Patents by Inventor Yasuhiro Hida
Yasuhiro Hida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9060429Abstract: Provided is a circuit board in which visibility of an alignment mark is improved. In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.Type: GrantFiled: November 2, 2010Date of Patent: June 16, 2015Assignee: Sharp Kabushiki KaishaInventors: Gen Nagaoka, Yasuhiro Hida, Hiroki Miyazaki
-
Patent number: 9007777Abstract: Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.Type: GrantFiled: May 12, 2010Date of Patent: April 14, 2015Assignee: Sharp Kabushiki KaishaInventors: Gen Nagaoka, Yasuhiro Hida, Hiroki Miyazaki
-
Patent number: 8563983Abstract: The invention provides a display panel and display device enabling easy connection to an external connection component depending on the type of a mounted component, and provides a display device manufacturing method allowing a simple manufacturing process. The display panel of the present invention is a display panel in which a thin film transistor array substrate and an opposed substrate are disposed opposing each other. The thin film transistor array substrate has a first routing wiring that is routed at the outer edge of the substrate, a common transfer section that is formed at a position overlapping with the first routing wiring when the substrate surface is viewed from a normal direction, and a first terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the first routing wiring, at an end portion of the substrate.Type: GrantFiled: April 6, 2010Date of Patent: October 22, 2013Assignee: Sharp Kabushiki KaishaInventors: Yasuhiro Hida, Gen Nagaoka
-
Patent number: 8554040Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.Type: GrantFiled: July 25, 2012Date of Patent: October 8, 2013Assignee: Nippon Telegraph and Telephone CorporationInventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
-
Patent number: 8538222Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.Type: GrantFiled: July 25, 2012Date of Patent: September 17, 2013Assignee: Nippon Telegraph and Telephone CorporationInventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
-
Patent number: 8463097Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.Type: GrantFiled: July 12, 2010Date of Patent: June 11, 2013Assignee: Nippon Telegraph and Telephone CorporationInventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
-
Patent number: 8450753Abstract: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.Type: GrantFiled: June 2, 2009Date of Patent: May 28, 2013Assignee: Sharp Kabushiki KaishaInventors: Motoji Shiota, Gen Nagaoka, Ichiro Umekawa, Yasuhiro Hida, Yukio Shimizu
-
Publication number: 20120319980Abstract: Provided is a circuit board in which visibility of an alignment mark is improved. In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.Type: ApplicationFiled: November 2, 2010Publication date: December 20, 2012Applicant: SHARP KABUSHIKI KAISHAInventors: Gen Nagaoka, Yasuhiro Hida, Hiroki Miyazaki
-
Publication number: 20120320290Abstract: A display device that can easily attach a connection member to a display panel is provided. This liquid crystal display device (1) includes: a liquid crystal display panel (2) that includes a TFT substrate (10) and a CF substrate (20); a FPC (30) that is electrically connected to the TFT substrate; and a FPC (40) that is electrically connected to the CF substrate. An alignment mark (13) is provided in the TFT substrate. An alignment mark (41) corresponding to the alignment mark (13) is provided in the FPC (40).Type: ApplicationFiled: October 27, 2010Publication date: December 20, 2012Applicant: Sharp Kabushiki KaishaInventors: Yasuhiro Hida, Gen Nagaoka, Hiroki Miyazaki
-
Publication number: 20120311516Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.Type: ApplicationFiled: July 25, 2012Publication date: December 6, 2012Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
-
Publication number: 20120304143Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.Type: ApplicationFiled: July 25, 2012Publication date: November 29, 2012Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
-
Publication number: 20120188733Abstract: To provide a substrate mounting structure with which reliability can be improved. This substrate mounting structure includes an ACF (2) disposed on a surface (1a) of a glass substrate (1) and SMDs (3) mounted on the surface (1a) of the glass substrate (1) via the ACF (2) and disposed in an SMD mounting region (10a) on the surface (1a) of the glass substrate (1). Then, dummy components (4) are respectively disposed in a region adjacent to one side of the SMD mounting region (10a) and in a region adjacent to the other side thereof.Type: ApplicationFiled: May 14, 2010Publication date: July 26, 2012Applicant: SHARP KABUSHIKI KAISHAInventors: Hiroki Miyazaki, Gen Nagaoka, Yasuhiro Hida
