminal connection parts of the plurality of connection terminals passes between the projection areas of the connection pin parts from among the connection pin parts of the plurality of connection terminals, that are positioned on both sides.
    Type: Application
    Filed: July 24, 2015
    Publication date: September 28, 2017
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Jiro TANIGUCHI, Keiichi NAKADA, Yasuhiro ASANO, Hiroshi HIRAYAMA, Kazunori SUZUKI
  • Patent number: 8523120
    Abstract: A component support device (7) that attaches components (61, 62) on a working structure (41) of a construction machine is formed by bending a plate along at least two bending lines, the component support device (7) including a support (711) formed at a center portion between the two bending lines for supporting the components (61, 62), and a pair of attachment legs (712, 713) formed at both sides of the support (711) to be fixed on the working structure (41), in which at least one of the pair of attachment legs (712, 713) is split into a plurality of portions at a portion to be fixed on the working structure (41), and rigidity of the attachment leg (712, 713) against a bending line direction is less than rigidity of the support (711) in the bending line direction.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: September 3, 2013
    Assignee: Komatsu Ltd.
    Inventors: Yasuhiro Asano, Naohisa Iwasawa, Yuji Terasaka
  • Patent number: 7752908
    Abstract: In a flow sensor, detecting elements are provided at a sub-passage. A sub-passage wall contains a hole to drain accumulated liquid. A protrusion arranged close to the hole on an external surface generates dynamic pressure on the opening in response to external flow. Alternatively, a protrusion upstream from the hole on the inner wall surface produces a separation flow area for separating the flow from the internal surface near the hole, whereby pressure in the separation area is reduced and almost the same pressure differences on the internal and external surfaces openings result. This reduces leakage from the hole and changes in the distribution flow in the sub-passage between cases where the hole is blocked and not blocked, thus minimizing flow measurement errors. Structure may be provided close to the external surface hole opening to prevent a liquid film or drop from being formed on the opening by surface tension.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: July 13, 2010
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Shinya Igarashi, Hiroshi Kikawa, Yasuhiro Asano, Naoki Saito
  • Publication number: 20090133489
    Abstract: In a flow sensor, detecting elements are provided at a sub-passage. A sub-passage wall contains a hole to drain accumulated liquid. A protrusion arranged close to the hole on an external surface generates dynamic pressure on the opening in response to external flow. Alternatively, a protrusion upstream from the hole on the inner wall surface produces a separation flow area for separating the flow from the internal surface near the hole, whereby pressure in the separation area is reduced and almost the same pressure differences on the internal and external surfaces openings result. This reduces leakage from the hole and changes in the distribution flow in the sub-passage between cases where the hole is blocked and not blocked, thus minimizing flow measurement errors. Structure may be provided close to the external surface hole opening to prevent a liquid film or drop from being formed on the opening by surface tension.
    Type: Application
    Filed: December 22, 2008
    Publication date: May 28, 2009
    Applicants: HITACHI, LTD., HITACHI CAR ENGINEERING CO., LTD.
    Inventors: Shinya IGARASHI, Hiroshi KIKAWA, Yasuhiro ASANO, Naoki SAITO
  • Publication number: 20090064968
    Abstract: It is an object of the present invention to expand an air flow measuring range of a thermal type air flow measuring instrument. A squeeze 157 is provided upstream of a thermal type air flow measuring instrument 100 of a main air passage 155 to expand an air flow measuring range on the low flow rate side. Furthermore, a slit 158 is provided to introduce air from the outside of the main air passage 155 to a position downstream of the squeeze 157 where flow exfoliation occurs without passing thorough a main air passage inlet 156 to prevent a pressure drop from increasing at a high flow rate and expand the air flow measuring range on the high flow rate side.
