Abstract: Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Abstract: Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Abstract: The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only N?n of the first processing units simultaneously at respective supply rates each in accordance with a demand for appropriately performing the first process in each of the first processing units, where n is a natural number and N?n is not less than 2. A controller that controls a timing of loading of the substrate into the ozone process units by the conveyer so as to avoid a case where more than N?n of the first processing units are simultaneously carrying out the first treatment each using the first processing fluid, where n is a natural number and N?n is not less than 2.

Abstract: A process system produces a process liquid of a predetermined concentration in a blending tank by blending solutions respectively supplied from a plurality of solution supply sources, supplies the process liquid to a supply tank to store therein the process liquid, and supplies the process liquid from the supply tank to a process liquid discharge port. In this process system, whether a concentration of the process liquid in the supply tank has changed or not is judged. When it is judged that the concentration of the process liquid in the supply tank has changed, the process liquid is additionally supplied from the blending tank to the supply tank, or the solution is directly supplied from the solution supply source to the supply tank, so as to maintain the concentration of the process liquid.

Abstract: A steam generator 40? provided in a substrate processing apparatus includes a tank 301 having a hollow cylindrical member 302 formed of a composite of PTFE and PFA and a pair of side wall plates 303 connected to the opposite ends of the cylindrical member 302. The tank 301 is surrounded by a shell 305 of an aluminum alloy to prevent deformation of the tank due to internal pressure of the tank. A heater 308 is attached to the outer surfaces of the plate members 307 of the shell 305. The shell 305 restrains the tank 301 and compresses elastic sealing members 305 to sealingly engage the cylindrical member 302 and the side wall plate 303 with each other.

Abstract: A common solvent vapor supply source 41 and a common processing gas supply source 42 supply ozone gas and steam to a plurality of processing vessels 30A, 30B. Pressures in the processing vessels are regulated by adjusting the openings of the valuable throttle valves 50A, 50B, which are placed in exhaust lines 80A, 80B, respectively.

Abstract: A steam generator 40? provided in a substrate processing apparatus includes a tank 301 having a hollow cylindrical member 302 formed of a composite of PTFE and PFA and a pair of side wall plates 303 connected to the opposite ends of the cylindrical member 302. The tank 301 is surrounded by a shell 305 of an aluminum alloy to prevent deformation of the tank due to internal pressure of the tank. A heater 308 is attached to the outer surfaces of the plate members 307 of the shell 305. The shell 305 restrains the tank 301 and compresses elastic sealing members 305 to sealingly engage the cylindrical member 302 and the side wall plate 303 with each other.

Abstract: A substrate processing vessel has a vessel body 100 and a cover 130 hermetically joined to the vessel body 100. The vessel body 100 is provided with a plurality of substrate support rods 102. Each of the support rods 102 has a shank 103 and a head 104 having a diameter greater than that of the shank 103 and attached to the upper end of the shank 103. The shanks 103 penetrate the vessel body 100 and project downward from the vessel body 100. When each substrate support rod 102 is lowered to its lower position, the head 104 is seated hermetically on a part, around the open upper end of a through hole 108 through which the shank 103 is inserted, of the vessel body 100. When each substrate support rod 102 is raised to its upper position, a space of a big thickness capable of receiving a wafer carrying arm 14a is formed between the upper surface of the vessel body 100 and a wafer W supported on the substrate support rods 102.

Abstract: The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only N−n of the first processing units simultaneously at respective supply rates each in accordance with a demand for appropriately performing the first process in each of the first processing units, where n is a natural number and N−n is not less than 2. A controller that controls a timing of loading of the substrate into the ozone process units by the conveyer so as to avoid a case where more than N−n of the first processing units are simultaneously carrying out the first treatment each using the first processing fluid, where n is a natural number and N−n is not less than 2.

Abstract: A common solvent vapor supply source 41 and a common processing gas supply source 42 supply ozone gas and steam to a plurality of processing vessels 30A, 30B. Pressures in the processing vessels are regulated by adjusting the openings of the valuable throttle valves 50A, 50B, which are placed in exhaust lines 80A, 80B, respectively.

Abstract: In a pneumatically driven liquid supply apparatus comprising a circulation pump 26 or constant-volume pump 34 for supplying a washing liquid or chemical to a washing tank 20 for semiconductor wafers used during the fabrication of semiconductor devices; an electromagnetic switching valve 51 and a pressure regulator 52 that configure an air-pressure adjustment means 50 are connected to an air source 60; and air supply pipelines 41a, 41b, 41d, and 41e are each connected to the air-pressure adjustment means 50, the circulation pump 26 and the constant-volume pump 34. A leakage sensor 70 is interposed within each of the air supply pipelines 41a, 41b, 41d, and 41e between the air-pressure adjustment means 50 and the circulation pump 26 or constant-volume pump 34, so that any liquid that flows backward through the circulation pump 26 or the constant-volume pump 34 and into the air supply pipeline 41a, 41b, 41d, or 41e is detected by the leakage sensor 70.

Abstract: A substrates-washing apparatus includes a process vessel in which washing solution is stored to wash a plurality of substrates, a boat for holding the substrates parallel to one another in the process vessel, solution supply openings formed in the bottom of the process vessel, a solution supply system communicated with the solution supply openings to supply washing solution into the process vessel through the solution supply openings, and a straightening plate arranged between the substrates held on the boat and the solution supply openings in the bottom of the process vessel and provided with a plurality of apertures through which washing solution passes. The apertures form plural lines in the longitudinal direction of the straightening plate, the apertures in each line are arranged to correspond to the substrates alternately, and the apertures in one line are shifted from those in the other adjacent line.