Patents by Inventor Yasuhiro Hida

Yasuhiro Hida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9060429
    Abstract: Provided is a circuit board in which visibility of an alignment mark is improved. In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: June 16, 2015
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Gen Nagaoka, Yasuhiro Hida, Hiroki Miyazaki
  • Patent number: 9007777
    Abstract: Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: April 14, 2015
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Gen Nagaoka, Yasuhiro Hida, Hiroki Miyazaki
  • Patent number: 8563983
    Abstract: The invention provides a display panel and display device enabling easy connection to an external connection component depending on the type of a mounted component, and provides a display device manufacturing method allowing a simple manufacturing process. The display panel of the present invention is a display panel in which a thin film transistor array substrate and an opposed substrate are disposed opposing each other. The thin film transistor array substrate has a first routing wiring that is routed at the outer edge of the substrate, a common transfer section that is formed at a position overlapping with the first routing wiring when the substrate surface is viewed from a normal direction, and a first terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the first routing wiring, at an end portion of the substrate.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: October 22, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yasuhiro Hida, Gen Nagaoka
  • Patent number: 8554040
    Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: October 8, 2013
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
  • Patent number: 8538222
    Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: September 17, 2013
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
  • Patent number: 8463097
    Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: June 11, 2013
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
  • Patent number: 8450753
    Abstract: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: May 28, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Motoji Shiota, Gen Nagaoka, Ichiro Umekawa, Yasuhiro Hida, Yukio Shimizu
  • Publication number: 20120319980
    Abstract: Provided is a circuit board in which visibility of an alignment mark is improved. In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.
    Type: Application
    Filed: November 2, 2010
    Publication date: December 20, 2012
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Gen Nagaoka, Yasuhiro Hida, Hiroki Miyazaki
  • Publication number: 20120320290
    Abstract: A display device that can easily attach a connection member to a display panel is provided. This liquid crystal display device (1) includes: a liquid crystal display panel (2) that includes a TFT substrate (10) and a CF substrate (20); a FPC (30) that is electrically connected to the TFT substrate; and a FPC (40) that is electrically connected to the CF substrate. An alignment mark (13) is provided in the TFT substrate. An alignment mark (41) corresponding to the alignment mark (13) is provided in the FPC (40).
    Type: Application
    Filed: October 27, 2010
    Publication date: December 20, 2012
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Yasuhiro Hida, Gen Nagaoka, Hiroki Miyazaki
  • Publication number: 20120311516
    Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.
    Type: Application
    Filed: July 25, 2012
    Publication date: December 6, 2012
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
  • Publication number: 20120304143
    Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.
    Type: Application
    Filed: July 25, 2012
    Publication date: November 29, 2012
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
  • Publication number: 20120188733
    Abstract: To provide a substrate mounting structure with which reliability can be improved. This substrate mounting structure includes an ACF (2) disposed on a surface (1a) of a glass substrate (1) and SMDs (3) mounted on the surface (1a) of the glass substrate (1) via the ACF (2) and disposed in an SMD mounting region (10a) on the surface (1a) of the glass substrate (1). Then, dummy components (4) are respectively disposed in a region adjacent to one side of the SMD mounting region (10a) and in a region adjacent to the other side thereof.
    Type: Application
    Filed: May 14, 2010
    Publication date: July 26, 2012
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Hiroki Miyazaki, Gen Nagaoka, Yasuhiro Hida
  • Publication number: 20120182697
    Abstract: Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.
    Type: Application
    Filed: May 12, 2010
    Publication date: July 19, 2012
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Gen Nagaoka, Yasuhiro Hida, Hiroki Miyazaki
  • Publication number: 20120146022
    Abstract: The invention provides a display panel and display device enabling easy connection to an external connection component depending on the type of a mounted component, and provides a display device manufacturing method allowing a simple manufacturing process. The display panel of the present invention is a display panel in which a thin film transistor array substrate and an opposed substrate are disposed opposing each other. The thin film transistor array substrate has a first routing wiring that is routed at the outer edge of the substrate, a common transfer section that is formed at a position overlapping with the first routing wiring when the substrate surface is viewed from a normal direction, and a first terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the first routing wiring, at an end portion of the substrate.