    Type: Application
    Filed: August 12, 2008
    Publication date: March 12, 2009
    Inventors: Taiji Shoyama, Yasuhiro Asano, Hiromu Kikawa, Chihiro Kobayashi
  • Patent number: 7467546
    Abstract: In a flow sensor, detecting elements are provided at a sub-passage. A sub-passage wall contains a hole to drain accumulated liquid. A protrusion arranged close to the hole on an external surface generates dynamic pressure on the opening in response to external flow. Alternatively, a protrusion upstream from the hole on the inner wall surface produces a separation flow area for separating the flow from the internal surface near the hole, whereby pressure in the separation area is reduced and almost the same pressure differences on the internal and external surfaces openings result. This reduces leakage from the hole and changes in the distribution flow in the sub-passage between cases where the hole is blocked and not blocked, thus minimizing flow measurement errors. Structure may be provided close to the external surface hole opening to prevent a liquid film or drop from being formed on the opening by surface tension.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: December 23, 2008
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Shinya Igarashi, Hiroshi Kikawa, Yasuhiro Asano, Naoki Saito
  • Publication number: 20060156808
    Abstract: In a flow sensor, detecting elements are provided at a sub-passage. A sub-passage wall contains a hole to drain accumulated liquid. A protrusion arranged close to the hole on an external surface generates dynamic pressure on the opening in response to external flow. Alternatively, a protrusion upstream from the hole on the inner wall surface produces a separation flow area for separating the flow from the internal surface near the hole, whereby pressure in the separation area is reduced and almost the same pressure differences on the internal and external surfaces openings result. This reduces leakage from the hole and changes in the distribution flow in the sub-passage between cases where the hole is blocked and not blocked, thus minimizing flow measurement errors. Structure may be provided close to the external surface hole opening to prevent a liquid film or drop from being formed on the opening by surface tension.
    Type: Application
    Filed: January 23, 2006
    Publication date: July 20, 2006
    Applicant: HITACHI, LTD.
    Inventors: Sinya Igarashi, Hiroshi Kikawa, Yasuhiro Asano, Naoki Saito
  • Publication number: 20060066610
    Abstract: Grid space designation information and grid plane designation information are acquired. The grid space designation information includes a width of the three-dimensional grid and a distance between two points of the three-dimensional grids. The grid plane designation information includes a display width of the three-dimensional grid and a display position at which the three-dimensional grid is to be displayed. Only that portion of the three-dimensional grids that is defined by the grid space designation information and the grid plane designation information is displayed.
    Type: Application
    Filed: January 18, 2005
    Publication date: March 30, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Yasuhiro Asano, Terutoshi Taguchi
  • Publication number: 20060043243
    Abstract: A component support device (7) that attaches components (61, 62) on a working structure (41) of a construction machine is formed by bending a plate along at least two bending lines, the component support device (7) including a support (711) formed at a center portion between the two bending lines for supporting the components (61, 62), and a pair of attachment legs (712, 713) formed at both sides of the support (711) to be fixed on the working structure (41), in which at least one of the pair of attachment legs (712, 713) is split into a plurality of portions at a portion to be fixed on the working structure (41), and rigidity of the attachment leg (712, 713) against a bending line direction is less than rigidity of the support (711) in the bending line direction.
    Type: Application
    Filed: June 13, 2005
    Publication date: March 2, 2006
    Applicant: KOMATSU LTD.
    Inventors: Yasuhiro Asano, Naohisa Iwasawa, Yuji Terasaka
  • Patent number: 7004022
    Abstract: The flow detecting elements are provided at the sub-passage for making the part of fluid to be measured (gas) flow. The wall of the sub-passage contains a leak hole (through hole) to drain a liquid having entered and accumulated inside the sub-passage. A protrusion for generating a dynamic pressure on the opening is arranged close to the opening of the leak hole on the external surface of the sub-passage. Alternatively, a protrusion located upstream from the leak hole is formed on the inner wall surface of the sub-passage. The former protrusion generates a dynamic pressure in response to the flow velocity of the gas flowing along the external surface of the sub-passage. The latter protrusion produces a separation flow area for separating the flow from the internal surface of the sub-passage (close to the leak hole), whereby the pressure of the separation floe area is reduced.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: February 28, 2006
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Sinya Igarashi, Hiroshi Kikawa, Yasuhiro Asano, Naoki Saito
  • Patent number: 6940140
    Abstract: A package structure of a solid-state image sensor having a solid-state image sensor chip and a color filter stuck on a light receiving surface of the chip. The package structure includes a vessel for packaging the solid-state image sensor chip. An optically transparent protection plate is attached to the vessel to cover the light receiving surface of the chip. A resin layer is arranged between the chip and the protection plate to absorb light having a predetermined wavelength.