-
Publication number: 20120182697Abstract: Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.Type: ApplicationFiled: May 12, 2010Publication date: July 19, 2012Applicant: SHARP KABUSHIKI KAISHAInventors: Gen Nagaoka, Yasuhiro Hida, Hiroki Miyazaki
-
Publication number: 20120146022Abstract: The invention provides a display panel and display device enabling easy connection to an external connection component depending on the type of a mounted component, and provides a display device manufacturing method allowing a simple manufacturing process. The display panel of the present invention is a display panel in which a thin film transistor array substrate and an opposed substrate are disposed opposing each other. The thin film transistor array substrate has a first routing wiring that is routed at the outer edge of the substrate, a common transfer section that is formed at a position overlapping with the first routing wiring when the substrate surface is viewed from a normal direction, and a first terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the first routing wiring, at an end portion of the substrate.Type: ApplicationFiled: April 6, 2010Publication date: June 14, 2012Applicant: SHARP KABUSHIKI KAISHAInventors: Yasuhiro Hida, Gen Nagaoka
-
Publication number: 20110169791Abstract: In a liquid crystal display device (10), stabilizing capacitors (61), bypass capacitors (62) and boosting capacitors (63), which would conventionally be mounted on an FPC board (50), are disposed along long and short input sides of an LSI chip (40) mounted on a projection (20a) of a glass substrate (20) and the capacitors are connected to their respective input terminals of the LSI chip (40) via capacitor traces (71). This makes it possible to narrow the FPC board (50) connected to the liquid crystal display device (10), thereby achieving size reduction of the liquid crystal display device (10) while achieving reduction in manufacturing cost, including processing and material cost of the FPC board (50).Type: ApplicationFiled: June 19, 2009Publication date: July 14, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Yasuhiro Hida, Gen Nagaoka, Ichiro Umekawa, Motoji Shiota, Yukio Shimizu
-
Publication number: 20110169022Abstract: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.Type: ApplicationFiled: June 2, 2009Publication date: July 14, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Motoji Shiota, Gen Nagaoka, Ichiro Umekawa, Yasuhiro Hida, Yukio Shimizu
-
Publication number: 20110169792Abstract: The present invention provides a display panel in which, without providing connection terminals, the number of which corresponds to the number of test terminals of a liquid crystal panel, on a circuit board such as an FPC board, miniaturization is obtained while reducing costs such as the mounting cost and material cost of the circuit board, and stable operation is performed. A liquid crystal panel (10) has a configuration in which jumper resistors (60a) to (60f) are provided in an overhanging portion (20a) of a glass substrate (20) to ground test terminals, which eliminates the need to ground the test terminals on an FPC board (50). Thus, wiring lines and connection terminals which are connected to the test terminals, respectively, and the numbers of which are equal to the number of the test terminals do not need to be provided on the FPC board (50), reducing the width of the FPC board (50).Type: ApplicationFiled: June 15, 2009Publication date: July 14, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Yukio Shimizu, Gen Nagaoka, Ichiro Umekawa, Motoji Shiota, Yasuhiro Hida
-
Patent number: 7856163Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.Type: GrantFiled: August 1, 2005Date of Patent: December 21, 2010Assignee: Nippon Telegraph and Telephone CorporationInventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
-
Publication number: 20100274541Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.Type: ApplicationFiled: July 12, 2010Publication date: October 28, 2010Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
-
Patent number: 7499613Abstract: A Y branch circuit according to the present invention includes; a under clad; a circuit core, formed on the under clad and having a main core and two branch cores, connected to the main core, and an over clad that embeds the circuit core. The main core and the two branch cores are connected across an interval. The two branch cores have a width-to-height ratio of 50% to 150% and have a gap, at the main core end, that is narrower at the over clad side than at the under clad side.Type: GrantFiled: June 5, 2006Date of Patent: March 3, 2009Assignee: NTT Electronics CorporationInventors: Yasuhiro Hida, Toshimi Kominato, Yasuyuki Inoue, Norio Takato, Yasumori Ohmura