Patents by Inventor Yasuhiro CHIDA

Yasuhiro CHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heater for bonding apparatus and method of cooling the same
    Patent number: 10350692
    Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: July 16, 2019
    Assignee: SHINKAWA LTD.
    Inventors: Kohei Seyama, Yasuhiro Chida, Osamu Kakutani
  • PACKAGE SEALING STRUCTURE, DEVICE PACKAGE, AND PACKAGE SEALING METHOD
    Publication number: 20190098786
    Abstract: A package sealing structure is provided wherein a narrow neck of a through-hole formed in a package member is closed with substance that has been produced from melting of an outer side of the package member and then has solidified, and the narrow neck is narrower than an opening of the thorough-hole that has been enlarged by the melting.
    Type: Application
    Filed: August 21, 2018
    Publication date: March 28, 2019
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Yasuhiro CHIDA
  • HEATER FOR BONDING APPARATUS AND METHOD OF COOLING THE SAME
    Publication number: 20150183040
    Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.
    Type: Application
    Filed: January 15, 2015
    Publication date: July 2, 2015
    Applicant: SHINKAWA LTD.
    Inventors: Kohei SEYAMA, Yasuhiro CHIDA, Osamu KAKUTANI