    Type: Application
    Filed: April 6, 2010
    Publication date: June 14, 2012
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Yasuhiro Hida, Gen Nagaoka
  • Publication number: 20110169791
    Abstract: In a liquid crystal display device (10), stabilizing capacitors (61), bypass capacitors (62) and boosting capacitors (63), which would conventionally be mounted on an FPC board (50), are disposed along long and short input sides of an LSI chip (40) mounted on a projection (20a) of a glass substrate (20) and the capacitors are connected to their respective input terminals of the LSI chip (40) via capacitor traces (71). This makes it possible to narrow the FPC board (50) connected to the liquid crystal display device (10), thereby achieving size reduction of the liquid crystal display device (10) while achieving reduction in manufacturing cost, including processing and material cost of the FPC board (50).
    Type: Application
    Filed: June 19, 2009
    Publication date: July 14, 2011
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Yasuhiro Hida, Gen Nagaoka, Ichiro Umekawa, Motoji Shiota, Yukio Shimizu
  • Publication number: 20110169022
    Abstract: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.
    Type: Application
    Filed: June 2, 2009
    Publication date: July 14, 2011
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Motoji Shiota, Gen Nagaoka, Ichiro Umekawa, Yasuhiro Hida, Yukio Shimizu
  • Publication number: 20110169792
    Abstract: The present invention provides a display panel in which, without providing connection terminals, the number of which corresponds to the number of test terminals of a liquid crystal panel, on a circuit board such as an FPC board, miniaturization is obtained while reducing costs such as the mounting cost and material cost of the circuit board, and stable operation is performed. A liquid crystal panel (10) has a configuration in which jumper resistors (60a) to (60f) are provided in an overhanging portion (20a) of a glass substrate (20) to ground test terminals, which eliminates the need to ground the test terminals on an FPC board (50). Thus, wiring lines and connection terminals which are connected to the test terminals, respectively, and the numbers of which are equal to the number of the test terminals do not need to be provided on the FPC board (50), reducing the width of the FPC board (50).
    Type: Application
    Filed: June 15, 2009
    Publication date: July 14, 2011
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Yukio Shimizu, Gen Nagaoka, Ichiro Umekawa, Motoji Shiota, Yasuhiro Hida
  • Patent number: 7856163
    Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: December 21, 2010
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
  • Publication number: 20100274541
    Abstract: A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (111) which inputs signal light, mode coupling part (112) for coupling a fundamental mode of the inputted signal light to a higher-order mode and/or a radiation mode, or mode re-coupling part (113) for re-coupling the higher-order mode and/or the radiation mode to the fundamental mode, and output optical waveguide(s) (114) which outputs signal light. The mode coupling part or the mode re-coupling part is an optical waveguide which has core width and/or height varied continuously.
    Type: Application
    Filed: July 12, 2010
    Publication date: October 28, 2010
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takashi Saida, Yohei Sakamaki, Toshikazu Hashimoto, Tsutomu Kitoh, Hiroshi Takahashi, Masahiro Yanagisawa, Senichi Suzuki, Yasuhiro Hida, Motohaya Ishii, Munehisa Tamura
  • Patent number: 7499613
    Abstract: A Y branch circuit according to the present invention includes; a under clad; a circuit core, formed on the under clad and having a main core and two branch cores, connected to the main core, and an over clad that embeds the circuit core. The main core and the two branch cores are connected across an interval. The two branch cores have a width-to-height ratio of 50% to 150% and have a gap, at the main core end, that is narrower at the over clad side than at the under clad side.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: March 3, 2009
    Assignee: NTT Electronics Corporation
    Inventors: Yasuhiro Hida, Toshimi Kominato, Yasuyuki Inoue, Norio Takato, Yasumori Ohmura