    Type: Grant
    Filed: October 17, 2000
    Date of Patent: September 6, 2005
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Kenji Ikeda, Kazuhiko Takeno, Yasuhiro Asano
  • Publication number: 20040182171
    Abstract: The flow detecting elements are provided at the sub-passage for making the part of fluid to be measured (gas) flow. The wall of the sub-passage contains a leak hole (through hole) to drain a liquid having entered and accumulated inside the sub-passage. A protrusion for generating a dynamic pressure on the opening is arranged close to the opening of the leak hole on the external surface of the sub-passage. Alternatively, a protrusion located upstream from the leak hole is formed on the inner wall surface of the sub-passage. The former protrusion generates a dynamic pressure in response to the flow velocity of the gas flowing along the external surface of the sub-passage. The latter protrusion produces a separation flow area for separating the flow from the internal surface of the sub-passage (close to the leak hole), whereby the pressure of the separation floe area is reduced.
    Type: Application
    Filed: January 16, 2004
    Publication date: September 23, 2004
    Inventors: Sinya Igarashi, Hiroshi Kikawa, Yasuhiro Asano, Naoki Saito
  • Patent number: 5885369
    Abstract: According to the present invention, the oxidation of the surface of solder particles is inhibited and the generation of solder balls in the reflow soldering process is inhibited. More specifically, the present invention protects the surface of the solder particles from oxidation during all steps, including the storage of a solder powder, formation of a paste from the solder powder, printing, transferring to a reflow oven and reflow soldering, to minimize the oxidation of the solder particles at these steps so that the generation of solder balls is minimized. In addition, the present invention provides a method for making the solder powder and a solder paste using the solder powder. The objective of the present invention is achieved by the solder powder, the particles of which have on the surface thereof an organometallic compound composed of adipic acid and a metal of the solder alloy. This solder powder is produced by reacting particles of the solder alloy powder with vaporized adipic acid.
    Type: Grant
    Filed: August 15, 1997
    Date of Patent: March 23, 1999
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Kenzo Hanawa, Takayuki Araki, Yoshinobu Okamura, Yasuhiro Asano
  • Patent number: 5747177
    Abstract: The collected lumber of the present invention is formed by heating and softening a plurality of woods, applying adhesive on the woods, pressing and compressing the wood with adhesive thereon to mold the integral body in a prescribed shape, and by fixation treating the integral body using a heating device. The method for manufacturing collected lumber of this invention comprises the first process for softening woods by heat treating a plurality of woods, the second process for applying adhesive on the softened woods, the third process for forming integral body by pressing and compressing the woods applied with the adhesive to mold in a prescribed shape, and the fourth process for fixation treating the integral body using a heating device.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: May 5, 1998
    Assignee: Ibiden Co., Ltd.
    Inventors: Tadashi Torimoto, Yasuhiro Asano, Tsunehiro Kohara, Tetsuya Nishimura
  • Patent number: 5417312
    Abstract: A semiconductor acceleration sensor is formed by a cantilever having a conductive movable electrode of predetermined mass at one end, at least one pair of fixed conductive electrodes which are stationary with respect to the movable electrode located on opposing sides of the movable electrode, and gaps provided between the movable electrode and the fixed electrodes. To prevent the movable electrode becoming fused to the contacted fixed electrode, in a first aspect of this invention, an insulating layer is provided between the movable electrode and fixed electrodes, the layer being either on the movable electrode or on the fixed electrodes and in a second aspect the movable electrode or, preferably, the fixed electrodes, are formed of a high melting point material. In such a second aspect, to improve adhesion between the high melting point material and a substrate to which the fixed electrodes are mounted, a lower melting point material is firstly coated on the substrates.
    Type: Grant
    Filed: November 3, 1993
    Date of Patent: May 23, 1995
    Assignees: Hitachi, Ltd., Hitachi Automotive Engineering Co., Inc.
    Inventors: Shigeki Tsuchitani, Seiko Suzuki, Tomoyuki Tanaka, Masayuki Miki, Masahiro Matsumoto, Norio Ichikawa, Hiromichi Ebine, Yukiko Sugisawa, Kanemasa Sato, Sadayasu Ueno, Yasuhiro Asano, Masanori Kubota, Masayoshi Suzuki